A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treating surface is 0.4 to 3.0 μm. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of (111) plane to the sum of the integrated intensities of diffraction peaks of (111) plane, (200) plane, and (220) plane of the treating surface is at least 60%.

There is provided a photosensitive resin composition comprising (A) a photopolymerizable compound having an ethylenically unsaturated group and an acid substituent, (B) a curing agent, (C) a photopolymerization initiator, and (D) a photopolymerizable compound, wherein the photopolymerizable compound (D) is a polyfunctional monomer which has a skeleton (X) derived from a polyhydric alcohol and having three or more bonding groups (a), each bonded to another structure and corresponding to a hydroxy group from which the hydrogen atom has been removed, and which has three or more (meth)acryloyl groups bonded directly or indirectly to the bonding groups (a), and wherein at least one (meth)acryloyl group of the three or more (meth)acryloyl groups is bonded to the bonding group(s) (a) via a linking group. There are also provided a dry film using the photosensitive resin composition, a printed wiring board, and a method for producing the printed wiring board.

A polymer composition comprising a star-branched copolymer having a plurality of arms is disclosed. Each polymer arm has a molecular weight Mp of from 1 kg/mol to 50 kg/mol and comprises polymerized units (i) derived from a first vinyl aromatic monomer comprising a radical-reactive group, wherein from greater than 10 mol % to 100 mol % of the units (i) are unhydrogenated; and optionally, polymerized units (ii) comprising hydrogenated and unhydrogenated forms of polymerized units derived from a high Tg monomer, and hydrogenated form of polymerized units (i) or hydrogenated form of polymerized styrene units; and optionally, polymerized units (iii) comprising (a) hydrogenated form of polymerized units derived from one or more acyclic conjugated dienes, and (b) polymerized units derived from one or more of a second vinyl aromatic monomer; wherein less than 10 wt. % of units (a) are unhydrogenated.

A laminating system according to one embodiment includes: a film sticking-and-cutting device that sticks a film fed from a roll to a workpiece, and cuts the film at a position where the film is not overlapped with the workpiece; and a laminator that receives the workpiece delivered from the film sticking-and-cutting device, and presses the film stuck to the workpiece to the workpiece to join the film to the workpiece. The film sticking-and-cutting device includes a cooling unit that cools the workpiece or the film, before the film is cut. The laminating system may further includes a cooling device that cools the film by supplying air to the film on the workpiece delivered from the laminator, and a film peeling device that peels a layer from the film on the workpiece.

In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a D.sub.f of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m.sup.2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.

An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.

A manufacturing apparatus of a display device includes a first jig configured to hold a first member; a second jig located under the first jig and coupled to or separated from the first jig such that the first member is locatable between the first jig and the second jig; fixing parts located at both ends of the second jig and configured to hold a second member between the first member and the second jig, the second jig including a pad; and a stage located under the pad and provided with a groove formed therethrough and having an area smaller than an area of the pad when viewed in a plan view, wherein one portion of the pad, which faces the stage, is configured to be within the groove.

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

Compositions and methods for amorphous high temperature polyketone polymers incorporating 2H-benzimidazol-2-one with dihalobenzophenone and bis(halobenzoyl)benzene as comonomer units are described herein. The polyketones polymers have advantageous properties, particularly in terms of high glass transition temperatures (T.sub.g), inherently flame resistance, good mechanical properties at elevated temperature, chemical resistance and dimensional stability in wet environment. The polymers are suitable for manufacturing high temperature molded systems and other articles of manufacture via injection molding, extrusion, compression molding, coating, blow molding, thermoforming, rotational molding and additive manufacturing.

A circuit-including film comprising: a resin film (1); and a conductive fine wire circuit (A) and a conductive circuit (B) independent of the conductive fine wire circuit (A), which are arranged on one surface of the resin film (1), wherein the resin film (1) contains at least one resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin and an ethylene-(vinyl acetate) copolymer resin.