An affixing method includes a pressing step of pressing a tape against a wafer with a tape affixing roller and pressing the wafer against a suction table with the tape affixing roller, an evacuating step of evacuating a vacuum chamber that houses the suction table and the tape affixing roller therein to create a vacuum in the vacuum chamber, and an affixing step of affixing the tape to the wafer with the tape affixing roller by causing the tape affixing roller to roll on the tape while the tape affixing roller is pressing the wafer.

A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

In a first aspect, a polymer film includes a polyimide. The polyimide includes one or more dianhydrides and one or more diamines. Each of the dianhydrides and diamines is selected from the group consisting of crankshaft monomers, flexible monomers, rigid rotational monomers, rigid non-rotational monomers, and rotational inhibitor monomers. The polymer film has a D.sub.f of 0.005 or less, a water absorption of 2.0% or less and a water vapor transport rate of 50 (g×mil)/(m.sup.2×day) or less. In a second aspect, a metal-clad laminate includes the polymer film of first aspect and a first metal layer adhered to a first outer surface of the polymer film. In a third aspect, an electronic device includes the polymer film of the first aspect.

A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix.

The invention provides an adhesive composition containing an adhesive component (S) and a release component (H) formed of a polyorganosiloxane having a complex viscosity of 3,400 (Pa.Math.S) or higher.

An apparatus includes a product substrate having a transfer surface, and a semiconductor die defined, at least in part, by a first surface adjoined to a second surface that extends in a direction transverse to the first surface. The transfer surface includes ripples in a profile thereof such that an apex on an individual ripple is a point on a first plane and a trough on the individual ripple is a point on a second plane. The semiconductor die is disposed on the transfer surface between the first plane and the second plane such that the second surface of the semiconductor die extends transverse to the first plane and the second plane.

Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.

The present invention provides an adhesion promoting composition, or a sulfide compound-containing polysiloxane composition, having good adhesion, capable of forming a laminate having high adhesion between a metal layer and a polysiloxane layer. The adhesion promoting composition according to the present invention is an adhesion promoting composition applied to between a metal layer and a polysiloxane layer, and comprises a sulfide compound having a certain structure and a solvent. The sulfide compound-containing polysiloxane composition according to the present invention comprises a sulfide compound having a certain structure, a polysiloxane, and a solvent.

Apparatuses and methods for glass laminates having a controlled coefficient of thermal expansion are disclosed. In C one embodiment, a glass laminate includes a glass core having a core thickness (T.sub.core) and a core coefficient of thermal expansion (CTE.sub.core), a first glass cladding layer and a second glass cladding layer. The first glass cladding layer and the second glass cladding layer are arranged such that the glass core is disposed between the first glass cladding layer and the second glass cladding layer. The first glass cladding layer has a first cladding thickness (T.sub.clad1) and a first clad coefficient of thermal expansion (CTE.sub.clad1), and the second glass cladding layer has a second cladding thickness (T.sub.clad2) and a second clad coefficient of thermal expansion (CTE.sub.clad2). The glass laminate has a laminate coefficient of thermal expansion (CTE.sub.L) within a range of about 35×10.sup.−7/° C. to about 90×10.sup.−7/° C., the laminate coefficient of thermal expansion (CTE.sub.L) defined by: CTE.sub.L=((CTE.sub.core×T.sub.core)+(CTE.sub.clad1×T.sub.clad1)+(CTE.sub.clad2× T.sub.clad2))/(T.sub.core+T.sub.clad1+T.sub.clad2).

A laminate and a method for producing a patterned substrate using the same are disclosed herein. In some embodiments, a laminate includes a substrate, and a stripe pattern having first and second polymer lines alternately and repeatedly disposed on the substrate, wherein the first polymer line comprises a first polymer having a first polymerized unit having a ring structure connected to a main chain and a second polymerized unit represented by Formula 1. The method may be applied to manufacture of devices, such as electronic devices, or of applications, such as integrated optical systems, guidance and detection patterns of magnetic domain memories, flat panel displays, liquid crystal displays (LCDs), thin film magnetic heads or organic light emitting diodes, and may be used to build a pattern on a surface used in manufacture of discrete track media, such as integrated circuits, bit-patterned media and/or magnetic storage devices such as hard drives.