The present invention relates to a mono or multi-layer polyester film, a process for producing the mono or multi-layer polyester film, an article comprising the mono or multi-layer polyester film as well as the use of the mono or multi-layer polyester film packaging products, insulating materials, solar, marine or aviation applications, science, electronic or acoustic applications, wires, cables, radio frequency identifications, flexible circuits, graphic arts, stone paper, holograms, filter products, cosmetic products, household products imaging, recording media, or industrial products.

With the measures described herein, a structural composite laminate is provided that includes a structural fuel cell, a structural supercondensator and a structural battery. Each of these components is configured in a self-supporting manner, such that aircraft parts, like exterior panels, may be manufactured from the laminate. The aircraft parts are capable of generating electrical energy by means of the structural fuel cell and distribute the electrical energy over the whole aircraft without cabling. Furthermore, short power demand peaks can be absorbed by the structural supercondensator, whereas the basic load is supplied by the structural battery.

There is provided a resin composition that can greatly improve voltage endurance while ensuring high capacitance and excellent circuit adhesion, when used as the dielectric layer of a capacitor. This resin composition includes a binder component including bisphenol S, an epoxy resin curing agent having a phenolic hydroxyl group, and an epoxy resin; and a dielectric filler.

A trim element includes at least one support layer having an inner face and an outer face and at least one functional layer of carbon material extending over at least part of the inner face and/or over at least part of the outer face of the support layer. A part of the functional layer defines a pattern having at least one conductive area of carbon material and at least one non-conductive area formed by a through-opening in the functional layer, the conductive area being powered by a current source electrically connected to the conductive area, the pattern forming at least a part of an electrical circuit arranged to perform a function.

Provided is a packaging material for a power storage device capable of securing excellent formability without causing pinholes and/or cracks even when deep depth forming is performed and also capable of sufficiently preventing delamination even when deep depth forming is performed or even when it is used under severe environments, such as, e.g., high temperature and high humidity. [Solving means] The packaging material for a power storage device has a configuration including a heat resistant resin layer 2 serving as an outer layer, a heat fusible resin layer 3 serving as an inner layer, and a metal foil layer 4 disposed between both the two layers. The heat resistant resin layer 2 is composed of a heat resistant resin film with a hot water shrinkage percentage of 1.5% to 12%. The heat resistant resin layer 2 and the metal foil layer 4 are bonded via an outer adhesive layer 5 composed of a cured film of an electron beam curable resin composition.

A polyolefin micro porous film includes at least one of polyethylene and polypropylene, in which the compressive elastic modulus is 95 MPa or more and 150 MPa or less, the surface roughness (Ra) of a film surface is measured for a front surface and a rear surface, and the average value (Ra(ave)) thereof is 0.01 μm to 0.30 μm.

A film capacitor that includes a dielectric resin film having a glass transition temperature of 160° C. or higher and a density at 25° C. of 1.22 g/cm.sup.3 to 1.26 g/cm.sup.3; and a metal layer on at least one surface of the dielectric resin film.

A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

A polycarbonate-polysiloxane includes specific amounts of first carbonate units having the structure

##STR00001##

wherein R.sup.1 is a C.sub.6-C.sub.16 divalent aromatic group, second carbonate units having the structure

##STR00002##

wherein R.sup.2 is a C.sub.17-C.sub.40 divalent aromatic group having the structure

##STR00003##

wherein R.sup.f, R.sup.g, R.sup.h, R.sup.i, R.sup.j, R.sup.k, X.sup.b, j, m, n, x, and y are defined herein. The polycarbonate-polysiloxane is useful for forming thin extruded films, which in turn are useful for fabricating electrostatic film capacitors.

A method for making a bonded article, wherein a thin glass substrate is bonded on a support substrate in the absence of any interlayer by an electrostatic adhesion process with the assistance of external pressure, the pressure is applied constantly or stepwise during the adhesion process by use of a tool such as a roll or a wheel or other movable device with curved surface. The bonded article has no defects, e.g. bubbles or inclusions, in the bonded interface, which benefits transportation of the thin glass substrate and its post-processing as well. Such defect-free bonded article is also disclosed. Pressure supported electrostatic adhesion, initiated by electrostatic charges adhesion of a two members, e.g. a substrate member and a support member, is enabled to minimize, prevent and exclude defects, distortion between the adhered surfaces.