When forming layer stacks in the presence of solder material, uncontrolled flow of the solder material at the interface of two different layers of the layer stack may significantly be mitigated by providing an area of increased pressure in the material of the overlaying foil layer. For example, the area of increased pressure may be generated during the lamination process by providing a pressure inducing structure, for instance on the underlying foil layer, which laterally surrounds the solder material and therefore, in combination with the material of the overlying foil layer, reliably confines the solder material.

Disclosed are pre-cure RFID-enabled bead labels based on an RFID inlay construction consisting of an aluminum antenna etched on to a high temperature resistant polyimide film that is connected to an integrated memory circuit positioned on the surface of the polyimide film. This RFID inlay being further inserted into an overall label construction having a plurality of layers that include, for example, a plurality of polyester layers and a plurality of high temperature resistant adhesive layers that bond/adhere layers together, the plurality of layers further protecting and insulating the RFID inlay while the label is bonded to the external bead (or sidewall) of a tire. The compositions/devices disclosed herein can be used for electronic identification when applied on rubber-based articles (e.g., tires) prior to being subjected to stress related to the vulcanization process and normal use of this article during the manufacturing process.

Label constructions comprise a first section and a second section that are laminate constructions of a card stock top surface that may include printed indicia, an adhesive layer disposed underneath the card stock, and a removable liner adhered to the adhesive layer and common to the first and second sections. The first section includes an RFID device. The first section may be configured once removed from the liner to fold on itself to form an RFID tag, or to form an RFID adhesive label. The second section once separately removed from the liner forms an adhesive label. The construction first and second sections are positioned adjacent one another and are formed during the same manufacturing process for purposes of manufacturing efficiency. The first and second sections may be treated to facilitate separate removal from the liner to provide labeling flexibility.

A method, apparatus, and product-by-process, for preparing an RFID access card constructed out of wood is disclosed. The method involved preparing two wooden surfaces of appropriate thickness, preparing an RFID chip emitting an appropriate frequency, and pressing the wooden surfaces and the RFID chip together through the use of adhesive(s) and a hot press and a cold press. The apparatus included an RFID access card constructed out of at least two wooden surfaces where an RFID chip is disposed between the two surfaces. The two wooden surfaces are attached with a hot melt adhesive.

Film laminates containing a layer of a lower melting polyaryletherketone and a layer of a higher melting polyaryletherketone adhered to each other are resistant to heat, wear, moisture, weathering and chemicals and are useful for producing articles such as laminated electronic circuits, flexible heaters, insulated wire and cable, radio frequency identification tags and labeled articles.

A method, apparatus, and product-by-process, for preparing an RFID access card constructed out of wood is disclosed. The method involved preparing two wooden surfaces of appropriate thickness, preparing an RFID chip emitting an appropriate frequency, and pressing the wooden surfaces and the RFID chip together through the use of adhesive(s) and a hot press and a cold press. The apparatus included an RFID access card constructed out of at least two wooden surfaces where an RFID chip is disposed between the two surfaces. The two wooden surfaces are attached with a hot melt adhesive.

A Smart Patch comprising a label layer, an adhesive layer, a release liner layer and a RFID inlay, wherein the release liner comprises a separable inner release liner portion and a separable outer release liner portion; and the RFID inlay is adhered to a back surface of the inner release liner portion. The Smart Patches for uses including mounting to tires and other rubber materials. Methods of manufacturing including subjecting a release liner of the label to a die cut slightly larger than the size of an intended RFID inlay to form the separable inner release liner portion and outer release liner portion and applying a RFID inlay to a back surface of a release liner within the die cut inner release liner portion.

Disclosed are pre-cure RFID-enabled bead labels based on an RFID inlay construction consisting of an aluminum antenna etched on to a high temperature resistant polyimide film that is connected to an integrated memory circuit positioned on the surface of the polyimide film. This RFID inlay being further inserted into an overall label construction having a plurality of layers that include, for example, a plurality of polyester layers and a plurality of high temperature resistant adhesive layers that bond/adhere layers together, the plurality of layers further protecting and insulating the RFID inlay while the label is bonded to the external bead (or sidewall) of a tire. The compositions/devices disclosed herein can be used for electronic identification when applied on rubber-based articles (e.g., tires) prior to being subjected to stress related to the vulcanization process and normal use of this article during the manufacturing process.

A laminate material comprising a paper web and a polymeric film adhered to the paper web, the polymeric film comprising a biodegradable polymeric material that includes an organic additive.

Disclosed embodiments generally relate to a transaction card with a fabric inlay. The transaction card may include a housing component having a first housing surface opposite a second housing surface and an inlay component having a first inlay surface opposite a second inlay surface. The inlay and housing may be joined along the second inlay surface and the first housing surface. In addition, the first inlay surface may include a fabric material and a backer layer configured to support the fabric material of the first inlay surface.