Apparatus and method for exposing a partially processed photopolymer printing plate to post-exposure radiation and finishing radiation, the printing plate defining a whole area having a first full lateral dimension and a second full lateral dimension perpendicular to the first lateral dimension. A plurality of light-emitting diodes (LEDs) are arranged in one or more arrays; a surface for receiving the printing plate in a location disposed to receive the post exposure radiation and the finishing radiation; and one of more controllers connected to the one or more arrays to activate the one or more arrays to cause the plurality of sets of LEDs to emit radiation toward the printing plate. The plurality of LEDs includes at least a first set of LEDs to emit the post exposure radiation in a UVA spectral range and a second set of LEDs to emit the finishing radiation in a UVC spectral range.

Apparatus and method for exposing a partially processed photopolymer printing plate to post-exposure radiation and finishing radiation, the printing plate defining a whole area having a first full lateral dimension and a second full lateral dimension perpendicular to the first lateral dimension. A plurality of light-emitting diodes (LEDs) are arranged in one or more arrays; a surface for receiving the printing plate in a location disposed to receive the post exposure radiation and the finishing radiation; and one of more controllers connected to the one or more arrays to activate the one or more arrays to cause the plurality of sets of LEDs to emit radiation toward the printing plate. The plurality of LEDs includes at least a first set of LEDs to emit the post exposure radiation in a UVA spectral range and a second set of LEDs to emit the finishing radiation in a UVC spectral range.

Provided are a modular processing unit that is standardizable, capable of enhancing production efficiency, and is also flexibly customizable, and a fully automatic gravure cylinder manufacturing system using the modular processing unit. The modular processing unit includes a pair of frame members provided upright so as to face each other, a first processing module including a first processing bath module, a first beam module provided horizontal to a floor, and a first chuck module, and a second processing module including a second processing bath module, a second beam module provided horizontal to the floor, and a second chuck module. The modular processing unit has multi-stage structure with at least the first processing module and the second processing module being assembled onto the frame members.

Provided are a modular processing unit that is standardizable, capable of enhancing production efficiency, and is also flexibly customizable, and a fully automatic gravure cylinder manufacturing system using the modular processing unit. The modular processing unit includes a pair of frame members provided upright so as to face each other, a first processing module including a first processing bath module, a first beam module provided horizontal to a floor, and a first chuck module, and a second processing module including a second processing bath module, a second beam module provided horizontal to the floor, and a second chuck module. The modular processing unit has multi-stage structure with at least the first processing module and the second processing module being assembled onto the frame members.

Described herein are an apparatus and a method for direct engraving an elastomeric printing plate or sleeve by multiple laser beams simultaneously. In one embodiment, an elastomeric printing plate or sleeve is positioned on an imaging drum for direct engraving. The imaging drum is rotatable around its longitudinal axis. Such rotation defines a circumferential direction, also called the transverse direction. The axis of rotation defines an axial direction, also called the longitudinal direction. The printing plate or sleeve has an body and a surface made of an elastomer (made of polymer or rubber). A drive mechanism provides relative motion between a plurality of laser beams and the plate or sleeve in both the transverse and longitudinal directions.

The embodiments herein relate to methods and apparatus for determining whether a particular test bath is able to successfully fill a feature on a substrate. In various cases, the substrate is a semiconductor substrate and the feature is a through-silicon-via. Generally, two experiments are used: a first experiment simulates the conditions present in a field region of the substrate during the fill process, and the second experiment simulates the conditions present in a feature on the substrate during the fill process. The output from these experiments may be used with various techniques to predict whether the particular bath will result in an adequately filled feature.

The embodiments herein relate to methods and apparatus for determining whether a particular test bath is able to successfully fill a feature on a substrate. In various cases, the substrate is a semiconductor substrate and the feature is a through-silicon-via. Generally, two experiments are used: a first experiment simulates the conditions present in a field region of the substrate during the fill process, and the second experiment simulates the conditions present in a feature on the substrate during the fill process. The output from these experiments may be used with various techniques to predict whether the particular bath will result in an adequately filled feature.

The embodiments herein relate to methods and apparatus for determining whether a particular test bath is able to successfully fill a feature on a substrate. In various cases, the substrate is a semiconductor substrate and the feature is a through-silicon-via. Generally, two experiments are used: a first experiment simulates the conditions present in a field region of the substrate during the fill process, and the second experiment simulates the conditions present in a feature on the substrate during the fill process. The output from these experiments may be used with various techniques to predict whether the particular bath will result in an adequately filled feature.

Provided is a cylinder etching apparatus, which is capable of performing etching more uniformly than in the prior art and is also capable of solving a problem in that a remaining etching solution in an etching solution supply tube flows down therefrom. The cylinder etching apparatus includes: a processing bath; chuck means; at least one etching solution supply tube; and a plurality of ejection nozzles juxtaposed in the etching solution supply tube and configured to eject an etching solution from the etching solution supply tube. The etching solution ejected from the ejection nozzles through the etching solution supply tube is caused to impinge against a surface of the cylinder to be processed, to thereby etch the surface of the cylinder to be processed. The ejection nozzles are oriented obliquely upward with respect to a horizontal direction. An ejection direction of the ejection nozzle is oriented toward a rotation center of the cylinder to be processed from a position that is obliquely downward of the cylinder to be processed. The ejection nozzles are arranged so as to be brought closer to and away from the surface of the cylinder to be processed.

Provided is a cylinder etching apparatus, which is capable of performing etching more uniformly than in the prior art and is also capable of solving a problem in that a remaining etching solution in an etching solution supply tube flows down therefrom. The cylinder etching apparatus includes: a processing bath; chuck means; at least one etching solution supply tube; and a plurality of ejection nozzles juxtaposed in the etching solution supply tube and configured to eject an etching solution from the etching solution supply tube. The etching solution ejected from the ejection nozzles through the etching solution supply tube is caused to impinge against a surface of the cylinder to be processed, to thereby etch the surface of the cylinder to be processed. The ejection nozzles are oriented obliquely upward with respect to a horizontal direction. An ejection direction of the ejection nozzle is oriented toward a rotation center of the cylinder to be processed from a position that is obliquely downward of the cylinder to be processed. The ejection nozzles are arranged so as to be brought closer to and away from the surface of the cylinder to be processed.