Patent classifications
B41F19/02
METHOD AND DEVICE FOR ROTARY BLIND EMBOSSING OF A SUBSTRATE, A FEMALE DIE AND/OR A MALE DIE FOR USE IN A DEVICE, AND A METHOD FOR PRODUCING A FEMALE DIE AND/OR A MALE DIE
A method for the rotary blind embossing of a substrate, a device for the rotary blind embossing of a substrate, a female die and/or a male die for use in a device, and to a method for producing a female die and/or a male die. The method for the rotary blind embossing of a substrate in a work station including an embossing roller and a counter-pressure roller includes the following steps: a) preparing the substrate; b) blind embossing the substrate by means of at least one female die provided on the embossing roller and at least one male die provided on the counter-pressure roller. The device for the rotary blind embossing of a substrate has a work station having an embossing roller and a counter-pressure roller, at least one female die being provided on the embossing roller and at least one male die being provided on the counter-pressure roller.
Method and device for embossing of a nanostructure
A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate.
Method and device for embossing of a nanostructure
A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate.
DIGITAL PRINTING WITH TRANSPARENT BLANK INK
A method, a panel and equipment to form a digital print by applying dry ink, preferably including particles of pigment coated wood fibres, on a surface, bonding a part of the particles with a liquid blank ink drops and removing the non-bonded particles from the surface. A panel having a surface with a wood grain dcor, the panel including a first surface portion that is formed by a continuous basic layer including wood fibres having a first color, and a second surface portion that is formed by wood fibres having a second color, wherein the wood fibres having the second color are applied on and bonded to the continuous basic layer, and wherein the second surface portion covers a part of the first surface portion.
DIGITAL PRINTING WITH TRANSPARENT BLANK INK
A method, a panel and equipment to form a digital print by applying dry ink, preferably including particles of pigment coated wood fibres, on a surface, bonding a part of the particles with a liquid blank ink drops and removing the non-bonded particles from the surface. A panel having a surface with a wood grain dcor, the panel including a first surface portion that is formed by a continuous basic layer including wood fibres having a first color, and a second surface portion that is formed by wood fibres having a second color, wherein the wood fibres having the second color are applied on and bonded to the continuous basic layer, and wherein the second surface portion covers a part of the first surface portion.
Embossing with printed relief pattern
An embossing apparatus includes an embossing die that includes a printed relief pattern made up of multiple layers of a deposited material. A resilient surface presses media against the embossing die such that embossed features corresponding to the embossing die are formed in the media. A method for embossing media includes forming an embossing die by depositing multiple layers of ink on a impression layer to form a relief pattern and pressing media against the embossing die to transfer the relief image to the media.
Embossing with printed relief pattern
An embossing apparatus includes an embossing die that includes a printed relief pattern made up of multiple layers of a deposited material. A resilient surface presses media against the embossing die such that embossed features corresponding to the embossing die are formed in the media. A method for embossing media includes forming an embossing die by depositing multiple layers of ink on a impression layer to form a relief pattern and pressing media against the embossing die to transfer the relief image to the media.
LABEL INCLUDING A LENS ARRAY
A label having a lens array, and methods and system for preparing such a label. The label includes at least one surface, a portion of which is embossed, and a lens array provided by the embossed portion of the at least one surface. The method includes applying a coating to a film, and embossing a portion of the coating to provide a lens array. And the system includes an embossing apparatus associated with a printing apparatus.
LABEL INCLUDING A LENS ARRAY
A label having a lens array, and methods and system for preparing such a label. The label includes at least one surface, a portion of which is embossed, and a lens array provided by the embossed portion of the at least one surface. The method includes applying a coating to a film, and embossing a portion of the coating to provide a lens array. And the system includes an embossing apparatus associated with a printing apparatus.
Manufacturing a two-sided product with an integrated device including microscale structures
Apparatus for manufacturing a two-sided product with an integrated device on a web of material, including: a first rotary micro scale structure formation unit for having a first structure for forming a first microscale structure on one side of a portion of web; a second rotary microscale structure formation unit having a second structure for forming a second micro scale structure on second side of the portion of the web; the first and second micro scale structures and the portion of the web between the first and second microscale structures together forming the integrated device; and a web feed system for feeding the web of material between the first and second rotary microscale structure formation units.