In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.

In a flow path unit, ink flows toward a recording head that ejects the ink. The flow path unit includes a flow path portion, a temperature adjustment unit, and a compression coil spring. The flow path portion is formed of metal and includes a supply pipe through which the ink flows. The temperature control unit heats the supply pipe. The compression coil spring is formed of metal and is attached to an inner surface of the supply pipe. The ink can come into contact with the compression coil spring, and the compression coil spring enables the ink to flow downstream in the supply pipe.

In a flow path unit, ink flows toward a recording head that ejects the ink. The flow path unit includes a flow path portion, a temperature adjustment unit, and a compression coil spring. The flow path portion is formed of metal and includes a supply pipe through which the ink flows. The temperature control unit heats the supply pipe. The compression coil spring is formed of metal and is attached to an inner surface of the supply pipe. The ink can come into contact with the compression coil spring, and the compression coil spring enables the ink to flow downstream in the supply pipe.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.

A cutting device includes: a cutter blade movable between a retracted position and a cutting position; a cutter cradle facing the cutter blade; and a first lever and a second lever those operated by a user. The cutter blade performs one of a half-cutting operation and a full-cutting operation with respect to a cut target when positioned at the cutting position. The cutter cradle is movable between: a full-cutting position where the full-cutting operation is performed by the cutter blade; and a half-cutting position where the half-cutting operation is performed by the cutter blade. When the first lever is operated, the cutter blade is moved to the cutting position while the cutter cradle remains at the half-cutting position. When the second lever is operated, the cutter blade is moved to the cutting position and the cutter cradle is moved between the full-cutting position and the half-cutting position.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.

The disclosure relates to a method and apparatus for preventing oxidation or contamination during a circuit printing operation. The circuit printing operation can be directed to OLED-type printing. In an exemplary embodiment, the printing process is conducted at a load-locked printer housing having one or more of chambers. Each chamber is partitioned from the other chambers by physical gates or fluidic curtains. A controller coordinates transportation of a substrate through the system and purges the system by timely opening appropriate gates. The controller may also control the printing operation by energizing the print-head at a time when the substrate is positioned substantially thereunder.