An energy-efficient method of controlling the composite microstructure and resulting thermoelectric (TE) properties of TE composite films. The TE composite films, which include a small amount of naturally occurring chitosan binder that is sufficient to hold TE particles together, are modified by applying uniaxial mechanical pressure at low temperatures for a short duration. The TE composite films have high electrical conductivity and low thermal conductivity, making them ideal for use into high-performance energy harvesting thermoelectric devices.

The present invention relates to a baking tray (20) or baking grid, in particular a baking tray (20) for a cooking appliance (1), having a non-stick and/or non-wetting coating (12) obtainable by a process characterised by the following steps, a) providing a baking tray (20) or baking grid having a surface, in particular having an upper surface (7a) and a bottom surface (7b), b) preferably, pretreating of the surface (7a, 7b) of the baking tray (20) or baking grid at least partially, in particular completely, for providing a surface having a roughness being suitable for applying a non-stick and/or non-wetting coating (12) by mechanical treatment, physical treatment or chemical treatment, in particular by sandblasting and/or laser treatment and/or a surface activation treatment, particularly a plasma treatment, and/or an enamelling process to form a ground layer (13), c) applying the non-stick and/or non-wetting coating (12) to the pretreated surface (7a, 7b) of the baking tray (20) or baking grid or a surface (14a) of the ground layer (13), wherein the non-stick and/or non-wetting coating (12) comprises at least one layer (17) that is obtained by a sol-gel process from a first composition comprising a silica sol and a silane. The invention further relates to a cooking appliance (1), in particular a domestic oven comprising such a baking tray (20) or baking grid and a method for manufacturing such a baking tray (20) or baking grid.

Analyte sensors and methods for fabricating analyte sensors are provided. In an exemplary embodiment, a method for fabricating a planar flexible analyte sensor includes sputtering platinum onto a polyester base layer to form a layer of platinum. The method includes patterning the layer of platinum to form working electrodes and additional electrodes. Further, the method includes forming an insulating dielectric layer over the base layer, wherein the insulating dielectric layer is formed with openings exposing portions of the working electrodes and portions of the additional electrodes. Also, the method includes partially singulating individual sensors from the base layer, wherein each individual sensor is connected to the base layer by a tab. The method further includes depositing an enzyme layer over the exposed portions of the working electrodes and coating the working electrodes with a glucose limiting membrane.

Analyte sensors and methods for fabricating analyte sensors are provided. In an exemplary embodiment, a method for fabricating a planar flexible analyte sensor includes sputtering platinum onto a polyester base layer to form a layer of platinum. The method includes patterning the layer of platinum to form working electrodes and additional electrodes. Further, the method includes forming an insulating dielectric layer over the base layer, wherein the insulating dielectric layer is formed with openings exposing portions of the working electrodes and portions of the additional electrodes. Also, the method includes partially singulating individual sensors from the base layer, wherein each individual sensor is connected to the base layer by a tab. The method further includes depositing an enzyme layer over the exposed portions of the working electrodes and coating the working electrodes with a glucose limiting membrane.

A copper-based ink contains copper hydroxide and diethanolamine. The ink may be coated on a substrate and decomposed on the substrate to form a conductive copper coating on the substrate. The ink is low cost and micron-thick traces of the ink may be screen printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Sintered copper traces produced from the ink have improved air stability compared to traces produced from other copper inks. Sintered copper traces having sheet resistivity of about 20 mΩ/□/mil or less may be obtained for 5-20 mil wide screen-printed lines with excellent resolution.

A copper-based ink contains copper hydroxide and diethanolamine. The ink may be coated on a substrate and decomposed on the substrate to form a conductive copper coating on the substrate. The ink is low cost and micron-thick traces of the ink may be screen printed and thermally sintered in the presence of up to about 500 ppm of oxygen or photo-sintered in air to produce highly conductive copper features. Sintered copper traces produced from the ink have improved air stability compared to traces produced from other copper inks. Sintered copper traces having sheet resistivity of about 20 mΩ/□/mil or less may be obtained for 5-20 mil wide screen-printed lines with excellent resolution.

The electrostatic printing method of the present invention comprises arranging and adhering an original plate which is composed of an electrode and a plate layer having built-in a letterpress, intaglio plate, or gravure plate pattern or a mask sheet having ion-permeable openings on one or both sides of an image receiving sheet having an electrode and an image receiving layer, and forming a predetermined electrostatic pattern on the image receiving layer of the image receiving sheet by applying a voltage between the electrode of the original plate and the electrode of the image receiving sheet or by performing ion irradiation through the mask sheet.

Articles of wear having one or more textiles that include a low processing temperature polymeric composition and a high processing temperature polymeric composition, and methods of manufacturing the same are disclosed. The low processing temperature polymeric composition and the high processing temperature polymeric composition can be selectively incorporated into a textile to provide one or more structural properties and/or other advantageous properties to the article. The textile can be thermoformed to impart such structural and/or other advantageous properties to the article of wear. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

Articles of wear having one or more textiles that include a low processing temperature polymeric composition and a high processing temperature polymeric composition, and methods of manufacturing the same are disclosed. The low processing temperature polymeric composition and the high processing temperature polymeric composition can be selectively incorporated into a textile to provide one or more structural properties and/or other advantageous properties to the article. The textile can be thermoformed to impart such structural and/or other advantageous properties to the article of wear. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

A method of forming solder paste on an object is provided. The method includes providing a multilayered stencil, each stencil layer having an aperture formed therethrough from a top surface of the respective stencil layer to a bottom surface of the stencil layer. The method also includes applying the stencil to a surface of the object. The method also includes filling a void space formed by a combination of the apertures in the stencil layers with solder paste. The method also includes removing the stencil layers in a sequential manner to leave the solder paste.