A tubular casing has a package design (la) printed on an original fabric film (1) with transparent no-print zones (2, 3) formed along left and right end edges (2a, 3a). Best before date characters (4) are inkjet printed on the no-print zone (2). The fabric film (1) is bent to place the no-print zone (2) with printed characters on a lower side and form the fabric film (1) in a cylindrical shape. A heat seal portion (H) is formed including the date characters (4), in the no-print zone (2) located on the lower side. The heat seal portion (H) is formed up to the end edge (2a) of the no-print zone (2) and a no-heat seal portion (S) is formed on the end edge (3a) side of the no-print zone (3) located on an upper side to form a casing portion. Both ends of the casing portion are sealed.

A tubular casing has a package design (la) printed on an original fabric film (1) with transparent no-print zones (2, 3) formed along left and right end edges (2a, 3a). Best before date characters (4) are inkjet printed on the no-print zone (2). The fabric film (1) is bent to place the no-print zone (2) with printed characters on a lower side and form the fabric film (1) in a cylindrical shape. A heat seal portion (H) is formed including the date characters (4), in the no-print zone (2) located on the lower side. The heat seal portion (H) is formed up to the end edge (2a) of the no-print zone (2) and a no-heat seal portion (S) is formed on the end edge (3a) side of the no-print zone (3) located on an upper side to form a casing portion. Both ends of the casing portion are sealed.

The present invention relates to a method and a jig for forming a pattern, the method and the jig being capable of realizing various and unique pattern designs due to magnetic particles included in the magnetic ink being distributed in various densities according to intensity of the magnetic force. Disclosed is a method and a jig for forming a pattern by using magnetic ink and magnetic force, the method including: preparing a jig which generating magnetic force, applying magnetic ink on a surface of a substrate to form a print layer, disposing the substrate configured with the print layer above the jig, forming a magnetic pattern on the print layer by applying magnetic force generated from the jig, and drying the print layer.

The present invention relates to a method and a jig for forming a pattern, the method and the jig being capable of realizing various and unique pattern designs due to magnetic particles included in the magnetic ink being distributed in various densities according to intensity of the magnetic force. Disclosed is a method and a jig for forming a pattern by using magnetic ink and magnetic force, the method including: preparing a jig which generating magnetic force, applying magnetic ink on a surface of a substrate to form a print layer, disposing the substrate configured with the print layer above the jig, forming a magnetic pattern on the print layer by applying magnetic force generated from the jig, and drying the print layer.

A device source wafer includes a wafer substrate, devices formed on or in the wafer substrate at a location on the wafer substrate, and test structures disposed on the wafer substrate connected to some but not all of the devices. The devices include a first device disposed at a first location and a second device disposed at a second different location on the wafer substrate. The test structures include at least a first test structure connected to the first device and a second test structure connected to the second device. The first test structure is adapted to measuring a characteristic of the first device and the second test structure is adapted to measuring the characteristic of the second device. An estimated characteristic of unmeasured devices is derived from the first and second device locations and measured characteristics and the device is selected based on the estimated characteristic.

A device source wafer includes a wafer substrate, devices formed on or in the wafer substrate at a location on the wafer substrate, and test structures disposed on the wafer substrate connected to some but not all of the devices. The devices include a first device disposed at a first location and a second device disposed at a second different location on the wafer substrate. The test structures include at least a first test structure connected to the first device and a second test structure connected to the second device. The first test structure is adapted to measuring a characteristic of the first device and the second test structure is adapted to measuring the characteristic of the second device. An estimated characteristic of unmeasured devices is derived from the first and second device locations and measured characteristics and the device is selected based on the estimated characteristic.

The present invention discloses a system and method for printing a registered image on a wet wipe. The system includes a printing apparatus having a plurality of ink reservoirs configured to print a plurality of graphics on a fabric. At least one optical sensor is configured to sense the plurality of graphics and one or more perforating components form a plurality of perforations along a length of the fabric. One or more cutting components configured to form a plurality of cuts along a length of the fabric. A packaging apparatus packages the printed material.

The present invention discloses a system and method for printing a registered image on a wet wipe. The system includes a printing apparatus having a plurality of ink reservoirs configured to print a plurality of graphics on a fabric. At least one optical sensor is configured to sense the plurality of graphics and one or more perforating components form a plurality of perforations along a length of the fabric. One or more cutting components configured to form a plurality of cuts along a length of the fabric. A packaging apparatus packages the printed material.

A method of transfer lamination involves applying a release coating to a first side of a film, applying an application layer to the first side of the film over the release coating, bonding the first side of the film to a substrate, applying a second coating to a second side of the film while the first side of the film is bonded to the substrate, and removing the film from the substrate leaving the application layer deposited on the substrate and the second coating on the second side of the film.

An image forming system includes: a transporter that transports an object; a transfer unit that transfers an image onto the object transported by the transporter; a fixing unit that fixes, onto the object, the image transferred by the transfer unit; and a processor configured to: in a first mode, exert control to obtain the state in which the fixing unit enables an image to be fixed; and, in a second mode, exert control to obtain the state in which the fixing unit does not fix an image.