B41M3/006

Controlled deposition of materials using a differential pressure regime

Methods and devices for controlling pressures in microenvironments between a deposition apparatus and a substrate are provided. Each microenvironment is associated with an aperture of the deposition apparatus which can allow for control of the microenvironment.

Fast conductivity polymer silver
11084950 · 2021-08-10 · ·

A conductive paste is provided for forming conductive traces on substrates. The conductive paste includes a vehicle and conductive material. The vehicle includes a resin, a plasticizer, and a solvent in which the resin is dissolved. After application to a substrate, the conductive paste is cured at ambient temperature by evaporation of the solvent from the paste, to thereby form a conductive trace on the substrate. The conductive trace does not require a curing agent, and attains low resistivity within minutes of application to the substrate.

MULTIFLUIDIC DEVICE AND PROCESSING SYSTEM FOR COLORIMETRIC MULTIPLEXED DETECTION OF A SUBSTANCE

A μPAD may include a substrate comprising a substrate. The μPAD may further include a non-polar material printed on a surface of the substrate such that a portion the surface is exposed. The exposed portion may include a receiving area, a plurality of test areas, and a plurality of channels disposed between the receiving area and the test areas. The μPAD may further include colorimetric sensors respectively positioned in the test areas. The channel regions may be configured to receive an analyte solution from the receiving area and direct the analyte solution to the colorimetric sensors. A system may perform image processing on captured images of the μPAD to provide multiplexed analysis of analyte solutions applied to the μPAD.

SYSTEMS AND METHODS FOR PRINTING SOLDER PASTE AND OTHER VISCOUS MATERIALS AT HIGH RESOLUTION
20210237184 · 2021-08-05 ·

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.

Double-sided and multilayered printed circuit board fabrication using inkjet printing

The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.

Interior Trim for Vehicles with Electrical Conductors and Method for Manufacturing Same

Interior trim for vehicles, specifically of the type comprising a sandwich structure, where the electrical conductors are integrated by printing with conductive inks, specifically by screen printing, allowing to make compatible the manufacturing method for the interior trim and the printing method for the electrical conductors, while also facilitating the electrical connections through the edges of the trim of the electrical conductors and the electric devices assembled in the interior trim and ensuring the correct operation of the electrical conductors throughout the useful lifetime of the interior trim. The invention also relates to a method for manufacturing an interior trim for vehicles with electrical conductors.

Polyurethane, curable composition, overcoat film, and flexible wiring board and production method therefor

Provided are a polyurethane and a curable composition capable of obtaining an overcoat film for a flexible wiring board that is excellent in low-warpage properties, flexibility, long-term insulation reliability, and wiring disconnection preventing properties. The polyurethane has: a structural unit of formula (1) (in formula (1), an n-number of R.sup.1 each independently represents a 1,2-phenylene group or a 1,2-phenylene group having a substituent, an (n+1)-number of R.sup.2 each independently represents a hydrocarbon group having 3-9 carbon atoms, and n represents an integer from 1 to 50); a structural unit of formula (2) (in formula (2). R.sup.3 represents a divalent organic group having 6-14 carbon atoms); and a structural unit of formula (3) (in formula (3), R.sup.3 represents a divalent organic group having 6-14 carbon atoms, and R.sup.4 represents a methyl or ethyl group). ##STR00001##

Recording method, recording apparatus and recorded matter

A recording method includes a step of applying a first ink to a recording medium; and a step of recording an image on the recording medium by applying a second ink so that the second ink at least partially overlaps a region to which the first ink has been applied. The first ink is an aqueous ink containing a silver particle. The second ink is an aqueous ink containing a coloring material. The recording medium has an ink receiving layer that contains a halide ion selected from the group consisting of a bromide ion and an iodide ion. The ink receiving layer has a halide ion content (mmol/m.sup.2) of 0.1 mmol/m.sup.2 or more to 0.8 mmol/m.sup.2 or less.

Semiconductor device and method of manufacturing the semiconductor device
11038317 · 2021-06-15 · ·

A method of manufacturing a semiconductor device includes: providing a package; providing a mounting substrate; providing at least one first bonding member disposed at a position connecting at least one first metal surface of the package and at least one first metal pattern of the mounting substrate; providing a second bonding member connecting at least one second metal surface of the package and at least one second metal pattern of the mounting substrate; and heating the at least one first bonding member and the at least one second bonding member at a temperature equal to or higher than both a bonding temperature of the at least one first bonding member and a bonding temperature of the at least one second bonding member, to bond the package and the mounting substrate together.

Method of discharging chemical liquid using an ink jet head
11046078 · 2021-06-29 · ·

In a method of supplying chemical liquid using an ink jet head including a central portion and peripheral portions each having a first portion and a second portion, a first chemical liquid supply of a chemical liquid may be provided from the central portion onto a substrate, a second chemical liquid supply of the chemical liquid may be provided from the first portion onto a substrate, and a third chemical liquid supply of the chemical liquid may be provided from the second portion onto a substrate. The ink jet head may be moved over the substrate by a length of the peripheral portion. The first chemical liquid supply of the chemical liquid may be provided from the central portion onto a substrate, the second chemical liquid supply of the chemical liquid may be provided from the first portion onto a substrate, and the third chemical liquid supply of the chemical liquid may be provided from the second portion onto a substrate.