An electronic component series includes a base tape mainly composed of paper and having a multiplicity of accommodation recesses formed continuously at predetermined intervals for accommodating electronic components each having a substantially rectangular parallelepiped shape with an L dimension of less than or equal to 0.6 mm, a W dimension of less than or equal to 0.3 mm, and a T dimension of less than or equal to 0.3 mm; the electronic components accommodated in the accommodation recesses; and a cover tape continuously adhered to a surface of the base tape to cover the accommodation recesses. The electronic components are lifted from the accommodation recesses by peeling off the cover tape. Each of the accommodation recesses has a bottom surface inclined in a range of more than 10° to 20° with respect to the surface of the base tape to be deeper toward a downstream in a conveyance direction.

An electronic component array includes a base tape including paper and having approximately elongated and substantially planar shape, the base tape being provided with a plurality of accommodation recesses provided in a longitudinal direction of the base tape; a plurality of electronic components; and a cover tape. The electronic component array includes a first bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are included in the respective accommodation recesses, and a second bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are not included in the respective accommodation recesses. A peel strength of the second bonding portion is about 10% or more and about 70% or less of a peel strength of the first bonding portion.

An electronic component array includes a base tape including paper and having approximately elongated and substantially planar shape, the base tape being provided with a plurality of accommodation recesses provided in a longitudinal direction of the base tape; a plurality of electronic components; and a cover tape. The electronic component array includes a first bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are included in the respective accommodation recesses, and a second bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are not included in the respective accommodation recesses. A peel strength of the second bonding portion is about 10% or more and about 70% or less of a peel strength of the first bonding portion.

There is provided a component mounter including: a storage which stores information related to a tape feeder and information related to a carrier tape pitch-fed by the tape feeder; a detector which detects a state where the carrier tape becomes close to a component shortage; a determiner which determines whether to perform predetermined processing with respect to a termination portion of the carrier tape based on information related to the tape feeder and information related to the carrier tape which are stored in the storage, in a case where a state where the carrier tape is close to a component shortage is detected by the detector; and a notifier which notifies an operator of contents of the predetermined processing, in a case where the determiner determines that the predetermined processing is supposed to be performed with respect to the termination portion of the carrier tape.

There is provided a component mounter including: a storage which stores information related to a tape feeder and information related to a carrier tape pitch-fed by the tape feeder; a detector which detects a state where the carrier tape becomes close to a component shortage; a determiner which determines whether to perform predetermined processing with respect to a termination portion of the carrier tape based on information related to the tape feeder and information related to the carrier tape which are stored in the storage, in a case where a state where the carrier tape is close to a component shortage is detected by the detector; and a notifier which notifies an operator of contents of the predetermined processing, in a case where the determiner determines that the predetermined processing is supposed to be performed with respect to the termination portion of the carrier tape.

A carrier for reversibly immobilizing one or more objects is disclosed. The carrier comprises a frame having a major axis, a top surface, a bottom surface, and one or more openings through the frame along the major axis. The carrier also comprises a film comprising a thermoplastic elastomer material and having a top surface and a bottom surface. The film is attached to the frame based on thermal bonding of the top surface of the film to the bottom surface of the frame, is under tension along the major axis, and is free to flex at the openings. The top surface of the film comprises one or more exposed top surface portions that are accessible through the openings. The exposed top surface portions exhibit a holding force on stainless steel as per ASTM D1000 that is greater than that of the bottom surface of the film.

A carrier for reversibly immobilizing one or more objects is disclosed. The carrier comprises a frame having a major axis, a top surface, a bottom surface, and one or more openings through the frame along the major axis. The carrier also comprises a film comprising a thermoplastic elastomer material and having a top surface and a bottom surface. The film is attached to the frame based on thermal bonding of the top surface of the film to the bottom surface of the frame, is under tension along the major axis, and is free to flex at the openings. The top surface of the film comprises one or more exposed top surface portions that are accessible through the openings. The exposed top surface portions exhibit a holding force on stainless steel as per ASTM D1000 that is greater than that of the bottom surface of the film.

There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

The present invention provides a parallel method for packaging an electronic component and coating an adhesive on a carrier tape and a mechanism for same, so as to regulate continuous output of an adhesive and intermittent movement in packaging work, so that during a short pause of placing an electronic component, a continuously output adhesive is prevented from being repeatedly applied at a fixed position of a carrier tape. In this way, excessive application of an adhesive can be avoided, and it can be further ensured that the quality of packaging is not affected by an excessive amount of an adhesive.