B65B15/04

PARALLEL METHOD FOR PACKAGING ELECTRONIC COMPONENT AND COATING ADHESIVE ON CARRIER TAPE AND MECHANISM FOR SAME
20200317378 · 2020-10-08 ·

The present invention provides a parallel method for packaging an electronic component and coating an adhesive on a carrier tape and a mechanism for same, so as to regulate continuous output of an adhesive and intermittent movement in packaging work, so that during a short pause of placing an electronic component, a continuously output adhesive is prevented from being repeatedly applied at a fixed position of a carrier tape. In this way, excessive application of an adhesive can be avoided, and it can be further ensured that the quality of packaging is not affected by an excessive amount of an adhesive.

Apparatus for packing ultra-small electronic devices

An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.

Apparatus for packing ultra-small electronic devices

An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.

Taping apparatus
10683114 · 2020-06-16 · ·

A component conveyance disk of a taping apparatus has a plurality of component transport units at an equiangular interval. Each component transport unit is formed of three component transport grooves in a peripheral portion of the component conveyance disk. Width direction centerlines of the respective component transport grooves are parallel to each other, with a portion thereof in a direction along the width direction centerlines opening toward a component storage chamber. Dimensions along the width direction centerlines of the opened portion of the respective component transport grooves are shorter than a length of the component. In addition, the respective component transport grooves have component guides that guide the components into the respective component transport grooves.

Taping apparatus
10683114 · 2020-06-16 · ·

A component conveyance disk of a taping apparatus has a plurality of component transport units at an equiangular interval. Each component transport unit is formed of three component transport grooves in a peripheral portion of the component conveyance disk. Width direction centerlines of the respective component transport grooves are parallel to each other, with a portion thereof in a direction along the width direction centerlines opening toward a component storage chamber. Dimensions along the width direction centerlines of the opened portion of the respective component transport grooves are shorter than a length of the component. In addition, the respective component transport grooves have component guides that guide the components into the respective component transport grooves.

Individually sealed antiseptic applicators
10668267 · 2020-06-02 · ·

This disclosure describes example applicators and cap devices which may be used in combination with one or more cleansing, antimicrobial and/or antiseptic agents to reduce or eliminate contaminates on a surface. According to some embodiments, the disclosure describes a first cap which may be stored within a cavity of a second cap to create a dual cap device. According to some embodiments, both caps of the dual cap device may be individually sealed with a protective film. According to some embodiments, either a single cap device or a dual cap device may be attached to a flexible substrate by a surface other than the surface having the cavity opening.

Individually sealed antiseptic applicators
10668267 · 2020-06-02 · ·

This disclosure describes example applicators and cap devices which may be used in combination with one or more cleansing, antimicrobial and/or antiseptic agents to reduce or eliminate contaminates on a surface. According to some embodiments, the disclosure describes a first cap which may be stored within a cavity of a second cap to create a dual cap device. According to some embodiments, both caps of the dual cap device may be individually sealed with a protective film. According to some embodiments, either a single cap device or a dual cap device may be attached to a flexible substrate by a surface other than the surface having the cavity opening.

PORTION-WISE FILLING OF A RESERVOIR WITH BULK COMPONETS

A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

PORTION-WISE FILLING OF A RESERVOIR WITH BULK COMPONETS

A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

APPARATUS FOR PACKING ULTRA-SMALL ELECTRONIC DEVICES
20200098614 · 2020-03-26 ·

An apparatus for placing ultra-small electronic devices into pockets on a carrier tape for packing has at least one holding element, a movement mechanism, a conveying mechanism and a positioning mechanism. The positioning mechanism further includes first and second positioning devices coupled to the conveying mechanism, wherein the second positioning device is mounted on the first positioning device. In use, the conveying mechanism conveys the carrier tape to move each pocket to a receiving position and the movement mechanism moves each holding element to place the electronic device into a respective pocket at the receiving position. The positioning mechanism adjusts a relative position between the electronic device and the respective pocket by adjusting the carrier tape, the first and second positioning devices being for coarse and fine positioning of the conveying mechanism respectively.