A method for manufacturing a carrier tape housing electronic components with seal materials includes preparing a tape-shaped main body including housing holes penetrating from one surface to other surface along a longitudinal direction, preparing a tape-shaped seal material including an adhesive layer on the one surface and including pairs of terminal electrodes on the adhesive layer, affixing the adhesive layer to the other surface such that respective portions of the paired terminal electrodes are located within each of the housing holes in a planar view, forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions overlapping with the respective housing holes in a planar view from the other portions, and providing an electronic component into each housing hole and connecting the respective portions of the paired terminal electrodes located within each of the housing holes to the electronic component.

A tape-and-reel system for processing components is disclosed. In the embodiment, the tape-and-reel system includes a first carrier tape reel for holding unloaded carrier tape, a component loading system for loading components into pockets of the unloaded carrier tape, an air-guided cover tape feeder through which cover tape travels, an alignment tool for guiding the cover tape into alignment with the loaded carrier tape and adhering the cover tape to the loaded carrier tape to secure the components into the loaded carrier tape, and a second carrier tape reel for holding the loaded carrier tape.

A tape-and-reel system for processing components is disclosed. In the embodiment, the tape-and-reel system includes a first carrier tape reel for holding unloaded carrier tape, a component loading system for loading components into pockets of the unloaded carrier tape, an air-guided cover tape feeder through which cover tape travels, an alignment tool for guiding the cover tape into alignment with the loaded carrier tape and adhering the cover tape to the loaded carrier tape to secure the components into the loaded carrier tape, and a second carrier tape reel for holding the loaded carrier tape.

An encapsulated electrotextile includes at least one electrotextile strip and at least one elongated wire. The at least one electrotextile strip and the at least one elongated wire are laminated between two encapsulation films.

The disclosure is directed to apparatus and methods for detection of out of position (OOP) components in a carrier tape forming machine. An apparatus includes cross track sensors coupled to the bus interface circuitry, the cross track sensors configured to detect OOP components prior to overlaying the components on the carrier tape with cover tape, optical sensors to detect the OOP components on the carrier tape after overlaying with cover tape and prior to sealing and to detect reflections from OOP components seated on the carrier tape, an amplifier coupled to the optical sensors to amplify signals generated by the optical sensors and set a range for determining whether the components are OOP, and relays to receive indications of detected OOP components, and a controller coupled to the relays to stop the carrier tape forming machine as a function of signals received by the relays.

A process for a continuous production of an encapsulated component web by conveying at least two continuous encapsulation films along a longitudinal axis of a production line with at least one of the two continuous encapsulation films having an adhesive layer on an inner face thereof; inserting at least one encapsulatable component between the two continuous encapsulation films; conveying an assembly including the two continuous encapsulation films with the at least one encapsulatable component extending therebetween in a nip defined in between at least two contiguous rolls; and laminating the assembly to encapsulate the at least one encapsulatable component between the two continuous encapsulation films. There is also provided an apparatus for carrying out the process.

A method for manufacturing a carrier tape housing electronic components with seal materials includes preparing a tape-shaped main body including housing holes penetrating from one surface to other surface along a longitudinal direction, preparing a tape-shaped seal material including an adhesive layer on the one surface and including pairs of terminal electrodes on the adhesive layer, affixing the adhesive layer to the other surface such that respective portions of the paired terminal electrodes are located within each of the housing holes in a planar view, forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions overlapping with the respective housing holes in a planar view from the other portions, and providing an electronic component into each housing hole and connecting the respective portions of the paired terminal electrodes located within each of the housing holes to the electronic component.

A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

A component conveyance disk of a taping apparatus has a plurality of component transport units at an equiangular interval. Each component transport unit is formed of three component transport grooves in a peripheral portion of the component conveyance disk. Width direction centerlines of the respective component transport grooves are parallel to each other, with a portion thereof in a direction along the width direction centerlines opening toward a component storage chamber. Dimensions along the width direction centerlines of the opened portion of the respective component transport grooves are shorter than a length of the component. In addition, the respective component transport grooves have component guides that guide the components into the respective component transport grooves.