Described herein is a packaging system comprising a sleeve having a plurality of sides, an open top, and an open bottom, each of the sides having an inner surface, an inner liner located on the inner surfaces of the sides of the sleeve, the inner liner having an inner surface that defines a cavity, a plurality of building panels located in the cavity, and an outer wrapping surrounding at least a portion of the sleeve and at least a portion of the plurality of building panels.

Described herein is a packaging system comprising a sleeve having a plurality of sides, an open top, and an open bottom, each of the sides having an inner surface, an inner liner located on the inner surfaces of the sides of the sleeve, the inner liner having an inner surface that defines a cavity, a plurality of building panels located in the cavity, and an outer wrapping surrounding at least a portion of the sleeve and at least a portion of the plurality of building panels.

A crate apparatus can at least partially contain and protect articles that may be artificial stone slabs. The crate apparatus can include a crate and one or more partitions mounted to the crate and at least partially positioned in the interior of the crate. The partitions can extend crosswise to, and be spaced apart from one another in, an upright direction. The partitions and holes therein can be cooperatively configured to at least partially define upright receptacles for respectively receiving the articles. The upright receptacles and/or articles therein can extend vertically or be in an inclined configuration.

A crate apparatus can at least partially contain and protect articles that may be artificial stone slabs. The crate apparatus can include a crate and one or more partitions mounted to the crate and at least partially positioned in the interior of the crate. The partitions can extend crosswise to, and be spaced apart from one another in, an upright direction. The partitions and holes therein can be cooperatively configured to at least partially define upright receptacles for respectively receiving the articles. The upright receptacles and/or articles therein can extend vertically or be in an inclined configuration.

A transportation system for semiconductor substrates includes a tray, lid and packaging bag. The tray includes a bottom and circumferential sidewalls. The tray has an opening on a top side and is configured to receive semiconductor substrates through the opening, the substrates being stacked onto each other in the tray in parallel to the tray bottom. The lid includes a cover plate and at least two arms extending from the plate. The arms are configured to be inserted into the tray between the tray sidewalls and the semiconductor substrates. The cover plate is configured to cover the tray opening when the lid is fully mounted to the tray. The packaging bag is configured to enclose the tray with the substrates stacked therein and lid arranged thereon, and to be evacuated of air and sealed such that the tray and lid arranged in the bag are vacuum sealed inside the bag.

A transportation system for semiconductor substrates includes a tray, lid and packaging bag. The tray includes a bottom and circumferential sidewalls. The tray has an opening on a top side and is configured to receive semiconductor substrates through the opening, the substrates being stacked onto each other in the tray in parallel to the tray bottom. The lid includes a cover plate and at least two arms extending from the plate. The arms are configured to be inserted into the tray between the tray sidewalls and the semiconductor substrates. The cover plate is configured to cover the tray opening when the lid is fully mounted to the tray. The packaging bag is configured to enclose the tray with the substrates stacked therein and lid arranged thereon, and to be evacuated of air and sealed such that the tray and lid arranged in the bag are vacuum sealed inside the bag.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.