The invention provides a method of manufacturing packaging comprising the steps of: a) providing a packaging material (2) comprising cartonboard, semi-rigid plastics or other semi-rigid packaging material; b) forming fold lines (8) and/or cuts within the packaging material (2) by subjecting the packaging material (2) to laser (12) or mechanical scoring; c) folding the packaging material (2) along the fold lines (8) and/or cuts and securing in position to form a substantially tubular container (200); and d) forming at least one seal (302, 304) by sealing together at least two opposing regions (122, 124, 126, 128) of a blank (4) to form an at least partially sealed package (300); e) performing at least one of steps b), c) and d) on a horizontal or vertical fill, form and seal apparatus (400).

The invention provides a method of manufacturing packaging comprising the steps of: a) providing a packaging material (2) comprising cartonboard, semi-rigid plastics or other semi-rigid packaging material; b) forming fold lines (8) and/or cuts within the packaging material (2) by subjecting the packaging material (2) to laser (12) or mechanical scoring; c) folding the packaging material (2) along the fold lines (8) and/or cuts and securing in position to form a substantially tubular container (200); and d) forming at least one seal (302, 304) by sealing together at least two opposing regions (122, 124, 126, 128) of a blank (4) to form an at least partially sealed package (300); e) performing at least one of steps b), c) and d) on a horizontal or vertical fill, form and seal apparatus (400).

The disclosure provides a water soluble film suitable for thermoforming deep-drawn profiles, the film including a mixture of a water soluble polyvinyl alcohol (PVOH) resin and a plasticizer, and the film being characterized by a storage modulus at 90° C. less than 1.5×10.sup.8. The disclosure further provides a thermoformed article comprising the water soluble film according to the disclosure.

The disclosure provides a water soluble film suitable for thermoforming deep-drawn profiles, the film including a mixture of a water soluble polyvinyl alcohol (PVOH) resin and a plasticizer, and the film being characterized by a storage modulus at 90° C. less than 1.5×10.sup.8. The disclosure further provides a thermoformed article comprising the water soluble film according to the disclosure.

A child resistant blister pack includes a blister layer which includes one or more blister cavities for receiving a product. A frangible retaining layer is attached to the blister layer over the blister cavities to retain the product within the blister cavities. A first backing layer is attached to the retaining layer on a side opposite the blister layer. The first backing layer has one or more lines of weakness aligned with the blister cavities. A second backing layer is attached to the first backing layer on a side opposite the retaining layer. The second backing layer has a plurality of removable sections. At least two removable sections are arranged over each line of weakness in the underlying first backing layer.

A child resistant blister pack includes a blister layer which includes one or more blister cavities for receiving a product. A frangible retaining layer is attached to the blister layer over the blister cavities to retain the product within the blister cavities. A first backing layer is attached to the retaining layer on a side opposite the blister layer. The first backing layer has one or more lines of weakness aligned with the blister cavities. A second backing layer is attached to the first backing layer on a side opposite the retaining layer. The second backing layer has a plurality of removable sections. At least two removable sections are arranged over each line of weakness in the underlying first backing layer.

Provided are a display panel, a backward diode equipped on a bottom surface of the display panel, a packaging film for packaging the backward diode, and a pressure-sensitive adhesive layer formed between the display panel and the packaging film. The packaging film includes a first region corresponding to a top surface of the backward diode, and a second region extending from the first region and corresponding to a side surface of the backward diode. Due to the display device, a bezel region can be minimized.

Provided are a display panel, a backward diode equipped on a bottom surface of the display panel, a packaging film for packaging the backward diode, and a pressure-sensitive adhesive layer formed between the display panel and the packaging film. The packaging film includes a first region corresponding to a top surface of the backward diode, and a second region extending from the first region and corresponding to a side surface of the backward diode. Due to the display device, a bezel region can be minimized.

Methods and packages for storing film strips while reducing or eliminating stress cracking during storage, including use of packages having an inner surface made from polymeric materials exhibiting various physical properties and including films and pouches that are annealed.

Methods and packages for storing film strips while reducing or eliminating stress cracking during storage, including use of packages having an inner surface made from polymeric materials exhibiting various physical properties and including films and pouches that are annealed.