Patent classifications
B65D2213/02
CUSHION STRUCTURE AND PACKAGING ASSEMBLY
A cushion structure for use with a packaging case provides cushion and protection of an object. The cushion structure includes a first member and a second member. The first member is configured to snuggly receive the object; the second member is configured to be mounted onto a case body of the packaging case; and the first member and the second member are detachably coupled.
Container
A closable and sealable, preferably thermoplastic plastic container (1) for storing, transporting and dispensing a powdery or granular polypeptide, said container comprising a circumferential wall (2) having an upper end and a lower end and at the lower end joining a closed bottom wall (7) and being at the upper end provided with a closable outlet member (16) having an outlet opening, the container having an inner surface and an outer surface, the inner surface being an antistatic surface adapted to be in contact with the polypeptide.
MAGNETIC SHIELD TRAY, MAGNETIC SHIELD WRAPPER AND MAGNETIC MEMORY PRODUCT SHIELDED FROM EXTERNAL MAGNETIC FIELD
According to an embodiment, a magnetic shield tray includes a main body with a plate form including a magnetic material, and mount portions as holes disposed in the main body. The magnetic material is exposed on an inner surface of the holes.
Method for making static-dissipative composite structure with exposed conductive fiber
Provided is a method for making a composite structure with exposed conductive fibers. The exposed conductive fibers can be used for static dissipation. In the present method, a liquid, gum, gel, or impermeable film mask is applied to the conductive fiber material. The mask functions to prevent infiltration of curable liquid resin into the conductive fiber material. The masked conductive fiber material is incorporated into the composite structure, along with structural fiber material. The liquid resin is cured. The mask material and cured resin are removed from the masked areas, thereby exposing the conductive fiber material. The exposed conductive fiber material can collect and drain electrostatic charges. The present method can be used to make storage tanks and other objects that require electrostatic charge dissipation.
PACKAGE FOR PELLETS OF SAPONIFIED ETHYLENE-VINYL ESTER-BASED COPOLYMER OR RESIN COMPOSITION THEREOF
The purpose of the invention is to provide: a package for EVOH resin pellets which is capable of providing the EVOH resin pellets almost free from powder even in a case where the package contains the powder generated therein during transportation or the like after shipment; and EVOH resin pellets contaminated with very small amount of the powder in a case where a user uses the EVOH resin pellets as a molding material. A package, where pellets each having a substantially circular or oval cross-section are packed in a packaging container whose inner surface has a surface resistivity of 1.010.sup.14 or more, is capable of providing pellets to which 0.8 wt % or less of powder adhered relative to the weight of the pellets.
ANTISTATIC COATINGS FOR PLASTIC VESSELS
A method of reducing static charge of a plastic container is provided. The method includes providing a PECVD coating of SiCOH, SiO.sub.x or SiOH to an external support surface of the container. The PECVD coating reduces static charge of the container compared to a reference container that is essentially identical to the container except that the reference container is uncoated.
MULTI-LAYER FOAM SHEET AND INTERLEAF SHEET FOR GLASS PLATES
A multi-layer foam sheet with an apparent density of 30 to 300 kg/m.sup.3 and a thickness of 0.05 to 2 mm, including a foam layer containing a polyethylene-based resin (A), and an antistatic layer fusion-laminated by coextrusion on each of both sides of the foam layer. The antistatic layer has a basis weight of 1 to 10 g/m.sup.2 and contains a polyethylene-based resin (B), a polystyrene-based resin, a styrenic elastomer, and a polymeric antistatic agent, with the polystyrene-based resin being contained in the antistatic layer in an amount of 15 to 70% by weight.