B65G47/34

TRAY RETURN MODULE FOR AN INSPECTION FACILITY, AND INSPECTION FACILITY COMPRISING AT LEAST ONE SUCH MODULE
20230286753 · 2023-09-14 ·

The application relates to a tray return module for an inspection facility extending between a public area for deposit of personal belongings of travelers and a secure area for recovery of these belongings, this module including an opening for receiving the trays, means for returning the trays towards the deposit zone, and means for transferring the trays from the opening to the return means, wherein the transfer means include a plurality of transfer rollers with helical thread capable of engaging with the edges of the trays and arranged between the receiving opening and the return means.

TRAY RETURN MODULE FOR AN INSPECTION FACILITY, AND INSPECTION FACILITY COMPRISING AT LEAST ONE SUCH MODULE
20230286753 · 2023-09-14 ·

The application relates to a tray return module for an inspection facility extending between a public area for deposit of personal belongings of travelers and a secure area for recovery of these belongings, this module including an opening for receiving the trays, means for returning the trays towards the deposit zone, and means for transferring the trays from the opening to the return means, wherein the transfer means include a plurality of transfer rollers with helical thread capable of engaging with the edges of the trays and arranged between the receiving opening and the return means.

Tie plate dispenser and method therefore
11772903 · 2023-10-03 · ·

Present embodiments relate to a tie plate dispenser which aligns tie plates for dispensing based on rail base rather than outer edges of the tie plate. Thus tie plates are aligned and located in a differing manner than prior art systems. Further, the tie plate dispenser includes an opening over which a magnet is disposed to retain a tie plate over the opening. The tie plate over the opening may be selectively released by disengaging the tie plate from the magnet.

Tie plate dispenser and method therefore
11772903 · 2023-10-03 · ·

Present embodiments relate to a tie plate dispenser which aligns tie plates for dispensing based on rail base rather than outer edges of the tie plate. Thus tie plates are aligned and located in a differing manner than prior art systems. Further, the tie plate dispenser includes an opening over which a magnet is disposed to retain a tie plate over the opening. The tie plate over the opening may be selectively released by disengaging the tie plate from the magnet.

TIE PLATE DISPENSER AND METHOD THEREFORE
20220411199 · 2022-12-29 ·

Present embodiments relate to a tie plate dispenser which aligns tie plates for dispensing based on rail base rather than outer edges of the tie plate. Thus tie plates are aligned and located in a differing manner than prior art systems. Further, the tie plate dispenser includes an opening over which a magnet is disposed to retain a tie plate over the opening. The tie plate over the opening may be selectively released by disengaging the tie plate from the magnet.

TIE PLATE DISPENSER AND METHOD THEREFORE
20220411199 · 2022-12-29 ·

Present embodiments relate to a tie plate dispenser which aligns tie plates for dispensing based on rail base rather than outer edges of the tie plate. Thus tie plates are aligned and located in a differing manner than prior art systems. Further, the tie plate dispenser includes an opening over which a magnet is disposed to retain a tie plate over the opening. The tie plate over the opening may be selectively released by disengaging the tie plate from the magnet.

CLEANING SYSTEM FOR TRAYS USED FOR HANDLING SEMICONDUCTOR PACKAGES

An automated system cleans trays used in handling circuit device packages is provided in a sequential manner with pressurized air in a cleaning chamber, and a vacuum system is operated to remove the contamination (e.g. metal fibers) from the cleaning chamber. The system can convey trays in a sequential manner from one or more stacks of trays at associated tray loading stations into one or more associated cleaning chambers, and convey the cleaned trays from the one or more cleaning chambers to one or more associated tray unloading stations, where the cleaned trays are stacked. The system can handle approximately 30,000 trays per day.

CLEANING SYSTEM FOR TRAYS USED FOR HANDLING SEMICONDUCTOR PACKAGES

An automated system cleans trays used in handling circuit device packages is provided in a sequential manner with pressurized air in a cleaning chamber, and a vacuum system is operated to remove the contamination (e.g. metal fibers) from the cleaning chamber. The system can convey trays in a sequential manner from one or more stacks of trays at associated tray loading stations into one or more associated cleaning chambers, and convey the cleaned trays from the one or more cleaning chambers to one or more associated tray unloading stations, where the cleaned trays are stacked. The system can handle approximately 30,000 trays per day.

Systems and methods for dynamic processing of objects

A method of processing objects is disclosed using a programmable motion device. The method includes the steps of acquiring an object from a plurality of mixed objects at an input area, perceiving identifying indicia in connection with the object, assigning an intermediate station to a destination location for the object responsive to the identifying indicia in connection with the object, and moving the acquired object toward the intermediate station.

Systems and methods for dynamic processing of objects

A method of processing objects is disclosed using a programmable motion device. The method includes the steps of acquiring an object from a plurality of mixed objects at an input area, perceiving identifying indicia in connection with the object, assigning an intermediate station to a destination location for the object responsive to the identifying indicia in connection with the object, and moving the acquired object toward the intermediate station.