An optical fiber winding mechanism feeds an optical fiber from raw material bobbins and winds the optical fiber around a winding bobbin, and includes a first raw material bobbin-side unit to mount the first raw material bobbin thereon, a second raw material bobbin-side unit to mount the second raw material bobbin thereon, a winding bobbin-side unit to mount the winding bobbin thereon, and a controller to control each of the units. The first raw material bobbin-side unit includes a body device, a head capable of rotating with respect to the body device, a rotation assist device capable of engaging with the head, a rotation mechanism capable of rotating the body device around a Z direction, and a slide mechanism capable of moving the rotation mechanism.

A method of and apparatus for the rapid deployment of a fracturing water transferring system, along with the rapid picking up and storage of such system after use. In different embodiments the method in includes the use of a tensioning system to retrieve one or more segments of lay flat hose.

A method of and apparatus for the rapid deployment of a fracturing water transferring system, along with the rapid picking up and storage of such system after use. In different embodiments the method in includes the use of a tensioning system to retrieve one or more segments of lay flat hose.

A method of reducing entanglement of wires includes receiving from a wire feed system of a wire processing machine a first wire on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire. In addition, the method includes receiving from the wire feed system a second wire at least partially on top of the first wire, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire and the second wire. The method also includes moving the second wire relative to the first wire, and reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.

A method of reducing entanglement of wires includes receiving from a wire feed system of a wire processing machine a first wire on a tray surface providing a wire-to-surface coefficient of friction between the tray surface and the first wire. In addition, the method includes receiving from the wire feed system a second wire at least partially on top of the first wire, the wire-to-surface coefficient of friction being higher than a wire-to-wire coefficient of friction between the first wire and the second wire. The method also includes moving the second wire relative to the first wire, and reducing movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire due to the wire-to-surface coefficient of friction being higher than the wire-to-wire coefficient of friction.

A method of reducing entanglement of wires includes receiving, at a tray, one or more first wires of a first wire group from a wire feed system of a wire processing machine. In addition, the method includes receiving, at the tray, one or more second wires of a second wire group from the wire feed system after receiving the first wire group at the tray. The method further includes physically separating, using a separator device associated with the tray, at least a portion of the first wire group from the second wire group. The method also includes moving the second wire group relative to the first wire group, reducing movement of at least a portion of the first wire group relative to a tray surface during movement of the second wire group relative to the first wire group.

A method of reducing entanglement of wires includes receiving, at a tray, one or more first wires of a first wire group from a wire feed system of a wire processing machine. In addition, the method includes receiving, at the tray, one or more second wires of a second wire group from the wire feed system after receiving the first wire group at the tray. The method further includes physically separating, using a separator device associated with the tray, at least a portion of the first wire group from the second wire group. The method also includes moving the second wire group relative to the first wire group, reducing movement of at least a portion of the first wire group relative to a tray surface during movement of the second wire group relative to the first wire group.

A method for operating a textile machine is provided to produce roving from a fiber bundle with a consolidating means, the roving having a protective twist. The produced roving is wound onto a tube with a winding device. During the winding process, the roving is guided a guide element arranged between the consolidating means and the tube, wherein the guide element exerts a decelerating effect on the roving. The decelerating effect is controlled during operation of the textile machine such that the decelerating effect is lower during a start procedure while the roving leaving the consolidating means is brought into contact with a tube or during a tube change while a wound tube is replaced by an empty tube than during a winding process that takes place between the start procedure and the tube change.

A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.

A wire processing system includes a tray having at least one tray surface configured to sequentially receive a first wire and a second wire from a wire feed system of a wire processing machine. The tray surface has a surface feature configured to provide a wire-to-surface coefficient of friction between the tray surface and the first wire higher than a wire-to-wire coefficient of friction between the first wire and the second wire laying on top of the first wire. The wire-to-surface coefficient of friction reduces movement of at least a portion of the first wire relative to the tray surface during movement of the second wire relative to the first wire.