B81B1/002

SUBSTRATE ASSEMBLY AND RELATED METHODS

Example sensor apparatus for microfluidic devices and related methods are disclosed. In examples disclosed herein, a method of fabricating a sensor apparatus for a microfluidic device includes etching a portion of an intermediate layer to form a sensor chamber in a substrate assembly, where the substrate assembly has a base layer and the intermediate layer, and where the base layer comprises a first material and the intermediate layer comprises a second material different than the first material. The method includes forming a first electrode and a second electrode in the sensor chamber. The method also includes forming a fluidic transport channel in fluid communication with the sensor chamber, where the fluidic transport channel comprises a third material different than the first material and the second material.

Nanochannel arrays and their preparation and use for high throughput macromolecular analysis

Nanochannel arrays that enable high-throughput macromolecular analysis are disclosed. Also disclosed are methods of preparing nanochannel arrays and nanofluidic chips. Methods of analyzing macromolecules, such as entire strands of genomic DNA, are also disclosed, as well as systems for carrying out these methods.

MICROFLUIDIC DEVICE WITH CAPILLARY CHAMBER

Examples include microfluidic devices. Example microfluidic devices comprise a microfluidic channel, a capillary chamber, and a fluidic actuator. The microfluidic channel is fluidly connected to the capillary chamber. The capillary chamber is to restrict flow of fluid therethrough. The fluidic actuator is positioned proximate the capillary chamber. The fluidic actuator is to actuate to thereby initiate flow of fluid through the capillary chamber.

Nanochannel arrays and their preparation and use for high throughput macromolecular analysis

Nanochannel arrays that enable high-throughput macromolecular analysis are disclosed. Also disclosed are methods of preparing nanochannel arrays and nanofluidic chips. Methods of analyzing macromolecules, such as entire strands of genomic DNA, are also disclosed, as well as systems for carrying out these methods.

SHEAR WAVE MODE PIEZOELECTRIC RESONATOR
20240278285 · 2024-08-22 ·

According to an aspect, there is provided a structure for a thin-film bulk acoustic resonator. The structure comprises a substrate (101) comprising a cavity (104) having at least one slanted flat surface (103) facing away from the cavity and a piezoelectric bulk material layer (102) deposited on said at least one slanted flat surface.

BIOMATERIAL DETECTION SENSOR AND METHOD OF MANUFACTURING THE SAME

The present disclosure provides methods and apparatuses for biomaterial detection sensors. In some embodiments, a biomaterial detection sensor includes a membrane including a plurality of wells. Each of the plurality of wells is configured to encapsulate a biomaterial contained in a sample solution. A surface of the membrane is selectively modified into at least one of a hydrophilic surface and a hydrophobic surface. In some embodiments, a method of manufacturing a biomaterial detection sensor includes depositing a first membrane and a second membrane on respective surfaces of a wafer, forming a window by etching the first membrane and the first surface of the wafer, forming a plurality of wells on the second membrane, modifying a surface of the second membrane into at least one of a hydrophilic surface and a hydrophobic surface; and transferring a two-dimensional graphene oxide material onto a bottom of each of the plurality of wells.

Extremal microstructured surfaces
12060261 · 2024-08-13 · ·

The present application relates to multifunctional hierarchically microstructured surfaces and three-dimensional anchored interfacial domain structures. The multifunctional properties are extremal. In one aspect the microstructured surfaces may be super-adhesive. Examples of super-adhesive mechanisms may include gas trapping, fluid trapping, and solid wrinkle trapping. In another aspect the micro structured surfaces may be nearly adhesive-less. Examples of adhesive-less mechanisms may include inter-solid surface lubrication, energy conserving fluid flows, and super-low drag phase-phase lateral displacement. The extremal structures may be obtained by anchoring mechanisms. Examples of anchoring mechanisms may include Wenzel-Cassie formation, contact angle confusion, and capillary effects.

Micro-electro-mechanical-system structures and applications thereof

A Micro-Electro-Mechanical-System (MEMS) device and a method for operating the device are disclosed. The device includes a substrate platform and an electrode plate having a plurality of serpentine arms, the electrode plate attached to the substrate platform via the plurality of serpentine arms, the electrode plate provided on a plane in a resting position. The device includes a sharp member disposed substantially perpendicularly on the electrode plate. In various implementations, the electrode plate and the substrate platform are co-planar. In various implementations, the electrode plate is configured to move in a direction perpendicular to the plane away from the resting position. The device also includes a counter-electrode. The method of operating the device includes supplying, via a power source, a direct current (DC) across the electrode and the counter-electrode to generate an electrostatic field across the electrode and the counter-electrode of the device.

MEMS gas chromatograph and method of forming a separator column for a MEMS gas chromatograph

A micro gas chromatograph includes one or more separator columns formed within a device layer. The separator columns have small channel cross sections and long channel lengths with atomic-smooth channel sidewalls enabling a high channel packaging density, multiple channels positioned on top of each other, and channel segments that are thermally decoupled from the substrates. The micro gas-chromatograph also enables electrostatic and thermal actuators to be positioned in close proximity to the separator columns such that the material passing through the columns is one or more of locally heated, locally cooled, and electrically biased.

SEMICONDUCTOR ELEMENT AND METHODS FOR MANUFACTURING THE SAME

A semiconductor element includes a processed substrate arrangement including a processed semiconductor substrate and a metallization layer arrangement on a main surface of the processed semiconductor substrate. The semiconductor element further includes a passivation layer arranged at an outer border of the processed substrate arrangement.