B81B3/0018

Method for producing a micromechanical component with an exposed pressure sensor device and micromechanical component

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.

Micromechanical actuator device and method for tilting a micromechanical actuator device

An actuator device and a method for tilting an actuator device. The method includes the steps: conducting electrical current through an electrical conduction device, which is guided via a tilting device of the actuator device, within a first magnetic field that is generated by a permanent magnet device of the actuator device, so that an actuator element of the tilting device is tilted along a first tilting axis as the result of a Lorentz force; and generating a second magnetic field by an electromagnet device of the actuator device in the area of the permanent magnet device, so that the tilting device is tilted along a second tilting axis as the result of magnetic attraction and repulsion.

Piezoelectric micro-electro-mechanical actuator device, movable in the plane

A MEMS actuator device of a piezoelectric type formed on a substrate, with a base unit including a base beam element having a main extension in a extension plane and a thickness in a thickness direction perpendicular to the extension plane, smaller than the main extension. A piezoelectric region extends over the beam element. An anchor region is rigid to the base beam element and to the substrate. A base constraint structure is connected to one end of the base beam element and is configured to allow a deformation of the base beam element in the extension plane and substantially reduce a deformation of the base beam element in the thickness direction.

DISTRIBUTING LIDAR SYSTEM COMPONENTS
20200249324 · 2020-08-06 · ·

In some embodiments, a LIDAR system may include at least one processor configured to control at least one light source for projecting light toward a field of view and receive from at least one first sensor first signals associated with light projected by the at least one light source and reflected from an object in the field of view, wherein the light impinging on the at least one first sensor is in a form of a light spot having an outer boundary. The processor may further be configured to receive from at least one second sensor second signals associated with light noise, wherein the at least one second sensor is located outside the outer boundary; determine, based on the second signals received from the at least one second sensor, an indicator of a magnitude of the light noise; and determine, based on the indicator the first signals received from the at least one first sensor and, a distance to the object.

AGGREGATING PIXEL DATA ASSOCIATED WITH MULTIPLE DISTANCES TO IMPROVE IMAGE QUALITY
20200249349 · 2020-08-06 · ·

A LIDAR system may include a processor configured to control a LIDAR light source in a manner enabling light flux to vary over scans of a field of view (FOV). The FOV may include foreground and background areas. The processor may be further configured to receive from a detector input signals indicative of light reflected from the FOV. A representation of a portion of the FOV associated with pixels may be constructible from the input signals associated with a first pixel that covers a portion of the foreground area, a second pixel that covers a portion of the foreground area and a portion of the background area, and a third pixel that covers a portion of the background area. The processor may be further configured to determine a distance to a first object located in the foreground area and a distance to a second object located in the background area.

BINNING AND NON-BINNING COMBINATION

A LIDAR system may include a processor configured to control a LIDAR light source for illuminating a field of view (FOV), receive, from a group of light detectors, input signals indicative of reflections of light from objects in the FOV, and process a first subset of the input signals associated with a first region of the FOV to detect a first object in the first region. The processor may also process a second subset of the input signals associated with a second region of the FOV to detect a second object in the second region. The second object may be located at a greater distance from the light source than the first object.

Double-membrane MEMS Component and Production Method for a Double-membrane MEMS Component

A production method for a double-membrane MEMS component includes: providing a layer arrangement on a carrier substrate, wherein the layer arrangement comprises a first membrane structure, a sacrificial material layer adjoining the first membrane structure, and a counterelectrode structure in the sacrificial material layer and at a distance from the first membrane structure, wherein at least one through opening is formed in the sacrificial material layer as far as the first membrane structure; forming a filling material structure in the at least one through opening by applying a first filling material layer on the wall region of the at least one through opening; applying a second membrane structure on the layer arrangement with the sacrificial material; and removing the sacrificial material from an intermediate region to expose the filling material structure in the intermediate region.

Integrating nanopore sensors within microfluidic channel arrays using controlled breakdown

Nanopore arrays are fabricated by controlled breakdown in solid-state membranes integrated within polydimethyl-siloxane (PDMS) microfluidic devices. This technique enables the scalable production of independently addressable nanopores. By confining the electric field within the microfluidic architecture, nanopore fabrication is precisely localized and electrical noise is significantly reduced during sensing.

METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT WITH AN EXPOSED PRESSURE SENSOR DEVICE AND MICROMECHANICAL COMPONENT

A method for manufacturing a micromechanical component having a disengaged pressure sensor device includes: configuring an electrically conductive sacrificial element in or on a first outer surface of a first substrate; applying a second substrate on or upon the outer surface of the first substrate over the sacrificial element; configuring a pressure sensor device by anodic etching of the second substrate; configuring in the second substrate at least one trench that extends to the sacrificial element; and at least partly removing the sacrificial element in order to disengage the pressure sensor device.

MICROMECHANICAL COMPONENT FOR A CAPACITIVE PRESSURE SENSOR DEVICE

A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.