A MEMS device formed by a substrate, having a surface; a MEMS structure arranged on the surface; a first coating region having a first Young's modulus, surrounding the MEMS structure at the top and at the sides and in contact with the surface of the substrate; and a second coating region having a second Young's modulus, surrounding the first coating region at the top and at the sides and in contact with the surface of the substrate. The first Young's modulus is higher than the second Young's modulus.

The disclosure describes a z-axis gyroscope where a proof mass is suspended from a peripheral suspender and a central suspender. The peripheral suspender forms a truncated triangle around the proof mass, and the central suspender extends through the truncated corner of the triangle formed by the peripheral suspender. The proof mass is driven into a primary oscillation mode by one or more piezoelectric drive transducers located on the peripheral suspender. One or more piezoelectric sense transducers located on the base of the peripheral suspender are configured to detect the secondary oscillation mode of the proof mass.

Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.

Systems and methods for fabricating 3D soft microstructures. The system comprises injecting a pressurized, curable liquid into certain structural layers induces folding and allows the 2D structures to reconfigure into a 3D form In addition to the injection of a curable liquid that permanently reconfigures the structure of the system, in an embodiment this method also allows for the injection of other liquids into certain actuator layers that enable motion in certain portions of the system Furthermore, the system allows for handling of colored fluids that are passed to visualization layers. The method of creating such a system depends on taking advantage of laser machining of the individual layers to influence the behavior of how different portions bend and move.

Circuits and methods for compensating microelectromechanical system (MEMS) gyroscopes for quality factor variations are described. Quality factor variations arise when mechanical losses are introduced in the gyroscope's resonator, for example due to thermoelastic damping or squeeze-film damping, which may hinder the gyroscope's ability to accurately sense angular velocity. Quality factor compensation may be performed by generating a compensation signal having a time decay rate that depends on the quality factor of resonator. In this way, artifacts that may otherwise arise in gyroscope's output are limited. Additionally, or alternatively, quality factor compensation may be performed by controlling the force with which the gyroscope's resonator is driven. This may be achieved, for example, by controlling the average value of the drive signal.

A MEMS speaker including a base, a circuit board, a spacing layer, a vibration mold, and at least one actuator. The base has a first chamber. The circuit board is disposed on the base, and has at least one support portion and a fixing portion disposed around the support portion. The at least one support portion has a first perforation, and a plurality of second perforations are formed between the at least one support portion and the fixing portion. The spacing layer is disposed on the circuit board. A second chamber is formed between the spacing layer and the circuit board. The vibration mold is disposed on the spacing layer. The actuator is disposed on the support portion of the circuit board. The actuator has a shift part and a deformation part disposed above the first perforation of the support portion. The second perforations communicate with the first chamber and the second chamber.

An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.

A physical quantity sensor includes: a detection element that outputs a sensor signal in accordance with a physical quantity; and a mount member. The detection element includes a sensor portion that has a first surface, includes a movable electrode, and a fixed electrode, and outputs the sensor signal, and a cap portion that has a first surface and is bonded with the sensor portion. Each of the first surface of the sensor portion and the first surface of the cap portion is mounted on the mount member, and the detection element detects the physical quantity. An electrode, which is connected with the movable electrode and connected with a circuit portion, and an electrode, which is connected with the fixed electrode and connected with the circuit portion, are provided on a side surface continued to the first surface of the cap portion.

A microelectromechanical structure, including a functional element situated in a cavity of the microelectromechanical structure. The functional element includes an aluminum nitride layer. The cavity is closed by a cap layer. The cap layer includes epitaxial silicon. A method for manufacturing a micromechanical structure is also described.

A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.