A method of manufacturing a plurality of resonators, each formed by a membrane sealing a cavity, includes forming a plurality of cavities starting from one face called the front face of a support substrate, the plurality of cavities comprising central cavities and peripheral cavities arranged around the assembly formed by the central cavities, and forming central membranes and peripheral membranes covering the central cavities and peripheral cavities, respectively, by the transfer of a coverage film on the front face of the support substrate. At least part of the peripheral membranes is removed.

A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.

A sensor includes a movable element adapted for rotational motion about a rotational axis due to acceleration along an axis perpendicular to a surface of a substrate. The movable element includes first and second ends, a first section having a first length between the rotational axis and the first end, and a second section having a second length between the rotational axis and the second end that is less than the first length. A motion stop extends from the second end of the second section. The first end of the first section includes a geometric stop region for contacting the surface of the substrate at a first distance away from the rotational axis. The motion stop for contacting the surface of the substrate at a second distance away from the rotational axis. The first and second distances facilitate symmetric stop performance between the geometric stop region and the motion stop.

Embodiments of the disclosure include a method of scanning mirror assembly for an optical sensing system. The method may include bonding a first wafer that includes a handle to a second wafer that includes a scanning mirror layer and etching the first wafer to release the handle. The method may further include bonding a third wafer that includes an actuator layer to the second wafer, and etching the third wafer to form a first set of actuator features and a second set of actuator features from the actuator layer. The method may also include etching the second wafer to release the scanning mirror layer.

A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

Embodiments of the disclosure provide systems and methods for incorporating an optical sensing system in a MEMS package for real-time sensing of angular position of a MEMS mirror. The system may include an optical source configured to emit an optical signal to a backside of the MEMS mirror. The system may also include an optical detector configured to receive a returning optical signal reflected by the backside of the MEMS mirror. The system may further include at least one controller. The at least one controller may be configured to determine a scanning angle of the MEMS mirror based on a position on the optical detector where the returning optical signal is received.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a MEMS die located within a substrate, and below a processor die. In selected examples, the MEMS die includes a resonator. Example methods of forming MEMS resonator devices are also shown.

Embodiments of the disclosure include a scanning mirror assembly for an optical sensing system. The scanning mirror assembly may include a scanning mirror formed in a first layer of the scanning mirror assembly. The scanning mirror assembly may also include a MEMS actuator formed in a second layer of the scanning mirror assembly, where the first layer is a predetermined distance above the second layer. The MEMS actuator may also include a plurality of stator actuator features and a plurality of rotatable actuator features formed from a same semiconductor layer during a fabrication process.

A MEMS inertial sensor includes a supporting structure and an inertial structure. The inertial structure includes at least one inertial mass, an elastic structure, and a stopper structure. The elastic structure is mechanically coupled to the inertial mass and to the supporting structure so as to enable a movement of the inertial mass in a direction parallel to a first direction, when the supporting structure is subjected to an acceleration parallel to the first direction. The stopper structure is fixed with respect to the supporting structure and includes at least one primary stopper element and one secondary stopper element. If the acceleration exceeds a first threshold value, the inertial mass abuts against the primary stopper element and subsequently rotates about an axis of rotation defined by the primary stopper element. If the acceleration exceeds a second threshold value, rotation of the inertial mass terminates when the inertial mass abuts against the secondary stopper element.

The micromirror device includes a mirror part, a first actuator that reciprocally rotates the mirror part about the first axis, and a second actuator that reciprocally rotates the mirror part about the second axis. A resonance frequency Ain a lowest-order resonance mode as a resonance mode in which the mirror part and the first actuator are rotated about the first axis in opposite phases to each other, a resonance frequency B in a lowest-order resonance mode as a resonance mode in which the mirror part and the first actuator oscillate in opposite phases in a direction orthogonal to both of the first axis and the second axis, a frequency difference F=A−B, a resonance frequency C less than F and closest to the F, and a resonance frequency D greater than F and closest to F satisfy F−C≥20 Hz and F−D≤−150 Hz.