A MEMS scanning device may include: a movable MEMS mirror configured to pivot about at least one axis; at least one actuator operable to rotate the MEMS mirror about the at least one axis, each actuator out of the at least one actuator operable to bend upon actuation to move the MEMS mirror; and at least one flexible interconnect element coupled between the at least one actuator and the MEMS mirror for transferring a pulling force of the bending of the at least one actuator to the MEMS mirror. Each flexible interconnect element out of the at least one interconnect element may be an elongated structure comprising at least two turns at opposing directions, each turn greater than 120°.

A scanning device includes a planar scanning mirror disposed within a frame and having a reflective upper surface. A pair of flexures have respective first ends connected to the frame and respective second ends connected to the mirror at opposing ends of a rotational axis of the mirror. A rotor including a permanent magnet is disposed on the lower surface of the mirror. A stator includes first and second cores disposed in proximity to the rotor on opposing first and second sides of the rotational axis and first and second coils of wire wound respectively on the cores. A drive circuit drives the first and second coils with respective electrical currents including a first component selected so as to control a transverse displacement of the mirror and a second component selected so as to control a rotation of the mirror about the rotational axis.

A method of making a piezoelectric sensor includes forming piezoelectric layer(s) to define a beam extending between a proximal portion and a distal end. The method also includes modeling a strain distribution on the beam based on a force applied to the beam, and defining an outer boundary with a shape substantially corresponding to a contour line of the strain distribution on the beam. The method also includes forming an electrode having said outer boundary shape, and attaching the electrode to the beam. The method also includes attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal end of the beam is unsupported.

In some embodiments, a LIDAR system may include at least one processor configured to control at least one light source for projecting light toward a field of view and receive from at least one first sensor first signals associated with light projected by the at least one light source and reflected from an object in the field of view, wherein the light impinging on the at least one first sensor is in a form of a light spot having an outer boundary. The processor may further be configured to receive from at least one second sensor second signals associated with light noise, wherein the at least one second sensor is located outside the outer boundary; determine, based on the second signals received from the at least one second sensor, an indicator of a magnitude of the light noise; and determine, based on the indicator the first signals received from the at least one first sensor and, a distance to the object.

A photoacoustic sensor includes a first MEMS device and a second MEMS device. The first MEMS device includes a first MEMS component including an optical emitter, and a first optically transparent cover wafer-bonded to the first MEMS component, wherein the first MEMS component and the first optically transparent cover form a first closed cavity. The second MEMS device includes a second MEMS component including a pressure detector, and a second optically transparent cover wafer-bonded to the second MEMS component, wherein the second MEMS component and the second optically transparent cover form a second closed cavity.

A micromechanical switch including a first substrate with a micromechanical functional layer in which a deflectable switching element is formed, and with a second substrate that is connected to the first substrate. The second substrate is situated at a distance above the switching element. The switching element includes an electrically conductive first contact area and is deflectable toward the second substrate. The second substrate, at an internal side, includes an electrically conductive second contact area that is situated in such a way that the switching element together with the first contact area may be applied to the second contact area in order to close an electrical contact. A method for manufacturing a micromechanical switch is also described.

A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.

In one example, an apparatus comprises a semiconductor integrated circuit, the semiconductor integrated circuit including a microelectromechanical system (MEMS) device layer and a silicon substrate, the MEMS device layer including at least one micro-mirror assembly, the at least one micro-mirror assembly including a micro-mirror and electrodes. The at least one micro-mirror assembly further includes a light reduction layer on the silicon substrate. A method of fabricating the semiconductor integrated circuit is also provided.

An alternate venting path can be employed in a sensor device for pressure equalization. A sensor component of the device can comprise a diaphragm component and/or backplate component disposed over an acoustic port of the device. The diaphragm component can be formed with no holes to prevent liquid or particles from entering a back cavity of the device, or gap between the diaphragm component and backplate component. A venting port can be formed in the device to create an alternate venting path to the back cavity for pressure equalization for the diaphragm component. A venting component, comprising a filter, membrane, and/or hydrophobic coating, can be associated with the venting port to inhibit liquid and particles from entering the back cavity via the venting port, without degrading performance of the device. The venting component can be designed to achieve a desired low frequency corner of the sensor frequency response.

A method for producing a pressure sensor device. The method includes providing a vessel that includes a cavity having side walls, the cavity including a floor and the side walls each including an upper side, which face away from the floor; providing a pressure sensor and situating the pressure sensor in the cavity and on the floor; filling the cavity with an oil so that the oil fills the cavity up to the upper sides of the side walls; applying a membrane onto the surface of the oil that completely covers the oil, and at least in some regions onto the upper sides of the side walls so that the membrane covers, circumferentially around the cavity, those regions of the upper sides of the side walls that lie against the oil, the membrane including a liquid material when applied onto the oil; and curing the liquid material of the membrane.