A package structure of a micro speaker includes a substrate, a diaphragm, a coil, a carrier board, a lid, a first permanent magnetic element, and a second permanent magnetic element. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The carrier board is disposed on the bottom surface of the substrate. The first permanent magnetic element is disposed on the carrier board and in the hollow chamber. The lid is wrapped around the substrate and the diaphragm. The lid exposes a portion of the top surface of the diaphragm. The second permanent magnetic element is disposed either above the lid or under the lid.

A system includes an array of chemical, pressure, and temperature sensors, and a temporal airflow modulator configured to provide sniffed vapors in a temporally-modulated sequence through a plurality of different air paths across multiple sensor locations.

The present invention relates to a capacitive MEMS gyroscope with drive-signal induced offset cancelling features. In a MEMS gyroscope of the type including force feedback circuitry, the drive signal is modulated according to a known modulation scheme or frequency. The modulation scheme/frequency of the drive signal is used by offset cancelling circuitry to determine the offset in the rate signal caused by the drive signal. The determined offset is subsequently removed from the rate signal.

An optical mirror assembly includes a mirror with a reflective surface and a back surface, opposite the reflective surface. The mirror is tilted around a first axis or a second axis, perpendicular to the first axis. The optical mirror assembly also includes an inverted light emitting device (LED) of a feedback sensor arranged to emit light onto the back surface of the mirror, and four photodiodes of the feedback sensor arranged to receive reflected light resulting from the back surface of the mirror reflecting the light emitted by the inverted LED. Each of the four photodiodes is disposed in a different one of four quadrants defined by the first axis and the second axis and the inverted LED being disposed at a center of the four photodiodes.

A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.

A physical quantity sensor includes a substrate; a movable body that is displaceable about a support axis according to a physical quantity and includes an opening; a support that is provided on the substrate and is located in the opening, and the support includes a first fixed plate and a second fixed plate that are fixed to the substrate and provided so as to sandwich the support axis in plan view; a first beam and a second beam that each connect the first fixed plate with the second fixed plate and are spaced apart from each other; a third beam extending in a direction of the support axis and connecting the first beam with the movable body; and a fourth beam extending in a direction of the support axis and connecting the second beam with the movable body.

A purpose is to provide a technology for improving the resolution and/or the angle of view of an image projection device including a scanning mirror. The present technology provides an image projection device including an optical waveguide element including at least one incident port on which a laser beam is incident and a plurality of emission ports from which the laser beam is emitted, and a scanning mirror that performs scanning with the laser beam emitted from the optical waveguide element, in which the laser beam with which the scanning mirror performs the scanning reaches a projection target. According to one embodiment of the present technology, the image projection device may further include a hologram element that condenses the laser beam with which the scanning mirror performs the scanning on a vicinity of a pupil to allow the laser beam to reach a retina. According to another embodiment of the present technology, the image device may allow the laser beam with which the scanning mirror performs the scanning to reach a projection surface without or through a projection optical system.

An optical switch includes a bus waveguide supported by a substrate, an actuation electrode supported by the substrate, the actuation electrode having fins that protrude in a direction perpendicular to the substrate and to the bus waveguide, and a reaction electrode having interdigitated fins configured to form a comb drive with the actuation electrode. When a voltage difference between the reaction electrode and the actuation electrode is less than a lower threshold, the reaction electrode is positioned a first distance from the bus waveguide, when the voltage difference between the reaction electrode and the actuation electrode is greater than an upper threshold, the reaction electrode is positioned a second distance from the bus waveguide, and the second distance is less than the first distance.

An optical switch includes a first bus waveguide supported by a substrate, an optical antenna suspended over the first bus waveguide via a spring, and interdigitated electrodes coupling the substrate with optical antenna and configured to control a position of the optical antenna relative to the first bus waveguide. When a voltage difference applied to the interdigitated electrodes is less than a lower threshold, the optical antenna is at a first position offset from the first bus waveguide, when the voltage difference applied to the interdigitated electrodes is greater than an upper threshold, the optical antenna is at a second position offset from the first bus waveguide, and the offset at the second position is greater than at the first position.

A MEMS microphone integrates a temperature-sensing element in or on the ASIC die of a MEMS microphone to enable an audio mode and a temperature-sensing mode in parallel. The system also permits for a method for easily switching between these two modes and for outputting both digital output signals at the same common output pad, which allows for the use of the footprint of a conventional microphone.