A Light Detection and Ranging (LiDAR) module for a vehicle can include a semiconductor integrated circuit with a microelectromechanical system (MEMS) and a substrate, the MEMS comprising a micro-mirror assembly including a mirror and a gimbal structure. The gimbal can be configured concentrically around and coplanar with the mirror. When rotated, the gimbal drives the mirror to oscillate at or near a resonant frequency and is coupled to the mirror via mirror-gimbal connectors. A support structure can be coupled to a backside of the mirror and gimbal structures and can increase the stiffness of the mirror to help the mirror better resist dynamic deformation. To limit the added rotational moment of inertia, the support structure can be etched to form a matrix of cells (e.g., formed by a mesh of circumferential and radial ridges) such that up to approximately 90% of the support structure material forming the support structure is removed.

A resonator is provided that includes a vibrating section that vibrates in a contour vibration mode, a frame that surrounds at least a portion of the vibrating section, supporting sections extending along a Y-axis direction and connecting the vibrating section and the frame. The vibrating section includes a through hole that extends along an X-axis direction perpendicular to the Y-axis direction such that a coupling section is disposed between the through hole and each of the supporting sections. The length SL of the through hole in the X-axis direction is longer than the length Sd of the coupling section in the Y-axis direction.

A pick-up head picks up a semiconductor device from a carrier substrate. The pick-up head includes a first leg portion, a second leg portion, a raised bridge base portion between the first and second leg portions, and a tip portion mounted on the raised bridge base portion. The tip portion engages with the semiconductor device to pick up the semiconductor device from the carrier substrate. The pick-up head is associated with a force detection mechanism that detects a force applied to the pick-up head for picking up the semiconductor device. The force detection mechanism includes cavities formed on the first leg portion and/or second leg portion, pillars arranged on the pick-up head, a force detection device arranged in a mount assembly that is attached on the pick-up head, or electrodes arranged on the mount assembly. Actuation of the pick-up head is determined based on the detected force.

A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

A resonator is provided that includes a vibrating section that vibrates in a contour vibration mode, a frame that surrounds at least a portion of the vibrating section, supporting sections extending along a Y-axis direction and connecting the vibrating section and the frame. The vibrating section includes a through hole that extends along an X-axis direction perpendicular to the Y-axis direction such that a coupling section is disposed between the through hole and each of the supporting sections. The length SL of the through hole in the X-axis direction is longer than the length Sd of the coupling section in the Y-axis direction.

In at least one illustrative embodiment, a microelectromechanical system (MEMS) includes a composable piezoelectric actuator electrically coupled to a terminal. In response to a voltage applied across electrodes of the actuator, a piezoelectric rod moves from an initial position to a displaced position. In an embodiment, the MEMS includes two terminals, a resistive element is coupled between the terminals, and when in the displaced position the rod contacts one of the terminals. In an embodiment, the MEMS includes three terminals, and when a threshold voltage is applied to one of the terminals, the rod moves to the displaced position and allows current to flow between the other two terminals. In an embodiment, the MEMS includes a primary set of actuators that are mechanically but not electrically connected to a secondary set of actuators. An output terminal is coupled to the second set of actuators. Other embodiments are described and claimed.

Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A two-fold symmetric switch may be formed by a primary, secondary, and optionally tertiary set of voids formed in the movable plate. These voids may define the spring beams which provide a stable and reliable restoring force to the switch.

A MEMS device includes a movable mirror and a solid material below the mirror that removes more heat from the mirror and creates more viscous drag than if the solid material were absent while allowing free movement of the mirror. A MEMS system includes a movable mirror, transparent window, electronic package, and a fluid-tight cavity between the window and the electronic package filled with a fluid exhibiting higher thermal conductivity than air. Another system has a reflective movable mirror, transparent window, and a lid that holds the window close to the mirror without obstructing its free movement. There is greater vertical clearance between the MEMS system and lid than between the mirror and MEMS system. Another MEMS device has a movable mirror and a surrounding substrate coplanar to the mirror. A gap between the mirror and substrate is filled with fluid. Finger structures extend from the mirror into the gap.

The MEMS type semiconductor gas detection element of the invention is a MEMS type semiconductor gas detection element 1 having a MEMS structure, for detecting hydrogen gas, comprising: a substrate 2; a gas sensitive portion 3 mainly made of a metal oxide semiconductor and provided to the substrate 2; a heating portion 4 for heating the gas sensitive portion 3; an inactive film 5 having hydrogen-permselective and formed outside the gas sensitive portion 3; a protective film 6 formed outside the inactive film 5, for suppressing deterioration of the gas sensitive portion 3.

Systems and methods for maintaining autonomous vehicle operator awareness are provided. A method can include determining, by a computing system, an awareness challenge for an operator of a vehicle. The awareness challenge can be based on object data. The awareness challenge can have one or more criteria. The criteria can include a challenge response interval, a response time, and an action for satisfying the awareness challenge. The method can include initiating, by the computing system, a timer measuring elapsed time from a start time of the challenge response interval. The method can include communicating to the operator, by the computing system, a soft notification indicative of the awareness challenge during the challenge response interval. The method can include determining, by the computing system, whether the operator provides a user input after the response time interval and whether the user input corresponds to the action for satisfying the awareness challenge.