Patent classifications
B81B3/0097
SELF-FOLDING 3D FILM ASSEMBLIES
A substantially planar self-folding film assembly to generate a folded three-dimensional assembly. The assembly includes a flexible support substrate, adhesive elements, and folding members. The folding members include a base, a folding region, and a hinge adjacent each folding region attached at the base to the flexible support substrate by at least one of the adhesive elements. An array of polymer actuators is co-extensive, or shaped to be not co-extensive, with each of the flexible folding members. Upon activation by a patterned light to heat conversion layer, each polymer actuator is designed and configured to provide a displacement of the corresponding flexible folding member about each hinge.
ARTIFICIAL RETINAL NERVE FLEXIBLE MICROELECTRODE DEVICE AND FABRICATION METHOD THEREOF
This application discloses an artificial retinal nerve flexible microelectrode device and a fabrication method thereof. The device includes a flexible transparent substrate and a transparent thin film transistor (TFT) array layer. The transparent TFT array layer is disposed on the flexible transparent substrate and used for connecting with an optic nerve in a human eye to transmit a visual electrical signal to the optic nerve.
Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits
This work develops a novel microfluidic method to fabricate conductive graphene-based 3D micro-electronic circuits on any solid substrate including, Teflon, Delrin, silicon wafer, glass, metal or biodegradable/non-biodegradable polymer-based, 3D microstructured, flexible films. It was demonstrated that this novel method can be universally applied to many different natural or synthetic polymer-based films or any other solid substrates with proper pattern to create graphene-based conductive electronic circuits. This approach also enables fabrication of 3D circuits of flexible electronic films or solid substrates. It is a green process preventing the need for expensive and harsh postprocessing requirements for other fabrication methods such as ink-jet printing or photolithography. We reported that it is possible to fill the pattern channels with different dimensions as low as 10×10 μm. The graphene nanoplatelet solution with a concentration of 60 mg/mL in 70% ethanol, pre-annealed at 75° C. for 3 h, provided ˜0.5-2 kOhm resistance. The filling of the pattern channels with this solution at a flow rate of 100 μL/min created a continuous conductive graphene pattern on flexible polymeric films. The amount of graphene used to coat 1 cm.sup.2 of area is estimated as ˜10 μg. A second method regarding the transfer of graphene material-based circuits with small features size (5 μm depth, 10 μm width) from any solid surface to flexible polymeric films via polymer solvent casting approach was demonstrated. This method is applicable to any natural/synthetic polymer and their respective organic/inorganic solvents.
Method for processing a monocrystalline substrate and micromechanical structure
In various embodiments, a method of processing a monocrystalline substrate is provided. The method may include severing the substrate along a main processing side into at least two monocrystalline substrate segments, and forming a micromechanical structure comprising at least one monocrystalline substrate segment of the at least two substrate segments.
Flexible electronics for wearable healthcare sensors
Aspects include a method of manufacturing a flexible electronic structure that includes a metal or doped silicon substrate. Aspects include depositing an insulating layer on a silicon substrate. Aspects also include patterning a metal on a silicon substrate. Aspects also include selectively masking the structure to expose the metal and a portion of the silicon substrate. Aspects also include depositing a conductive layer including a conductive metal on the structure. Aspects also include plating the conductive material on the structure. Aspects also include spalling the structure.
Micro-device having a metal-semiconductor compound layer protected against HF etching and method for making the same
A micro-device including at least one first element comprising at least: a portion of material corresponding to a compound of at least one semi-conductor and at least one metal, first and second protective layers each covering one of two opposite faces of said portion of material, such that the first and second protective layers are in direct contact with said portion of material, that the first protective layer comprises at least one first material able to withstand an HF etching, that the second protective layer comprises at least one second material able to withstand the HF etching, and that at least one of the first and second materials able to withstand the HF etching includes the semi-conductor.
Device and method of fabricating such a device
There is disclosed a device and method for fabricating such a device. The device includes cavities formed in a substrate. A laminated membrane is mounted to the substrate and spans the cavities. The laminated membrane includes a layer of a flexible material, typically a polymer, and a layer of a two-dimensional material that is typically graphene.
MEMS device formed by at least two bonded structural layers and manufacturing process thereof
A microelectromechanical device having a first substrate of semiconductor material and a second substrate of semiconductor material having a bonding recess delimited by projecting portions, monolithic therewith. The bonding recess forms a closed cavity with the first substrate. A bonding structure is arranged within the closed cavity and is bonded to the first and second substrates. A microelectromechanical structure is formed in a substrate chosen between the first and second substrates. The device is manufactured by forming the bonding recess in a first wafer; depositing a bonding mass in the bonding recess, the bonding mass having a greater depth than the bonding recess; and bonding the two wafers.
Device with a suspended membrane having an increased amplitude of displacement
A device with a membrane comprising a support, a membrane made of a polymer material suspended on said support and at least one actuating module arranged opposite a face of the membrane and separate from said membrane, said actuating module comprising at least one actuator comprising at least one piezoelectric material and a beam connected to the support and separate from the membrane, the piezoelectric material being connected to the beam, such that, when a difference in electric potential is applied to the piezoelectric material, a bimetal effect appears between the piezoelectric material and the beam deforming the beam in the direction of the membrane, causing the deformation of the membrane, said device also comprising at least one electrostatic actuator configured for compressing at least one part of the membrane on the at least one part of the actuating module.
Systems and methods for micromechanical displacement-based logic circuits
The present disclosure relates to a micromechanical displacement logic, signal propagation system that makes use of first and second bistable elements, and first and second mounting structures arranged adjacent opposing surfaces of the first bistable element. A plurality of pivotal lever arms are used to support the first bistable element in either one of two positions of equilibrium. A support structure and a compressible flexure element disposed between the support structure and the first mounting structure apply a preload force to the first mounting structure, which imparts the preload force to the first bistable element. The first bistable element is moveable from one of the two stable equilibrium positions to the other in response to an initial signal applied thereto. The preload force, at least one stiffness characteristic of the lever arms, and a compressibility of a compressible coupling element which links the second bistable element to the first, are all selected to tune signal propagation from the first bistable element to the second bistable element.