Micromachined ultrasonic transducers having a self-assembled monolayer formed on a surface of a sealed cavity are described. A micromachined ultrasonic transducer may include a flexible membrane configured to vibrate over a sealed cavity, and the self-assembled monolayer may coat some or all of the interior surfaces of the sealed cavity. During fabrication, the sealed cavity may be formed by bonding the membrane to a substrate such that the sealed cavity is between the membrane and the substrate. An access hole may be formed through the membrane to the sealed cavity and the self-assembled monolayer is formed on surface(s) of the sealed cavity by introducing precursors into the sealed cavity through the access hole.

A layered hinge design providing an improved shock and vibration performance for a two-axis MEMS Micromirror featuring combs drive actuation with independent drive and control for rotating the Micromirror along two-axis of rotation. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, a plurality of actuation voltages are driven via conductive layers forming one or more hinges allowing the Micromirror to rotate along the two-axis of rotation. The layered hinge design achieves set angles that are highly stable over time and provides a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration.

A layered hinge design providing an improved shock and vibration performance for a two-axis MEMS Micromirror featuring combs drive actuation with independent drive and control for rotating the Micromirror along two-axis of rotation. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, a plurality of actuation voltages are driven via conductive layers forming one or more hinges allowing the Micromirror to rotate along the two-axis of rotation. The layered hinge design achieves set angles that are highly stable over time and provides a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration.

Inertial measurement apparatus arranged to be carried by a carrier vehicle include a chassis, a turntable mounted on the chassis, a first inertial measurement unit mounted on the turntable and connected to an electronic control unit connected to a motor for controlling turning of the turntable, and a second inertial measurement unit secured to the chassis. The control unit turns the turntable through one revolution with periodic alternating motion from a fixed initial angular position of the turntable. The control unit calculates the acceleration of the carrier vehicle from measuring the first inertial measurement unit while the turntable is stationary and from measuring the second inertial measurement unit while the turntable is moving. The control unit reconstitutes an inertial reference frame for each inertial measurement unit and compares the two inertial reference frames to determine a difference and takes account of this difference when calculating the acceleration.

A layered hinge design providing an improved shock and vibration performance for a two-axis MEMS Micromirror featuring combs drive actuation with independent drive and control for rotating the Micromirror along two-axis of rotation. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, a plurality of actuation voltages are driven via conductive layers forming one or more hinges allowing the Micromirror to rotate along the two-axis of rotation. The layered hinge design achieves set angles that are highly stable over time and provides a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration.

A microelectromechanical device, in particular a non-volatile memory module or a relay, comprising: a mobile body including a top region and a bottom region; top electrodes facing the top region; and bottom electrodes, facing the bottom region. The mobile body is, in a resting condition, at a distance from the electrodes. The latter can be biased for generating a movement of the mobile body for causing a direct contact of the top region with the top electrodes and, in a different operating condition, a direct contact of the bottom region with the bottom electrodes. In the absence of biasing, molecular-attraction forces maintain in stable mutual contact the top region and the top electrodes or, alternatively, the bottom region and the bottom electrodes.

Hinge for a microelectromechanical system, said system comprising a fixed part and at least one part able to move relative to the fixed part along at least an out-of-plane direction, said hinge being intended to suspend the moving part from the fixed part, said hinge comprising a first rigid part, a second part fixed to the first part at one end and intended to be anchored to the fixed part or the moving part, said second part being configured to deform in bending in a first direction, and two third parts fixed to the first part and intended to be anchored to the moving part or the fixed part, the third parts being configured to deform in bending along a second direction orthogonal to the first direction.

A layered hinge design providing an improved shock and vibration performance for a two-axis MEMS Micromirror featuring combs drive actuation with independent drive and control for rotating the Micromirror along two-axis of rotation. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, a plurality of actuation voltages are driven via conductive layers forming one or more hinges allowing the Micromirror to rotate along the two-axis of rotation. The layered hinge design achieves set angles that are highly stable over time and provides a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration.

A tactile computerized device which includes a tactile interface apparatus for displaying information and receive inputs from a user, comprising a touchscreen for receiving inputs from the user and for displaying visual data; an array of tactile pins that can It be pushed to one or more levels to protrude above the touchscreen and pulled below the touchscreen, via holes in the surface, by one or more actuators, the tactile pins, when protruding above the surface, are being capable of representing the information in the form of tactile pixels that create embossed images above the surface; actuators, for individually controlling the movement of each tactile pin and holding each the tactile pins in a desired level; a controller for converting information to be displayed that is received from the computerized device, to activation signals, activating the actuators to individually control the level of each tactile pin, such that tactile pins that protrude above the touchscreen and the remaining tactile pins being below the touchscreen will represent the information to be displayed; refreshing the displayed information by updating the level of each tactile pin; following groping of protruding tactile pins, receiving inputs from the user in the form of touching a desired location on the touchscreen.

A planar micromechanical actuator suspended on opposing suspension zones including a neutral axis between the opposing suspension zones, first to fourth segments into which the planar micromechanical actuator is segmented between the opposing suspension zones, each including a first electrode and a second electrode which form a capacitor and are isolatedly affixed to each other at opposite ends of the respective segment along a direction between the opposing suspension zones so as to form a gap between the first and second electrode along a thickness direction, the gap being offset to the neutral axis along the thickness direction, and wherein the first to fourth segments are configured such that the planar micromechanical actuator deflects into the thickness direction by the first and fourth segment bending into the thickness direction and the second and third segments bending contrary to the thickness direction upon a voltage being applied to the first and second electrodes of the first to fourth segments.