A wire-based microelectromechanical systems (MEMS) apparatus is provided. In examples discussed herein, the wire-based MEMS apparatus includes a MEMS control bus and at least one passive MEMS switch circuit. The passive MEMS switch circuit is configured to close a MEMS switch(es) by generating a constant voltage(s) that exceeds a defined threshold voltage (e.g., 30-50 V). In a non-limiting example, the passive MEMS switch circuit can generate the constant voltage(s) based on a radio frequency (RF) voltage(s), which may be harvested from an RF signal(s) received via the MEMS control bus. In this regard, it may be possible to eliminate active components and/or circuits from the passive MEMS switch circuit, thus helping to reduce leakage and power consumption. As a result, it may be possible to provide the passive MEMS switch circuit in a low power apparatus for supporting such applications as the Internet-of-Things (IoT).

A microelectromechanical gyroscope system is provided. The system includes a first substrate, a second substrate, and a third substrate. The substrates respectively have a first fixing, a second fixing, and a third fixing surfaces. The system further includes a first sensing, a second sensing and a third sensing module boards respectively fixed to the fixing surfaces. Each sensing module board has several microelectromechanical gyroscopes. A signal processing control board is electrically connected to the first sensing module board, the second sensing module board, and the third sensing module board. Wherein the first substrate, the second substrate, and the third substrate are perpendicular to each other. With the above structure, on each system coordinate axis of the microelectromechanical gyroscope system, at least one gyroscope is aligned with it for data acquisition and measurement. Accordingly, the measurement accuracy of the system is improved.

A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.

A sensor system includes first and second MEMS structures and a processing circuit. The first and second MEMS structures are configured to produce first and second output signals, respectively, in response to a physical stimulus. A method performed by the processing circuit entails receiving the first and second output signals and detecting a defective one of the first and second MEMS structures from the first and second output signals by determining that the first and second output signals are uncorrelated to one another. The method further entails utilizing only the first or the second output signal from a non-defective one of the MEMS structures to produce a processed output signal when one of the MEMS structures is determined to be defective and utilizing the first and second output signals from both of the MEMS structures to produce the processed output signal when neither of the MEMS structures is defective.

The present subject matter relates to charge pump devices, systems, and methods in which a plurality of series-connected charge-pump stages are connected between a supply voltage node and a primary circuit node, and a discharge circuit is connected to the plurality of charge-pump stages, wherein the discharge circuit is configured to selectively remove charge from the primary circuit node.

The present invention discloses a coating monitoring system of wind turbines, comprising a monitoring object having at least one coating on the surface. A coating monitoring module is coupled to the monitoring object, and the coating monitoring module comprises a MEMS system including a signal generating device, and a printed circuit board connected to the MEMS system. The coating monitoring module measures a measured coating impedance value of the monitoring object. A potentiostat, calculating an actual coating impedance value of the monitoring object, is connected to the monitoring object. And a computing device coupled to the coating monitoring module, the computing device correcting the measured coating impedance value based on the actual coating impedance value.

A sensor device includes a first and second Micro-Electro-Mechanical (MEM) structures. The first MEM structure includes a first heating element on a first layer of the first MEM structure. The first heating element includes an input adapted to receive an input signal. The first MEM structure also includes a first temperature sensing element on a second layer of the first MEM structure. The second MEM structure includes a second heating element on a first layer of the second MEM structure and a second temperature sensing element on a second layer of the second MEM structure. An output circuit has a first input coupled to the first temperature sensing element and a second input coupled to the second temperature sensing element.

The disclosure provides a system, comprising: a MEMS capacitive transducer, comprising one or more first capacitive plates coupled to a first node and one or more second capacitive plates coupled to a second node; biasing circuitry coupled to the first node, operable to provide a biasing voltage to the one or more first capacitive plates; and test circuitry coupled to the second node, operable to: selectively apply one or more current sources to the second node, so as to charge and discharge the MEMS capacitive transducer and so vary a signal based on a voltage at said second node between an upper value and a lower value; determine a parameter that is indicative of a time period of the variation of the signal; and determine a capacitance of the MEMS capacitive transducer based on the parameter that is indicative of the time period.

The invention discloses a MEMS sensor detection device and a MEMS sensor system, wherein the MEMS sensor detection device comprises: a readout circuit used for analog signal processing of the output signal of the MEMS sensor to generate detection voltage; a cancellation voltage generation circuit used for generating a gravity cancellation voltage according to the detection voltage, wherein the gravity cancellation voltage and the gravity acceleration are in a positive proportional relationship; a selection circuit used for selecting the detection voltage output in a feedback phase and selecting the gravity cancellation voltage output in a gravity cancellation phase, wherein in one detection period, the feedback phase is located after the gravity cancellation phase; and a feedback circuit used for generating a feedback voltage according to the output voltage of the selection circuit, wherein the feedback voltage is in a positive proportional relationship with the output voltage of the selection circuit. The MEMS sensor detection device and the MEMS sensor system disclosed by the invention can cancel the influence of gravity acceleration and improve the sensitivity of the MEMS sensor system.

Selective self-assembled monolayer patterning with sacrificial layer for devices is provided herein. A sensor device can include a handle layer and a device layer that comprises a first side and a second side. First portions of the first side are operatively connected to defined portions of the handle layer. At least one area of the second side comprises an anti-stiction area formed with an anti-stiction coating. The device can also include a Complementary Metal-Oxide-Semiconductor (CMOS) wafer operatively connected to second portions of the second side of the device layer. The CMOS wafer comprises at least one bump stop. The anti-stiction area faces the at least one bump stop.