A method of fabricating a MEMS structure includes providing a substrate comprising a logic element region and a MEMS region. Next, a logic element is formed within the logic element region. A nitrogen-containing material layer is formed to cover the logic element region and the MEMS region conformally. Then, part of the nitrogen-containing material layer within the MEMS region is removed to form at least one shrinking region. Subsequently, a dielectric layer is formed to cover the logic element region and MEMS region, and the dielectric layer fills in the shrinking region. After that, the dielectric layer is etched to form at least one releasing hole, wherein the shrinking region surrounds the releasing hole. Finally, the substrate is etched to form a chamber.

An illumination system having a reduced z-dimensional profile, which is achieved by reflecting light out of plane relative to a light source that generated the light, is disclosed herein. This illumination system includes an IR illumination device, a collimating optic, a turning optic, and a waveguide. The turning optic is specially configured to receive IR light from the IR illumination device and to reflect the IR light out of plane relative to the emission orientation of the IR illumination device. The reflected IR light is reflected towards the collimating optic. The waveguide is positioned in a fixed position relative to the collimating optic and includes an input port or grating to receive the collimated IR light. By reflecting light out of the plane, the size of the illumination system can be beneficially reduced in the z-direction.

Integrated systems for force or strain sensing and haptic feedback are described herein. An example force-haptic system can include a sensor chip configured to receive an applied force, where the sensor chip includes at least one sensing element and an integrated circuit. The force-haptic system can also include a haptic actuator configured to convert an electrical excitation signal into mechanical vibration. Further, the force-haptic system can include a circuit board, where the sensor chip and the haptic actuator are electrically and mechanically coupled to the circuit board. The integrated circuit can be configured to process an electrical signal received from the at least one sensing element and to output the electrical excitation signal.

An electronic package structure includes a first printed circuit board, a second printed circuit board and first space columns. The first printed circuit board has a first surface and a through hole. The second printed circuit board has a second surface facing the first surface. Each first space column is interconnected between the first surface and the second surface. An encapsulation layer is filled between the first and second printed circuit boards and among the first space columns so as to define a hollow chamber. A MEMS microphone component located within the hollow chamber is located on the first surface and aligned with the through hole. A sensing component is located within the hollow chamber.

A microphone package structure includes a substrate, a metal housing, a MEMS microphone component and at least one integrated circuit component. The substrate has a first surface and a second surface that are opposite to each other. The metal housing is located on the first surface such that the substrate and the metal housing collectively define a hollow chamber. The MEMS microphone component is located on the metal housing and within the hollow chamber. The at least one integrated circuit component is located within a region of the second surface on which the metal housing has a vertical projection.

A package includes a support structure having an electrically insulating material, a microelectromechanical system (MEMS) component, a cover structure having an electrically insulating material and mounted on the support structure for at least partially covering the MEMS component, and an electronic component embedded in one of the support structure and the cover structure. At least one of the support structure and the cover structure has or provides an electrically conductive contact structure.

An MEMS microphone is provided, comprising: a first substrate; a vibration diaphragm supported above the first substrate by a spacing portion, the first substrate, the spacing portion, and the vibration diaphragm enclosing a vacuum chamber, and a static deflection distance of the vibration diaphragm under an atmospheric pressure being less than a distance between the vibration diaphragm and the first substrate; and a floating gate field effect transistor outputting a varying electrical signal, the floating gate field effect transistor including a source electrode and a drain electrode both provided on the first substrate and a floating gate provided on the vibration diaphragm.

An electro-optical apparatus has an element substrate that is provided with a mirror and a sealing member which seals the mirror, and the sealing member includes a light-transmitting cover which faces the mirror opposite from the element substrate. An infrared cut filter is laminated on the light-transmitting cover.

A MEMS vibration sensor die can include a substrate having a top portion, a mounting surface, and an aperture extending at least partially through the substrate. The die can include a first electrode coupled to the top portion of the substrate and positioned over the aperture. The die can include a second electrode disposed between the substrate and the first electrode. The second electrode can be spaced apart from the first electrode. The die can include a proof mass that can have a first portion coupled to the first electrode or the second electrode. The proof mass can have a second end opposite the first portion. The second end can be recessed within the aperture relative to the mounting surface of the substrate. The proof mass can be suspended freely within the aperture. The proof mass can move the first electrode or the second electrode from which it is suspended in response to vibration.

A MEMS pump module includes a MEMS chip, at least one signal electrode, a plurality of MEMS pumps and a plurality of switch units. The MEMS chip comprises a chip body. The signal electrode is disposed on the chip body. Each of the MEMS pumps comprises a first electrode and a second electrode. The second electrode is electrically connected to the signal electrode. The switch units are electrically connected to the first electrodes of the MEMS pumps. A modulation voltage is received by the at least one signal electrode and then is transmitted to the second electrodes of the MEMS pumps. The on-off actions of MEMS pumps are controlled by the plurality of switch units.