A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

A semiconductor structure and a microfluidic system comprising the semiconductor structure are disclosed. The semiconductor structure comprises a thermoelement layer. The thermoelement layer comprises p- and n-type thermoelements. These thermoelements form regions wherein respective region is associated with a specific temperature range, where achieving the specific temperature range is based on an electron or hole current flowing through the thermoelements. The semiconductor structure forms part of the microfluidic system comprising a microfluidic channel having a meander extension across regions having different temperature ranges. This allows a fluid flowing in the microfluidic channel being exposable to cyclic temperature variations.

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

A MEMS package is provided. The MEMS package includes a metallization layer, a planarization structure, a MEMS device structure, a cap structure and a pressure adjustment element. The planarization structure has an inner sidewall defining a first cavity exposing the metallization layer. The MEMS device structure is bonded to the planarization structure. The MEMS device structure includes a movable element over the first cavity. The cap structure is bonded to the MEMS device structure and has an inner sidewall defining a second cavity facing the movable element. The pressure adjustment element is disposed in the second cavity.

An electronic structure includes a circuit element, and a functional element disposed at a position overlapping the circuit element in a plan view in a Z-axis direction along a Z-axis, where three mutually orthogonal axes are an X-axis, a Y-axis, and the Z-axis, in which, between the circuit element and the functional element, a first protrusion group including a plurality of first protrusions disposed in an X-axis direction along the X-axis and a second protrusion group including a plurality of second protrusions disposed in the X-axis direction are provided, the circuit element and the functional element are coupled through the first protrusion group and the second protrusion group, a gap is provided between the first protrusion group and the second protrusion group, and the gap includes a first space provided from an end of the circuit element on a negative side of the X-axis to an end of the circuit element on a positive side of the X-axis.