A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.

A die attachment to a support is disclosed. In an embodiment, a semiconductor package includes a support and a die attached to the support by an adhesive on a backside of the die, wherein the die includes a capacitive pressure sensor integrated on a CMOS read-out circuit, and wherein the adhesive covers only a part of the backside of the die.

An inclination sensor system for a mobile work machine includes a MEMS inclination sensor and a further inclination sensor of a different type and a fusion device. The inclination sensor is configured to output a first inclination signal on the basis of an inclination that exists at the inclination sensor. The further inclination sensor is configured to output a second inclination signal on the basis of the inclination that exists at the further inclination sensor. The fusion device is configured to calculate a corrected inclination signal on the basis of the first and second inclination signals and to output same as the corrected inclination signal.

An inclination sensor system for a mobile work machine includes a MEMS inclination sensor and a further inclination sensor of a different type and a fusion device. The inclination sensor is configured to output a first inclination signal on the basis of an inclination that exists at the inclination sensor. The further inclination sensor is configured to output a second inclination signal on the basis of the inclination that exists at the further inclination sensor. The fusion device is configured to calculate a corrected inclination signal on the basis of the first and second inclination signals and to output same as the corrected inclination signal.

An electronic apparatus includes a semiconductor package including a sensor unit that outputs a signal responding to an applied physical quantity, mounted on a mounting member. An island projected region is defined as a region in the mounting member obtained by projecting an outline of an island on which the sensor unit is mounted, and a part of or entire of the island projected region is configured as a through hole or a concave portion.

An electronic apparatus includes a semiconductor package including a sensor unit that outputs a signal responding to an applied physical quantity, mounted on a mounting member. An island projected region is defined as a region in the mounting member obtained by projecting an outline of an island on which the sensor unit is mounted, and a part of or entire of the island projected region is configured as a through hole or a concave portion.

A system includes a semiconductor substrate having a first cavity. The semiconductor substrate forms a pedestal adjacent the first cavity. A device overlays the pedestal and is bonded to the semiconductor substrate by metal within the first cavity. A plurality of second cavities are formed in a surface of the pedestal beneath the device, wherein the second cavities are smaller than the first cavity. In some of these teachings, the second cavities are voids. In some of these teachings, the metal in the first cavity comprises a eutectic mixture. The structure relates to a method of manufacturing in which a layer providing a mask to etch the first cavity is segmented to enable easy removal of the mask-providing layer from the area over the pedestal.

A system includes a semiconductor substrate having a first cavity. The semiconductor substrate forms a pedestal adjacent the first cavity. A device overlays the pedestal and is bonded to the semiconductor substrate by metal within the first cavity. A plurality of second cavities are formed in a surface of the pedestal beneath the device, wherein the second cavities are smaller than the first cavity. In some of these teachings, the second cavities are voids. In some of these teachings, the metal in the first cavity comprises a eutectic mixture. The structure relates to a method of manufacturing in which a layer providing a mask to etch the first cavity is segmented to enable easy removal of the mask-providing layer from the area over the pedestal.

A MEMs and/or NEMs measurement system includes a resonant assembly comprising: an input and an output, a plurality of N optical resonators Ri indexed i each having a resonance wavelength λr,i, at least one waveguide to which the optical resonators are coupled, at least one element coupled to each resonator Ri, an emission device, a modulation device, an injection device configured to superpose the N light beams to form an input beam and to inject the beam as input to the resonant assembly, at least one detector configured to detect a light beam arising from the beam at the output of the resonant assembly and to generate an output signal, a demodulation device comprising at least N synchronous-detection demodulation modules.

A MEMs and/or NEMs measurement system includes a resonant assembly comprising: an input and an output, a plurality of N optical resonators Ri indexed i each having a resonance wavelength λr,i, at least one waveguide to which the optical resonators are coupled, at least one element coupled to each resonator Ri, an emission device, a modulation device, an injection device configured to superpose the N light beams to form an input beam and to inject the beam as input to the resonant assembly, at least one detector configured to detect a light beam arising from the beam at the output of the resonant assembly and to generate an output signal, a demodulation device comprising at least N synchronous-detection demodulation modules.