A MEMS microphone includes an ASIC chip, a first MEMS chip, a second MEMS chip, a housing and a circuit board. The ASIC chip is electrically connected to the first MEMS chip and the second MEMS chip, and the ASIC chip, the first MEMS chip and the second MEMS chip are mounted on the circuit board. The circuit board and the housing cooperatively form a first chamber configured to accommodate the ASIC chip and the first MEMS chip, and a second chamber configured to accommodate the second MEMS chip. The circuit board defines a first through hole corresponding to the first MEMS chip and a second through hole corresponding to the second MEMS chip. The MEMS microphone has both the function of the traditional microphone and the function of the distance sensor, which saves the space occupied by components in a mobile terminal and the cost of the components.

A microelectromechanical device, in particular a non-volatile memory module or a relay, comprising: a mobile body including a top region and a bottom region; top electrodes facing the top region; and bottom electrodes, facing the bottom region. The mobile body is, in a resting condition, at a distance from the electrodes. The latter can be biased for generating a movement of the mobile body for causing a direct contact of the top region with the top electrodes and, in a different operating condition, a direct contact of the bottom region with the bottom electrodes. In the absence of biasing, molecular-attraction forces maintain in stable mutual contact the top region and the top electrodes or, alternatively, the bottom region and the bottom electrodes.

A microelectromechanical device, in particular a non-volatile memory module or a relay, comprising: a mobile body including a top region and a bottom region; top electrodes facing the top region; and bottom electrodes, facing the bottom region. The mobile body is, in a resting condition, at a distance from the electrodes. The latter can be biased for generating a movement of the mobile body for causing a direct contact of the top region with the top electrodes and, in a different operating condition, a direct contact of the bottom region with the bottom electrodes. In the absence of biasing, molecular-attraction forces maintain in stable mutual contact the top region and the top electrodes or, alternatively, the bottom region and the bottom electrodes.

An apparatus includes a base having a first surface and an array of pillars. Each pillar of the array of pillars includes (i) a first end attached to the first surface of the base; (ii) a second end having an electric charge retention portion; (iii) a physical separation from adjacent pillars of the array of pillars; and (iv) an electrical conductor configured to electrically connect the electric charge retention portion with a bus structure. The bus structure is configured to addressably connect with the electrical conductor of each respective pillar of the array of pillars.

An apparatus includes a base having a first surface and an array of pillars. Each pillar of the array of pillars includes (i) a first end attached to the first surface of the base; (ii) a second end having an electric charge retention portion; (iii) a physical separation from adjacent pillars of the array of pillars; and (iv) an electrical conductor configured to electrically connect the electric charge retention portion with a bus structure. The bus structure is configured to addressably connect with the electrical conductor of each respective pillar of the array of pillars.

A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate having a MEMS component in a device region. A top cap is fusion bonded to the top surface of the device substrate and a bottom cap is fusion bonded to the bottom surface of the device substrate. The top and bottom caps encapsulate the MEMS components. A cap includes a via isolation which extends a thickness of the cap and surrounds the device region.

A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate having a MEMS component in a device region. A top cap is fusion bonded to the top surface of the device substrate and a bottom cap is fusion bonded to the bottom surface of the device substrate. The top and bottom caps encapsulate the MEMS components. A cap includes a via isolation which extends a thickness of the cap and surrounds the device region.

A microelectromechanical resonator includes a support structure, a resonator element suspended to the support structure, and an actuator for exciting the resonator element to a resonance mode. The resonator element includes a plurality of adjacent sub-elements each having a length and a width and a length-to-width aspect ratio of higher than 1 and being adapted to a resonate in a length-extensional, torsional or flexural resonance mode. Further, each of the sub-elements is coupled to at least one other sub-element by one or more connection elements coupled to non-nodal points of the of said resonance modes of the sub-elements for exciting the resonator element into a collective resonance mode.

A microelectromechanical resonator includes a support structure, a resonator element suspended to the support structure, and an actuator for exciting the resonator element to a resonance mode. The resonator element includes a plurality of adjacent sub-elements each having a length and a width and a length-to-width aspect ratio of higher than 1 and being adapted to a resonate in a length-extensional, torsional or flexural resonance mode. Further, each of the sub-elements is coupled to at least one other sub-element by one or more connection elements coupled to non-nodal points of the of said resonance modes of the sub-elements for exciting the resonator element into a collective resonance mode.

A semiconductor device includes first and second exposed electrical contacts and a cavity having a microelectromechanical system (MEMS) structure therein. A conductive path extends from the first exposed electrical contact to the cavity and an over-voltage protection element electrically is coupled between the first and second exposed electrical contacts.