A sensor is achieved by applying a layer of a mixture that contains polymer and conductive particles over a substrate or first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the material. An electric field is applied over the layer, so that a number of the conductive particles are assembled into one or more chain-like conductive pathways with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilize the material. The conductivity of the pathway is highly sensitive to the deformations and it can therefore act as deformation sensor. The pathways can be transparent and is thus suited for conductive and resistive touch screens. Other sensors such as strain gauge and vapor sensor can also be achieved.

Disclosed are a reader device, system, and method for communicating with a wireless sensor. The reader device may be configured to analyze the strength of a response signal transmitted from the wireless sensor in response to an excitation pulse generated by the reader device. In one embodiment, the reader device may be configured to engage be placed in a plurality of modes to allow the reader to transmit a signal, such as a short pulse of energy or a short burst of radio frequency energy to cause the wireless sensor to output a resonant signal. The reader device may receive the resonant signal from the wireless sensor and evaluate it against predetermined values. The evaluated signals may be used to assess the strength and the proximity of the reader device relative to the wireless sensor as it is implanted in a patient.

Disclosed herein is a gas sensing device comprising a dielectric membrane formed on a semiconductor substrate comprising a bulk-etched cavity portion, a heater located within or over the dielectric membrane, a material for sensing a gas which is located on one side of the membrane, a support structure located near the material, and a gas permeable region coupled to the support structure so as to protect the material.

A construction component for detecting the application of energy and responding to the energy input wherein a plurality of particles are distributed throughout the component with each particle being configured to sense component state information. The component includes at least one processor configured to receive sensing information from the plurality of particle sensors. The processor configured to receive component state information and to process the information to determine a response to selectively alter attributes of the construction component to affect the behavior of the component. The plurality of particles capable of converting a portion of the energy applied to the construction component into an alternative form of energy, wherein the converted energy is harvested for utilization elsewhere.

Matching layers configured for use with ultrasound transducers are disclosed herein. In one embodiment, a transducer stack can include a capacitive micromachined ultrasound transducer (CMUT), an acoustic lens, and a matching layer therebetween. The matching layer can be made from a compliant material (e.g. an elastomer and/or an liquid) and configured for use with CMUTs. The matching layer can include a bottom surface overlying a top surface of the transducer and a top surface underlying a bottom surface of the lens.

A sensing device includes a MEMS sensor and an adjustable amplifier. The MEMS sensor is configured to generate an input signal according to environmental changes. The adjustable amplifier has a first input terminal, a second input terminal, a third input terminal, a fourth input terminal and a first output terminal. The first input terminal is electrically connected to the MEMS sensor for receiving the input signal. The second input terminal is electrically connected to a first signal terminal for receiving a first common-mode signal. The third input terminal is electrically connected to the first output terminal. The fourth input terminal is electrically connected to a second signal terminal. An electric potential of a first output signal output by the first output terminal of the adjustable amplifier is related to electric potentials of the input signal, the first signal terminal and the second signal terminal.

A semiconductor package includes a semiconductor die having a sensor structure disposed at a first side of the semiconductor die, and a first port extending through the semiconductor die from the first side to a second side of the semiconductor die opposite the first side, so as to provide a link to the outside environment. Corresponding methods of manufacture are also provided.

A microelectromechanical system includes a membrane of amorphous carbon having a thickness between 1 nm and 50 nm, and for example between 3 nm and 20 nm.

A sensing device includes a micro-electromechanical sensor, a source follower and an amplifier. The source follower includes a first output module including a first transistor and a second transistor. The micro-electromechanical sensor is configured to generate an input signal. A first terminal of the first transistor is configured to receive a first reference voltage. A second terminal and a control of the first transistor are electrically connected to the first output terminal and to a first current source respectively. A first terminal and a second terminal of the second transistor are electrically connected to the second terminal and the control terminal of the first transistor respectively. A control terminal of the second transistor is configured to receive the input signal. A first input terminal and a second input terminal of the amplifier are electrically connected to a first output terminal configured to receive a common-mode voltage respectively.

A semiconductor gas sensor device includes a first cavity that is enclosed by opposing first and second semiconductor substrate slices. At least one conducting filament is provided to extend over the first cavity, and a passageway is provided to permit gas to enter the first cavity. The sensor device may further including a second cavity that is hermetically enclosed by the opposing first and second semiconductor substrate slices. At least one another conducting filament is provided to extend over the second cavity.