A microelectromechanical systems die including a thermally conductive substrate including an outer surface, a plurality of low mass sensing structures disposed within the thermally conductive substrate to form a plurality of inter-structure spaces therebetween, each of the plurality of low mass sensing structures include a sensing structure proximal top surface, a sensing structure distal top surface, and a sensing structure width dimension.

A production method for a micromechanical sensor component and a corresponding micromechanical sensor component. The production method includes: providing a sensor wafer with a plurality of micromechanical sensor chips, which include one or more relevant sensor regions; forming an access wafer with one or a corresponding plurality of access chips, which in each case include one or more access regions to the sensor regions, which form relevant media access regions for the sensor regions; attaching the access wafer to the sensor wafer, so that the access regions are arranged above the corresponding sensor region(s); and separating the sensor chips with the access chips glued thereon, in order to obtain a plurality of sensor component chips.

Systems and methods for maintaining autonomous vehicle operator awareness are provided. A method can include determining, by a computing system, an awareness challenge for an operator of a vehicle. The awareness challenge can be based on object data. The awareness challenge can have one or more criteria. The criteria can include a challenge response interval, a response time, and an action for satisfying the awareness challenge. The method can include initiating, by the computing system, a timer measuring elapsed time from a start time of the challenge response interval. The method can include communicating to the operator, by the computing system, a soft notification indicative of the awareness challenge during the challenge response interval. The method can include determining, by the computing system, whether the operator provides a user input after the response time interval and whether the user input corresponds to the action for satisfying the awareness challenge.

Systems and methods for maintaining autonomous vehicle operator awareness are provided. A method can include determining, by a computing system, an awareness challenge for an operator of a vehicle. The awareness challenge can be based on object data. The awareness challenge can have one or more criteria. The criteria can include a challenge response interval, a response time, and an action for satisfying the awareness challenge. The method can include initiating, by the computing system, a timer measuring elapsed time from a start time of the challenge response interval. The method can include communicating to the operator, by the computing system, a soft notification indicative of the awareness challenge during the challenge response interval. The method can include determining, by the computing system, whether the operator provides a user input after the response time interval and whether the user input corresponds to the action for satisfying the awareness challenge.

A semiconductor structure includes a first device, a second device, a first hole, a second hole, and a sealing object. The second device is contacted to the first device, wherein a chamber is formed between the first device and the second device. The first hole is disposed in the second device and defined between a first end with a first circumference and a second end with a second circumference. The second hole is disposed in the second device and aligned to the first hole. The sealing object seals the second hole. The first end links with the chamber, and the first circumference is different from the second circumference.

A construction component for detecting the application of energy and responding to the energy input wherein a plurality of particles are distributed throughout the component with each particle being configured to sense component state information. The component includes at least one processor configured to receive sensing information from the plurality of particle sensors. The processor configured to receive component state information and to process the information to determine a response to selectively alter attributes of the construction component to affect the behavior of the component. The plurality of particles capable of converting a portion of the energy applied to the construction component into an alternative form of energy, wherein the converted energy is harvested for utilization elsewhere.

In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent to an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.

An electrode configuration for a microelectromechanical system, including a first electrode structure and a second electrode structure. The first electrode structure has a receptacle, and the second electrode structure has a finger. The first and second electrode structure are designed for a relative movement in relation to one another along a movement axis. A first width of the receptacle, perpendicular to the movement axis, tapers along the movement axis at least in a first region, and/or a second width of the finger, perpendicular to the movement axis, tapers along the movement axis at least in a second region.

The present disclosure provides a semiconductor structure and a method for fabricating semiconductor structure. The semiconductor structure includes a first device, configured to be a complementary metal oxide semiconductor device, wherein the first device includes a substrate, a multi-layer structure disposed on the substrate, a first hole, defined between a first end with a first circumference and a second end with a second circumference, a second hole, aligned to the first hole and defined between the second end and a third end with a third circumference, wherein the third circumference is larger than the first circumference and the second circumference, and a second device, configured to be a micro-electro mechanical system device and bonded to the first device, wherein a first chamber is between the first device and the second device, and the first end links with the first chamber, and a sealing object configured to seal the second hole.

A MEMS gas sensor (A) and array (B) thereof, a gas detection and preparation method. The gas sensor (A) comprises a first substrate (A2) with a cavity (A1) provided in a first surface, and a gas detection assembly (A3) arranged at an opening of the cavity The gas detection assembly comprises: a supporting suspension bridge (A31) erected on the opening of the cavity, and a gas detection part (A32) arranged on the supporting suspension bridge. The gas detection part comprises a strip-shaped heating electrode part (A321), an insulating layer (A322), a strip-shaped detection electrode part (A323) and a gas-sensitive material part (A324), which are sequentially stacked. The strip-shaped detection electrode part comprises a first detection electrode part (A323-1) and a second detection electrode part (A323-2), with a first opening (A325) provided between the A323-1 and A323-2; the gas-sensitive material part is arranged at the position of the first opening.