Microelectromechanical systems (MEMS) based spatial light modulators (SLMs) enclosed in a package filled with a gas to enhance the reliability and lifetime of the SLM, and methods for operating the same in various applications are described. Generally, the SLM includes a number of MEMS modulators, each including a number of light reflective surfaces, at least one light reflective surface coupled to an electrostatically deflectable element suspended above a substrate, and each adapted to reflect and modulate a light beam incident thereon. The package enclosing the SLM includes an optically transparent cover through which the reflective surfaces are exposed to the light beam, and a cavity is filled a low molar mass fill gas having an atomic number of two or less and a thermal conductivity of greater than 100 mW/(m.Math.K). The SLM can include electrostatically deflectable ribbons suspended over a substrate, or a linear array of two-dimensional MEMS modulators.

An integrated circuit includes an electrode voltage controller, a micro-electromechanical system (MEMS) structure, and a bias voltage generator. The MEMS structure has a first electrode, a conductive plate, and a reflective layer on the conductive plate. The first electrode is coupled to the electrode voltage controller, and the conductive plate is configured to move vertically with respect to the first electrode responsive to a voltage generated by the electrode voltage controller and applied to the first electrode. The bias voltage generator is coupled to the conductive plate. The bias voltage generator has an input configured to receive a bias control signal. The bias voltage generator is configured to apply a non-zero bias voltage to the conductive plate responsive to the bias control signal.

A microelectromechanical systems (MEMS) device includes a mirror structure, a frame, a first cantilever, a second cantilever, and first to fourth transmission springs. The first cantilever includes a first electrode. The second cantilever includes a second electrode spaced apart from the first electrode. The mirror structure is suspended in the frame by the first cantilever and the second cantilever. The first transmission spring connects the first cantilever to a first end of the mirror structure. The second transmission spring connects the second cantilever to the first end of the mirror structure. The third transmission spring connects the first cantilever to a second end of the mirror structure. The fourth transmission spring connects the second cantilever to the second end of the mirror structure.

Spatial light modulators (SLMs) and systems using same are described. Generally, the system includes a laser, a fixture holding a workpiece to be processed using the laser, illumination optics to illuminate the SLM with laser light, imaging optics to focus modulated light from the SLM onto the workpiece, and a controller to control the laser, the SLM, imaging optics and the fixture to scan the modulated light across a workpiece surface. The SLM includes an array of microelectromechanical system based diffractors, each including an electrostatically deflectable member coupled to a first light reflective surface and to bring light reflected from the first light reflective surface into interference with light reflected from a second light reflective surface in the SLM. The controller is operable to provide analog gray-scale control of an intensity of modulated light reflected from each diffractor by controlling an electrostatic force generated by a driver coupled thereto.

Disclosed herein are microelectronics packages and methods for manufacturing the same. The microelectronics packages may include a photonic integrated circuit (PIC), an electrical integrated circuit (EIC), and an interconnect. The interconnect may connect the EIC to the PIC. The interconnect may include a plurality of paths between the EIC and the PIC and the individual paths of the plurality of paths are less than 100 micrometers long.