A micro-electro-mechanical system (MEMS) package structure and a method of fabricating the MEMS package structure. The MEMS package structure includes a MEMS die (210,220) and a device wafer (100). A control unit and an interconnection structure (300) are formed in the device wafer (100), and a first contact pad (410) is formed on a first surface (100a) of the device wafer. The MEMS die (210,220) includes a micro-cavity (221), a second contact pad (201) configured to be coupled to an external electrical signal, and a bonding surface (200a,220a). The micro-cavity (221) of the MEMS die (210,220) is provided with a through hole (221a) in communication with the exterior of the die. The MEMS die (210,220) is bonded to the first surface (100a) by a bonding layer (500), in which an opening (510) is formed. The first contact pad (410) is electrically connected to the second contact pad (201), and a rewiring layer (700) is arranged on a second surface (100b) opposing the first surface (100a). The MEMS package structure allows electrical interconnection between the MEMS die and the device wafer with a reduced package size, compared to those produced by existing integration techniques. In addition, a plurality of MEMS dies of the same or different structures and functions are allowed to be integrated on the same device wafer.

A photoacoustic sensor includes a first layer with an optical MEMS emitter; a second layer stacked over the first layer with a MEMS pressure pick-up and an optically transparent window, wherein the MEMS pressure pick-up and the optically transparent window are offset laterally with respect to one another; and a third layer stacked over the second layer with a cavity for a reference gas. The optical MEMS emitter transmits optical radiation along an optical path, wherein the optical path runs through the optically transparent window and the cavity for the reference gas, and wherein the MEMS pressure pick-up is outside the course of the optical path.

A scanning module (100) for a light scanner (99) comprises a base (141) and an interface element (142) which is configured to secure a mirror surface (151). The scanning module (100) also comprises at least one support element (101, 102) which extends between the base (141) and the interface element (142) and has an extension perpendicular to the mirror surface (151) which is no less than 0.7 mm. The base (141), the interface element (142) and the at least one support element (101) are integrally formed.

MEMS devices include a suspended element connected to a fixed part of a substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate. A sensor coupled to the suspended element and a damping structure coupled to the suspended element extends into a gap between the suspended element and the fixed part of the substrate. One or more fluid confinement structures are configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.

An integrated circuit includes an electrode voltage controller, a micro-electromechanical system (MEMS) structure, and a bias voltage generator. The MEMS structure has a first electrode, a conductive plate, and a reflective layer on the conductive plate. The first electrode is coupled to the electrode voltage controller, and the conductive plate is configured to move vertically with respect to the first electrode responsive to a voltage generated by the electrode voltage controller and applied to the first electrode. The bias voltage generator is coupled to the conductive plate. The bias voltage generator has an input configured to receive a bias control signal. The bias voltage generator is configured to apply a non-zero bias voltage to the conductive plate responsive to the bias control signal.

An optical device includes an elastic support portion which includes a torsion bar which extends along a second direction perpendicular to a first direction and a nonlinearity relaxation spring which is connected between the torsion bar and a movable portion. The nonlinearity relaxation spring is configured so that a deformation amount of the nonlinearity relaxation spring around the second direction is smaller than a deformation amount of the torsion bar around the second direction and a deformation amount of the nonlinearity relaxation spring in a third direction perpendicular to the first direction and the second direction is larger than a deformation amount of the torsion bar in the third direction while the movable portion moves in the first direction. A comb electrode is disposed along an outer edge of the movable portion.

MEMS devices include fluid confinement structures on either a fixed part of a substrate and/or on a suspended element. The fluid confinement structures may be configured to confine a viscoelastic fluid in a limited part of a gap between one or more vertical sidewalls of both the fixed part of the substrate and either the suspended element or the drive beam or both the suspended element and drive beam such that one part of the gap is bridged by the fluid and another part of the gap is not, The structures may be configured to prevent flow of the fluid to other parts of the gap.

An optical device includes: a base; a movable portion including an optical function portion; an elastic support portion supporting the movable portion so that the movable portion is movable along a first direction; a first comb electrode provided to the base and including a plurality of first comb fingers; and a second comb electrode including a plurality of second comb fingers. The elastic support portion includes a torsion bar extending along a second direction perpendicular to the first direction and a lever. The second comb electrode is provided to a portion of at least one of the movable portion and the elastic support portion, the portion being located on the optical function portion side with respect to the torsion bar. The first comb finger and the second comb finger adjacent to each other face each other in a direction in which the movable portion has higher external force resistance, of the second direction and a third direction perpendicular to the first direction and the second direction.

An acquisition and tracking sensor includes a quad detector with a narrow field of view (NFOV) and a micro-electromechanical system (MEMS) mirror with a wide field of view (WFOV). The quad detector is placed behind the MEMS mirror to produce a WFOV to allow the quad detector to scan a larger area for the incoming laser beam.

A piston-mode spatial light modulator (SLM) includes a mirror and an electrode. The electrode is attached to the mirror. The electrode includes: a rigid body; and three spring legs coupled to the rigid body and configured to displace the rigid body responsive to an electrostatic force applied to the electrode.