Systems and methods for measuring a fundamental mode vibrational spectrum of materials and substances in the Mid-IR spectral range of 2.5 m to 14 m wavelength. are disclosed herein. In one embodiment, a Mid-infrared absorption spectrometer (MIRAS) system includes an infrared Micro-Electro-Mechanical System (MEMS) single element emitter light source. The light source is electrically pulsed and emits electromagnetic radiation in the wavelength range from 2.5 m to 14 m and has an integral energy concentrating optic to provide energy for a spectral absorption process. The system includes a scanning high-efficiency infrared spectral grating with self-calibrating feature, configured so that incident energy having absorption information for the spectral absorption process of a sample is within a predefined threshold of a grating blaze angle. The system also includes a single-element thermal detector to receive output energy having the absorption information from the infrared spectral grating.

A scanning module (100) for a light scanner (99) comprises a base (141) and an interface element (142) which is configured to secure a mirror surface (151). The scanning module (100) also comprises at least one support element (101, 102) which extends between the base (141) and the interface element (142) and has an extension perpendicular to the mirror surface (151) which is no less than 0.7 mm. The base (141), the interface element (142) and the at least one support element (101) are integrally formed.

An optical module includes a mirror unit having a movable mirror portion, a magnet portion configured to generate a magnetic field acting on the movable mirror portion, and a package accommodating the magnet portion. The magnet portion has a Halbach structure including a first magnet applied with a force in a first direction, and a second magnet applied with a force in a second direction. The package has a bottom walls portion, a side wall portion, and a restriction portion configured to restrict movement of the second magnet in the second direction. The movable mirror portion is disposed in a space formed by the restriction portion.

A displacement enlarging mechanism includes a substrate, a fixing portion provided at the substrate, an actuator coupled to the fixing portion, a beam extending in a direction substantially parallel to an upper surface of the substrate and having a base end side has been coupled to the actuator and coupled to the fixing portion and having folded back in a direction crossing the upper surface of the substrate, and a coupling portion and a mirror coupled to a folded-back portion formed by folding back of the beam. The actuator drives the beam to push or pull the beam from the base end side in the direction of the folded-back portion.

An image display apparatus includes a light source device including a light source unit; a scanning optical system including an image forming unit on which an intermediate image is formed by light from the light source unit; and a virtual image optical system configured to guide light of the intermediate image by using a reflecting mirror and a curved transmissive reflection member. The scanning optical system includes an optical scanning unit configured to scan the light from the light source unit in a main scanning direction and a sub-scanning direction of the image forming unit. The image forming unit is a transmissive member curved with a convex surface toward the reflecting mirror.

An optical module includes a support layer, a device layer which is provided on the support layer, and a movable mirror which is mounted in the device layer. The device layer has a mounting region which is penetrated by the movable mirror, and a driving region which is connected to the mounting region. A space corresponding to at least the mounting region and the driving region is formed between the support layer and the device layer. A portion of the movable mirror is positioned in the space.

A layered hinge design providing an improved shock and vibration performance for a two-axis MEMS Micromirror featuring combs drive actuation with independent drive and control for rotating the Micromirror along two-axis of rotation. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, a plurality of actuation voltages are driven via conductive layers forming one or more hinges allowing the Micromirror to rotate along the two-axis of rotation. The layered hinge design achieves set angles that are highly stable over time and provides a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration.

A detection chip, a detection method using the same and a manufacturing method thereof are provided. The detection chip includes: a detection baseplate including a first substrate and at least one photoresistor disposed on the first substrate; at least one cantilever beam configured to correspond to the at least one a photoresistor, wherein an orthographic projection of the cantilever beam on the detection baseplate is located within a region where the corresponding photoresistor is located, the cantilever beam has a free end that is separated from the photoresistor by a predetermined distance and that is movable relative to the photoresistor.

A MEMS based alignment technology based on mounting an optical component on a released micromechanical lever configuration that uses multiple flexures rather than a single spring. The optical component may be a lens. The use of multiple flexures may reduce coupling between lens rotation and lens translation, and reduce effects of lever handle warping on lens position. The device can be optimized for various geometries.

Two-axis MEMS Micromirror is disclosed featuring combs drive actuation with independent drive for each of two axes of rotation and a layered hinge design providing an improved shock and vibration performance. The two-axis MEMS Micromirror is fabricated using Double SOI wafer as the primary starting material. In addition, actuation voltages are driven to an inner axis through multiple layers in one or more outer hinges, allowing for a robust and reliable micromirror that is easy to drive with multiple DC voltages, and moderately insensitive to temperature, shock and vibration. Furthermore, this novel design achieves set angles that are highly stable over time.