An elastic device may comprise an amorphous metal comprising at least one refractory metal, at least two elements selected from periods, 4, 5, 6, 9, and 10, and at least one metalloid. A membrane may comprise a layer of silicon dioxide and a layer of amorphous metal. A MEMS device may comprise a layer of amorphous metal comprising at least one refractory metal, at least two elements selected from periods, 4, 5, 6, 9, and 10, and a metalloid. In one example, the amorphous material comprises Tantalum (Ta), Tungsten (W), and Silicon (Si). In another example, the metalloid is Silicon. In yet another example, the refractory metals comprise Niobium, Molybdenum, Tantalum, Tungsten, Rhenium, or combinations thereof.

Methods are disclosed for manufacturing a Micro-ElectroMechanical Systems (MEMS) scanning mirror. In an embodiment, one method includes depositing a hinge material on a substrate and removing first and second portions of the substrate to form an outer frame, an inner frame, and a mirror plate in the substrate. First and second portions of the hinge material rotationally couple the outer frame to the inner frame and the inner frame to the mirror plate for rotation about first and second orthogonal axes of rotation. In another embodiment, a third portion of the substrate rotationally couples the inner frame to the mirror plate. In still another embodiment, an elastomer material is configured as a bending hinge that rotationally couples the outer frame to the inner frame.

A micromechanical arm is provided. The micromechanical arm includes: a bottom metal piece having a plurality of trenches extending downwardly from a top surface of the bottom metal piece; an intermediate layer on the bottom metal piece and filling at least a portion of each of the plurality of trenches; and a top metal piece on the intermediate layer. The intermediate layer is made of a material that has a stiffness smaller than the bottom metal piece and the top metal piece.

A method of fabricating a micro-electromechanical systems (MEMS) structure comprises: providing a substrate; forming an etch stop layer over the substrate; forming a sacrificial layer on the etch stop layer; selectively etching the sacrificial layer to create a remaining sacrificial layer; forming a dielectric support layer; selectively etching the dielectric support layer to create an opening in the dielectric support layer; forming a bottom metal layer in the opening and on the remaining sacrificial layer; selectively etching the bottom metal layer to form a plurality of trenches extending downwardly from a top surface of the bottom metal layer; depositing an intermediate layer on the bottom metal layer such that the intermediate layer fills at least a portion of each of the plurality of trenches; forming a top metal piece on the intermediate layer; and removing the remaining sacrificial layer to create a cavity.

A forming method of a package structure includes: performing a manufacturing method to manufacture a cell; and disposing the cell within a cover. The manufacturing method of the cell includes: providing a wafer including a first layer and a second layer; and patterning the first layer to form a trench line. A membrane of the first layer includes a first membrane subpart and a second membrane subpart opposite to each other, and a slit penetrates through the membrane because of the trench line. The first membrane subpart includes a first anchored edge which is fully or partially anchored by an anchor structure, the second membrane subpart includes a second anchored edge which is fully or partially anchored by the anchor structure, and edges of the first membrane subpart other than the first anchored edge and edges of the second membrane subpart other than the second anchored edge are non-anchored.