The present application provides a micromechanical (MEMS) based zoom lens system, for use in miniature device applications, such as miniature electronic imaging devices. The MEMS-based zoom lens system comprises at least four optical elements, or two Alvarez or Lohmann lenses, that are configured for passage of optical signals therethrough along an optical signal path. Each optical element is MEMS-driven and displaceable in a direction substantially transverse to the optical signal path. In use, the transverse displacement of the optical elements vary an overall focal length of the MEMS zoom lens system such as to provide an optical zoom function. A method of manufacturing a MEMS zoom lens system is also provided in a further aspect.

The present application provides a micromechanical (MEMS) based zoom lens system, for use in miniature device applications, such as miniature electronic imaging devices. The MEMS-based zoom lens system comprises at least four optical elements, or two Alvarez or Lohmann lenses, that are configured for passage of optical signals therethrough along an optical signal path. Each optical element is MEMS-driven and displaceable in a direction substantially transverse to the optical signal path. In use, the transverse displacement of the optical elements vary an overall focal length of the MEMS zoom lens system such as to provide an optical zoom function. A method of manufacturing a MEMS zoom lens system is also provided in a further aspect.

A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.

A method of manufacturing and assembling a sandwich flexure mechanism assembly is set forth herein. The method involves manufacture of a monolithic sandwich flexure module having a multitude of out of plane rigid inter-stage connections between at least some sets of twin stages of the monolithic sandwich flexure module. The method further involves assembling an interconnect subassembly to intermediate bodies of the monolithic sandwich flexure module. The interconnect subassembly furnishing in-plane rigid inter-stage connections between pairs of the intermediate bodies that constitute sister stages of the monolithic sandwich flexure module. The method can further involve assembling a motion body, actuators, and displacement sensors at the monolithic sandwich flexure module.

A MEMS device (40) includes a base structure (42) and a microstructure (44) suspended above the structure (42). The base structure (42) includes an oxide layer (50) formed on a substrate (48), a structural layer (54) formed on the oxide layer (50), and an insulating layer (56) formed over the structural layer (54). A sacrificial layer (112) is formed overlying the base structure (42), and the microstructure (44) is formed in another structural layer (116) over the sacrificial layer (112). Methodology (90) entails removing the sacrificial layer (112) and a portion of the oxide layer (50) to release the microstructure (44) and to expose a top surface (52) of the substrate (48). Following removal, a width (86) of a gap (80) produced between the microstructure (44) and the top surface (52) is greater than a width (88) of a gap (84) produced between the microstructure (44) and the structural layer (54).

A MEMs actuator device and method of forming includes arrays of actuator elements. Each actuator element has a moveable top plate and a bottom plate. The top plate includes a central membrane member and a cantilever spring for movement of the central membrane member. The bottom plate consists of two RF signal lines extending under the central membrane member. A MEMs electrostatic actuator device includes a CMOS wafer, a MEMs wafer, and a ball bond assembly. Interconnections are made from a ball bond to an associated through-silicon-via (TSV) that extends through the MEMS wafer. A RF signal path includes a ball bond electrically connected through a TSV and to a horizontal feed bar and from the first horizontal feed bar vertically into each column of the array. A metal bond ring extends between the CMOS wafer and the MEMS wafer. An RF grounding loop is completed from a ground shield overlying the array to the metal bond ring, a TSV and to a ball bond.

A device for converting the kinetic energy of molecules into useful work includes an actuator configured to move within a fluid or gas due to collisions with the molecules of the fluid or gas. The actuator has dimensions that subject it to the Brownian motion of the surrounding molecules. The actuator utilizes objects having multiple surfaces where the different surfaces result in differing coefficients of restitution. The Brownian motion of surrounding molecules produce molecular impacts with the surfaces. Each surface then experiences relative differences in transferred energy from the kinetic collisions. The sum effect of the collisions produces net velocity in a desired direction. The controlled motion can be utilized in a variety of manners to perform work, such as generating electricity or transporting materials.

A microelectromechanical system (MEMS) transducer includes a substrate and a pair of electrodes supported by the substrate. The pair of electrodes are configured as a bias electrode-sense electrode couple. A moveable electrode of the pair of electrodes is configured for vibrational movement in a first direction during excitation of the moveable electrode. The pair of electrodes are spaced apart from one another by a gap in a second direction perpendicular to the first direction. The moveable electrode includes a cantilevered end, the cantilevered end being warped to exhibit a resting deflection along the first direction.

A microelectromechanical system (MEMS) transducer includes a substrate and a pair of electrodes supported by the substrate. The pair of electrodes are configured as a bias electrode-sense electrode couple. A moveable electrode of the pair of electrodes is configured for vibrational movement in a first direction during excitation of the moveable electrode. The pair of electrodes are spaced apart from one another by a gap in a second direction perpendicular to the first direction. The moveable electrode includes a cantilevered end, the cantilevered end being warped to exhibit a resting deflection along the first direction.

A method of manufacturing and assembling a sandwich flexure mechanism assembly is set forth herein. The method involves manufacture of a monolithic sandwich flexure module having a multitude of out of plane rigid inter-stage connections between at least some sets of twin stages of the monolithic sandwich flexure module. The method further involves assembling an interconnect subassembly to intermediate bodies of the monolithic sandwich flexure module. The interconnect subassembly furnishing in-plane rigid inter-stage connections between pairs of the intermediate bodies that constitute sister stages of the monolithic sandwich flexure module. The method can further involve assembling a motion body, actuators, and displacement sensors at the monolithic sandwich flexure module.