An optical system including a dual-layer microelectromechanical systems (MEMS) device, and methods of fabricating and operating the same are disclosed. Generally, the MEMS device includes a substrate having an upper surface; a top modulating layer including a number of light modulating micro-ribbons, each micro-ribbon supported above and separated from the upper surface of the substrate by spring structures in at least one lower actuating layer; and a mechanism for moving one or more of the micro-ribbons relative to the upper surface and/or each other. The spring structures are operable to enable the light modulating micro-ribbons to move continuously and vertically relative to the upper surface of the substrate while maintaining the micro-ribbons substantially parallel to one another and the upper surface of the substrate. The micro-ribbons can be reflective, transmissive, partially reflective/transmissive, and the device is operable to modulate a phase and/or amplitude of light incident thereon.

A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor,and a biological sensor.

A monolithically integrated multi-sensor (MIMS) is disclosed. A MIMs integrated circuit comprises a plurality of sensors. For example, the integrated circuit can comprise three or more sensors where each sensor measures a different parameter. The three or more sensors can share one or more layers to form each sensor structure. In one embodiment, the three or more sensors can comprise MEMs sensor structures. Examples of the sensors that can be formed on a MIMs integrated circuit are an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, and a biological sensor.

A nanoelectronic system comprised of n microelectromechanical or nanoelectromechanical devices arranged on a connection support to electrically connect the n devices, each device with an interaction area, at least one mechanical anchor and a first terminal, a second terminal and a third terminal, the relative arrangement of the first, second and third terminals, the anchor area and the interaction area being identical or similar for the n sensors, the first terminal of each device being intended to recover a signal emitted by each representative device of the interaction area state. At least part of the devices are arranged in such a way that the geometric location of the first terminal of one of the adjacent devices is identical to the geometric location of the first terminal of said other adjacent device, the first terminals being coincident.

Provided are a device, method, and computer-readable recording medium for detecting an earthquake in a microelectromechanical system (MEMS)-based auxiliary seismic observation network. The method includes performing detrending of removing a moving average from original acceleration data received from single sensors of an MEMS-based auxiliary seismic observation network to preprocess the acceleration data, calculating a short-term average/long-term average (STA/LTA) value using a filter parameter value specified on the basis of the preprocessed acceleration data, generating an event occurrence message or event end message on the basis of the calculated STA/LTA value and transmitting the event occurrence message or event end message, when the event occurrence message is generated, calculating an earthquake probability through an earthquake detection deep learning model using the preprocessed acceleration data as an input, and analyzing noise by calculating a power spectral density (PSD) from the original acceleration data which is merged at certain intervals.

A cell phone is provided having multiple sensors configured to detect and measure different parameters of interest. The cell phone includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The cell phone couples a first parameter to be measured directly to the direct sensor. Conversely, the cell phone can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the cell phone by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.