A pressure sensor (100) includes a pressure measuring device (120) including: a circuit board (121); and a processing unit (122) and a detection unit, both provided on the circuit board (121); the detection unit includes first, second and third MEMS sensing elements (123, 124, 125); the first MEMS sensing element (123) is configured to sense a first pressure (P1) at a first target position; the second MEMS sensing element (124) is configured to sense a second pressure (P2) at a second target position, and the third MEMS sensing element (125) is configured to sense a pressure difference (P) between the first and second target positions; the processing unit (122) is configured to determine whether the three MEMS sensing elements (123, 124, 125) are abnormal based on the first and second pressures and on the pressure difference; if it is determined that at least one of the three MEMS sensing elements is abnormal, the processing unit (122) outputs abnormal diagnostic information; if it is determined that none of the three MEMS sensing elements is abnormal, the processing unit (122) outputs information about the pressure(s) at the first and/or second target position(s) and the pressure difference; thus rationality diagnosis of the pressure signals is achieved, resulting in increased reliability and accuracy in pressure measurement.

A method for producing a composite cap element for encapsulation of a MEMS component includes providing a base substrate having a window formed through an opening, providing a transparent cover substrate for transparently covering the window in the base substrate, producing a hermetic connection between the base substrate and the cover substrate in a connection region which extends peripherally around the window, heating the interconnected substrates in an edge region of the window to a temperature at which the base substrate becomes deformable and the cover substrate remains dimensionally stable, and displacing the dimensionally stable cover substrate in the region of the window while simultaneously deforming the deformable base substrate in a region around the window. A composite cap element is also provided.

An example method of producing a microelectromechanical system (MEMS) package, the method comprising: applying first epoxy layers to a first substrate, at least one of the first epoxy layers coupled to a second substrate; applying a first post gel heat treatment to the first epoxy layers; after applying the first post gel heat treatment to the first epoxy layers, applying second epoxy layers to the second substrate and to the first epoxy layers; and applying a second post gel heat treatment to the first epoxy layers and the second epoxy layers.

An example method of producing a microelectromechanical system (MEMS) package, the method comprising: applying first epoxy layers to a first substrate, at least one of the first epoxy layers coupled to a second substrate; applying a first post gel heat treatment to the first epoxy layers; after applying the first post gel heat treatment to the first epoxy layers, applying second epoxy layers to the second substrate and to the first epoxy layers; and applying a second post gel heat treatment to the first epoxy layers and the second epoxy layers.

The invention generally relates to drives for microelectromechanical acoustic pressure-generating device, which may be implemented in a microelectromechanical system (MEMS). In some embodiments of the invention, the microelectromechanical acoustic pressure-generating device is implemented in a chip/die, e.g. in form of a System-on-Chip (SoC) or a System-in-Package (SiP). Further embodiments of the invention relate to the use of such acoustic pressure-generating device in a microelectromechanical loudspeaker system, for example, headphones, hearing-aids, or the like. Embodiments of the invention relate to the miniaturization of the device. Some of the embodiments focus on countermeasures that reduce the pull-in force, which can facilitate further miniaturization of the microelectromechanical acoustic pressure-generating device.

Various embodiments of the present disclosure are directed towards an electronic device that comprises a semiconductor substrate having a first surface opposite a second surface. The semiconductor substrate at least partially defines a cavity. A first microelectromechanical systems (MEMS) device is disposed along the first surface of the semiconductor substrate. The first MEMS device comprises a first backplate and a diaphragm vertically separated from the first backplate. A second MEMS device is disposed along the first surface of the semiconductor substrate. The second MEMS device comprises spring structures and a moveable element. The spring structures are configured to suspend the moveable element in the cavity. A segment of the semiconductor substrate continuously laterally extends from under a sidewall of the first MEMS device to under a sidewall of the second MEMS device.