The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

There is provided a MOMS sensor comprising a fiber interface comprising a fiber passthrough for one or more optical fibers, a cavity comprising an element hermetically encapsulated within the cavity, wherein the element is movably anchored by SiN arms, which are movable with respect to walls of the cavity, wherein the SiN arms comprise anchor portions at first ends of the SiN arms, which are connected to the element, and at second ends of the SiN arms, which are connected to the walls of the cavity, and the fiber interface is configured to receive the fibers through the fiber passthrough into positions for communications of light between the element and the fibers. In this way a robust structure that supports sensitivity of the sensor is provided.

Various embodiments of the present disclosure are directed towards a method for forming a microelectromechanical systems (MEMS) device. The method includes forming a filter stack over a carrier substrate. The filter stack comprises a particle filter layer having a particle filter. A support structure layer is formed over the filter stack. The support structure layer is patterned to define a support structure in the support structure layer such that the support structure has one or more segments. The support structure is bonded to a MEMS structure.

A method of fabricating a sensing device for DNA sequencing and biomolecule characterization including the steps of fabricating a microelectrode chip having a silicon substrate and a silicon nitride diaphragm, attaching a monolayer graphene sheet to the silicon nitride diaphragm, dicing a portion of the monolayer graphene sheet to form a graphene microribbon, converting the graphene microribbon to a graphene nanoribbon, and converting the graphene nanoribbon to a carbyne. A sensing device for DNA sequencing and biomolecule characterization is also disclosed. The sensing device includes a silicon substrate, a cavity in the silicon substrate covered by a silicon nitride layer, microelectrodes attached to the silicon nitride layer, graphene covering the microelectrodes, and carbyne attached to a portion of the silicon nitride layer covering said cavity.

The present disclosure relates to an integrated chip including a semiconductor device substrate and a plurality of semiconductor devices arranged along the semiconductor device substrate. A micro-electromechanical system (MEMS) layer overlies the semiconductor device substrate. The MEMS layer includes a first moveable mass and a second moveable mass. A capping layer overlies the MEMS layer. The capping layer has a first lower surface directly over the first moveable mass and a second lower surface directly over the second moveable mass. An outgas layer is on the first lower surface and directly between the first pair of sidewalls. A lower surface of the outgas layer delimits a first cavity in which the first moveable mass is arranged. The second lower surface of the capping layer delimits a second cavity in which the second moveable mass is arranged.

An acceleration sensor functioning as a physical quantity sensor includes an acceleration sensor element including a substrate, a lid joined to the substrate to form a housing space in the inside, and an acceleration sensor element piece housed in the housing space and capable of detecting a physical quantity, and a circuit element bonded to, by an adhesive material, an upper surface on the opposite side of the acceleration sensor element piece side of the lid. A recess is provided along the outer edge of the lid in an outer edge region of the upper surface of the lid.

A method of manufacturing a semiconductor device includes: forming a first substrate includes a membrane stack over a first dielectric layer, the membrane stack having a first electrode, a second electrode over the first electrode and a piezoelectric layer between the first electrode and the second electrode, a third electrode over the first dielectric layer, and a second dielectric layer over the membrane stack and the third electrode; forming a second substrate, including: a redistribution layer (RDL) over a third substrate, the RDL having a fourth electrode; and a first cavity on a surface of the RDL adjacent to the fourth electrode; forming a second cavity in one of the first substrate and the second substrate; and bonding the first substrate to the second substrate.

The present disclosure relates to a microelectronics package with a vertically stacked structure of a microelectromechanical systems (MEMS) device and a controller device. The MEMS device includes a MEMS component, a MEMS through-via, and a MEMS connecting layer configured to electrically connect the MEMS component with the MEMS through-via. The controller device includes a controlling component, a controller through-via, and a controller connecting layer configured to electrically connect the controlling component with the controller through-via. The controller through-via is in contact with the MEMS through-via, such that the controlling component in the controller device is configured to control the MEMS component in the MEMS device.

In an apparatus for manufacturing a micro-channel and a method for manufacturing a micro-channel, the apparatus includes a base member and a holding chamber. The base member includes a first base member having a concave portion and a convex portion, and a second base member covering the concave portion to form a channel. The holding chamber holds the base member thereinside, to form a space uniformly applying a pressure on a surface of the base member. Accordingly, the pressure is uniformly applied on an entire surface of the base member and thus the micro-channel may be manufactured.

A pressure sensor is provided. The pressure sensor includes a magnetic sensor element configured to generate a signal based on a magnetic field sensed by the magnetic sensor element; a microelectromechanical system (MEMS) structure including a membrane configured to move, depending on a pressure applied thereto, relative to the magnetic sensor element; and a field influencing element configured to modify the magnetic field based on a movement of the membrane, wherein the field influencing element is arranged on the membrane.