A semi-finished product and a method for manufacturing a semi-finished product having at least one micro-component, which method uses a multi-component injection molding process, are disclosed, in which at least one mold chamber of an injection mold is provided with at least one lost part made of a first material, more particularly an injection-molded plastic material, and in another step for producing the micro-component, a second material, which is different from the first material and is elastomer-based, more particularly silicone-based, is injected, as a result of which a firm and form-fitting connection forms between the micro-component and the lost part. In order to be able to achieve advantageous cycle times in a risk-free way, it is proposed for the lost part to be embodied as a macroscopic object holder for the micro-component to permit manipulation of the semi-finished product and for the mold chamber to be provided with this lost part.

A light module includes an optical element and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface; an elastic portion which is provided around the optical portion such that an annular region is formed; and a pair of support portions which is provided such that the optical portion is sandwiched in a first direction along the optical surface and in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portions are inserted into the opening in a state where an elastic force of the elastic portion is applied.

A method of transferring nanomaterials with sugar, the method including: depositing a colloidal sugar layer on a first substrate; pressing a second substrate and a nanomaterial layer located on the second substrate on the colloidal sugar layer, wherein the nanomaterial layer is adhered to the colloidal sugar layer; solidifying the colloidal sugar layer into a solid sugar layer; tearing the second substrate; locating a fourth substrate on the nanomaterial layer; placing the first substrate, the solid sugar layer, the nanomaterial layer and the fourth substrate in a solvent, wherein the solid sugar layer is dissolved in the solvent, and the nanomaterial layer is detached from the first substrate and attached to the fourth substrate.

A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.

A MEMS component package comprises a body having outer surfaces of non-conductive material and a plurality of conducting leads protruding therefrom. A solder pad is applied on a blind pad exposed on a PCB surface while applying solder paste. The blind pad is collocated with an intended location of the body, and the solder pad is collocated with the blind pad. The package is placed on the PCB surface, joining the leads to the pin pads of the PCB with solder paste. The PCB is heated to melt the paste. This couples the leads to the pin pads, and melts the solder pad. The melting transforms the solder pad into a solder bump configured to couple the body to the at least one blind pad. The solder bump attaches with a non-galvanic contact directly to the non-conductive plastic bottom of the body.

A semi-finished product and a method for manufacturing a semi-finished product having at least one micro-component, which method uses a multi-component injection molding process, are disclosed, in which at least one mold chamber of an injection mold is provided with at least one lost part made of a first material, more particularly an injection-molded plastic material, and in another step for producing the micro-component, a second material, which is different from the first material and is elastomer-based, more particularly silicone-based, is injected, as a result of which a firm and form-fitting connection forms between the micro-component and the lost part. In order to be able to achieve advantageous cycle times in a risk-free way, it is proposed for the lost part to be embodied as a macroscopic object holder for the micro-component to permit manipulation of the semi-finished product and for the mold chamber to be provided with this lost part.

Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

Apparatuses, systems, and methods associated with placement of magnets within a microelectromechanical system device are disclosed herein. In embodiments, a method of affixing at least one magnet in a microelectromechanical system, may include affixing an electromagnetic actuator to a base structure of the microelectromechanical system, the affixing including affixing the electromagnetic actuator within a recess formed in the base structure. The method may further include placing a magnet within the recess, wherein the recess includes at least a portion of a spring, the spring affixed to the base structure and extending into the recess, the placing including placing the magnet on a side of the electromagnetic actuator, between the spring and the side of the electromagnetic actuator, the spring pressing the magnet against the side of the electromagnetic actuator and maintaining a position of the magnet in response to the placing the magnet within the recess.

Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.