An environmental sensor. The environmental sensor includes: a MEMS element; an ASIC element electrically connected to the MEMS element by means of at least two bonding wires. T ASIC element includes an evaluation circuit designed to ascertain and evaluate a parasitic capacitance between the at least two bonding wires connected to pads of the MEMS element, in order to detect a material deposit on the environmental sensor.

A discrete-time high voltage generating circuitry is disclosed, configured to provide a discrete-time high voltage at a high voltage output only during defined high voltage periods. The discrete-time high voltage generating circuitry comprises a current mirror circuitry configured to receive a supply current from a high voltage source and to provide a slew current. The discrete-time high voltage generating circuitry is configured to generate the discrete-time high voltage using the slew current. Further, a method to operate a discrete-time high voltage generating circuitry is disclosed. The circuitry and method may be used to provide a discrete-time self-test bias voltage to at least one capacitive load such as a capacitive MEMS element.

A micro-electro-mechanical device includes a movable structure. The movable structure includes a test structure changing an electrical characteristic, if the movable structure is damaged. Further, a method for detecting damaging of a micro-electro-mechanical device includes detecting a change of an electrical characteristic of the electrical test structure of the movable structure. Further, the method includes indicating a deviation of the electrical characteristic from a predefined tolerable range.

Disclosed a micro-differential pressure sensor, a package structure, a test method, and an electronic device. The micro-differential pressure sensor comprises a MEMS chip, the MEMS chip comprises a substrate, a diaphragm, and a back-pole plate set in a laminated manner, the substrate having a back cavity which passes through in the thickness direction thereof, the back-pole plate comprises a first electrode region and a second electrode region isolated from each other, the first electrode region forming a first electrode, the second electrode region forming a second electrode, and the diaphragm forming a third electrode, the first electrode and the third electrode form a first capacitor, the second electrode and the third electrode form a second capacitor.