Patent classifications
B81C2201/01
COMMON MODE REJECTION STRUCTURES FOR MEMS DEVICES
A MEMS device and method of forming the same includes paired masses suspended above a substrate includes linkages that couple pairs of masses to each other. Inner sense linkages couple interior edges of adjacent masses to each other. The inner sense linkages are configured to exhibit a first stiffness when the adjacent masses coupled to each inner sense linkage move out-of-phase relative to each other along a preferred axis of the inner sense linkages and to exhibit a second, increased stiffness in response to in-phase motion of the adjacent masses coupled to each inner sense linkage.
Common mode rejection structures for mems devices
A MEMS device and method of forming the same includes paired masses suspended above a substrate includes linkages that couple pairs of masses to each other. Inner sense linkages couple interior edges of adjacent masses to each other. The inner sense linkages are configured to exhibit a first stiffness when the adjacent masses coupled to each inner sense linkage move out-of-phase relative to each other along a preferred axis of the inner sense linkages and to exhibit a second, increased stiffness in response to in-phase motion of the adjacent masses coupled to each inner sense linkage.