The scrubbing apparatus may comprises a scrubbing chamber defining a scrubbing space, a separating wall dividing the scrubbing space into a first sub-space and a second sub-space, a spray nozzle in the first sub-space to spray a first cleaning solution into the first sub-space, a first scrubbing plate fixed to the separating wall, a cleaning solution supply nozzle supplying a second cleaning solution onto an upper surface of the first scrubbing plate, a cleaning solution storage tank, and a plurality of first scrubbing holes penetrating the first scrubbing plate, wherein a portion of impurities contained in the gas is dissolved into the first cleaning solution in the first sub-space, and another portion of impurities contained in the gas is dissolved into the second cleaning solution on the upper surface of the first scrubbing plate after the gas ascends through the plurality of first scrubbing holes in the second subspace.

A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing. In addition, the system includes at least one first filtering assembly and at least one second filtering assembly. The first filtering assembly and the second filtering assembly are positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing. Each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another.

A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing. In addition, the system includes at least one first filtering assembly and at least one second filtering assembly. The first filtering assembly and the second filtering assembly are positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing. Each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another.

The scrubbing apparatus of the present invention includes a scrubbing chamber defining a scrubbing space for scrubbing impurities, a gas injection pipe through which gas is injected into the scrubbing chamber, a gas discharge pipe through which gas is discharged outside the scrubbing chamber, a first scrubbing plate disposed in the scrubbing chamber, a plurality of first scrubbing holes penetrating the first scrubbing plate, a solution supply nozzle configured to supply a scrubbing solution, a first pressure gauge configured to measure a first pressure of the gas, and a first pressure controller configured to control the magnitude of the first pressure, wherein the gas ascends through the plurality of first scrubbing holes, bubbles are formed on the upper surface of the first scrubbing plate, and impurities are dissolved into the scrubbing solution at a portion where the bubbles and the scrubbing solution come into contact.