The present invention provides a new method for fixing carbon dioxide. The method for fixing carbon dioxide of the present invention includes a contact step of bringing a mixed liquid containing sodium hydroxide and further containing at least one of a chloride of a Group 2 element or a chloride of a divalent metal element into contact with a gas containing carbon dioxide.

A method for preparing Cl—SO.sub.2NHSO.sub.2Cl including a step of chlorinating sulphamic acid with at least one chlorinating agent and at least one sulphur-containing agent, the method resulting in a flow F1, preferably liquid, including Cl—SO.sub.2NHSO.sub.2Cl and a gas stream F2 including HCl and SO.sub.2, the method including a step a) of treating the gas stream F2. Also, a method for preparing LiFSI including the abovementioned method for preparing Cl—SO.sub.2NHSO.sub.2Cl.

A device for waste gas scrubbing in a urea plant may be configured such that a waste gas passes along a transportation direction in the duct. The duct may include a first region for removing urea dust particles from the waste gas and a second region for removing chemical compounds from the waste gas, which can be integrated by an acid-base reaction into an aqueous liquid phase. A cross-sectional area of the duct extending perpendicular to the transportation direction in the second region may be greater than a cross-sectional area extending perpendicular to the transportation direction in the first region. Further, the device may be configured such that the duct extends horizontally at least in sections and/or the transportation direction of the waste gas through the duct extends horizontally in an installed state.

Disclosed is an apparatus for separating amine gas from mixed gas, the apparatus including: a washer column through which mixed the gas passes; and a main adsorber column through which the mixed gas passing through the washer column passes. According to the present invention, the apparatus can remove amine gas more effectively and increase the lifetime of an adsorbent by allowing the mixed gas including the amine gas to pass through the washer column and the adsorber column.

A process for the conversion of solid lignocellulosic material containing hemicellulose, cellulose and lignin, includes (a) hydrolyzing, at a temperature equal to or less than 40 C. at least part of the hemicellulose and at least part of the cellulose of the solid lignocellulosic material with an aqueous hydrochloric acid solution, containing in the range from equal to or more than 40.0 wt. % to equal to or less than 51.0 wt. % hydrochloric acid, based on the combined weight amount of water and hydrochloric acid in the aqueous hydrochloric acid solution; yielding a hydrochloric acid-containing, aqueous hydrolysate solution; (b) separating the hydrochloric acid-containing, aqueous hydrolysate solution from the lignin; and (c) heating at least part of the hydrochloric acid-containing, aqueous hydrolysate solution to a temperature equal to or more than 60 C., yielding a product solution containing 5-(chloromethyl)furfural, and extracting the 5-(chloromethyl)furfural from the product solution into an extraction solvent.

The present disclosure provides systems and methods useful in capture of one more moieties (e.g., carbon dioxide) from a gas stream (i.e., direct air capture). In various embodiments, the systems and methods can utilize at least a scrubbing unit, a regeneration unit, and an electrolysis unit whereby an alkali solution can be used to strip the moiety (e.g., carbon dioxide) from the gas stream, the removed moiety can be regenerated and optionally purified for capture or other use, and a formed salt can be subjected to electrolysis to recycle the alkali solution back to the scrubber for re-use with simultaneous production of one or more further chemicals.

Disclosed are methods and systems for removing submicron particles from a gas stream, in particular from urea prilling off-gas, wherein a Venturi ejector is used. A method comprises contacting a gas stream containing submicron particles in a Venturi ejector with an injected high velocity scrubbing liquid to provide a pumping action, wherein the scrubbing liquid has an initial velocity of at least 25 m/s and wherein the ratio of scrubbing liquid and gas flow is between 0.0005 and 0.0015 (m.sup.3/h)/(m.sup.3/h).

Disclosed are methods and systems for removing submicron particles from a gas stream, in particular from urea prilling off-gas, wherein a Venturi ejector is used. A method comprises contacting a gas stream containing submicron particles in a Venturi ejector with an injected high velocity scrubbing liquid to provide a pumping action, wherein the scrubbing liquid has an initial velocity of at least 25 m/s and wherein the ratio of scrubbing liquid and gas flow is between 0.0005 and 0.0015 (m.sup.3/h)/(m.sup.3/h).

A device for waste gas scrubbing in a urea plant may be configured such that a waste gas passes along a transportation direction in the duct. The duct may include a first region for removing urea dust particles from the waste gas and a second region for removing chemical compounds from the waste gas, which can be integrated by an acid-base reaction into an aqueous liquid phase. A cross-sectional area of the duct extending perpendicular to the transportation direction in the second region may be greater than a cross-sectional area extending perpendicular to the transportation direction in the first region. Further, the device may be configured such that the duct extends horizontally at least in sections and/or the transportation direction of the waste gas through the duct extends horizontally in an installed state.

Disclosed are methods and systems for removing submicron particles from a gas stream, in particular from urea prilling off-gas, wherein a Venturi ejector is used. A method comprises contacting a gas stream containing submicron particles in a Venturi ejector with an injected high velocity scrubbing liquid to provide a pumping action, wherein the scrubbing liquid has an initial velocity of at least 25 m/s and wherein the ratio of scrubbing liquid and gas flow is between 0.0005 and 0.0015 (m.sup.3/h)/(m.sup.3/h).