The invention relates to a method for preparing a solid comprising a step of mixing a set of compounds comprising at least two Cu.sub.2(OH).sub.2CO.sub.3 powders of different particle sizes and at least one binder and the use of the solid prepared by means of this method.

A gas treatment includes: a gas scrubber chamber operable to receive an effluent gas stream originating from a manufacturing process tool to be scrubbed therewithin to provide a scrubbed gas stream; and an electrostatic precipitation chamber operable to receive the scrubbed gas stream to be treated therewithin to provide a treated gas stream, one of the gas scrubber chamber and the electrostatic precipitation chamber defining a first chamber and another of the gas scrubber chamber and the electrostatic precipitation chamber defining a second chamber, the first chamber being configured to surround the second chamber. In this way, the first chamber and the second chamber can share the same volume.

A vacuum pump with abatement function is used for evacuating a chamber of a manufacturing apparatus. The vacuum pump with abatement function includes a vacuum pump having a discharge port to which at least one abatement part for treating an exhaust gas discharged from the vacuum pump to make the exhaust gas harmless is attached. The abatement part is selected from a plurality of abatement parts having different treatment types of exhaust gas and/or different treatment amounts of exhaust gas and/or different treatment performances of exhaust gas.

At least one gaseous impurity, for example silane, is removed by absorption from a feed gas stream, for example a gas stream comprising nitrogen and hydrogen, the gaseous impurity being less volatile than the feed gas stream. The absorption is effected by a sub-cooled absorbent at a first cryogenic temperature and a first pressure. The absorbent is typically propane. The absorption may be conducted in a liquid-vapor contact column (130). Absorbent containing impurity may be regenerated in a regeneration vessel 150 and returned to the column (130).

A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH.sub.4, H.sub.2O, H.sub.2, NF.sub.3, SF.sub.6, F.sub.2, HCl, HF, Cl.sub.2, and HBr. Representative condensing abating reagents include, for example, H.sub.2, H.sub.2O, O.sub.2, N.sub.2, O.sub.3, CO, CO.sub.2, NH.sub.3, N.sub.2O, CH.sub.4, and combinations thereof.

An air separation system includes an air separation module configured to receive feed air and separate the feed air into nitrogen-enriched air and oxygen-enriched air, a nitrogen-enriched air line for transporting the nitrogen-enriched air from the air separation module to a fuel tank for inerting, an oxygen sensing line connected to the nitrogen-enriched air line, a gas adsorption filter located in the oxygen sensing line, and an oxygen sensor downstream of the gas adsorption filter in the oxygen sensing line.

A system to abate an emission from a first semiconductor process is disclosed. The system includes an abatement apparatus, such as a gas scrubber, to remove hazardous and toxic gas species from the emission. The abatement apparatus may combust the emission to remove these gas species using a fuel and oxidant. The system includes a fuel assembly fluidly coupled to the abatement apparatus which transmits the fuel from at least one source through the abatement apparatus. The fuel assembly may include a supply tank which contains a volume of fuel, a recovery apparatus which recovers and contains a recovery volume of fuel from a second semiconductor process, and a mass flow controller which may transmit fuel from at least one of the supply tank and the recovery apparatus through the abatement apparatus.

An exhaust system for discharging from semiconductor manufacturing equipment a hazardous gas includes: a main exhaust pipe above the semiconductor manufacturing equipment and having a top surface on a first side and a bottom surface on a second side, a first branch pipe connected to a source of a gas mixture containing the hazardous gas on the second side and connected to the main exhaust pipe through the top surface, a second branch pipe connected to a gas box on the second side and connected to the main exhaust pipe through the bottom surface, and a detector on the second branch pipe configured to detect presence of the hazardous gas and downstream to the gas box. The first and the second branch pipes are connected to the main exhaust pipe at a first location and a second location, respectively. The first location is more upstream than the second location.

The present disclosure generally relates to systems and methods for the combustive abatement of waste gas formed during the manufacture of semiconductor wafers. In particular, the systems described herein are capable of combusting air-polluting perfluorocarbons, including those having high greenhouse gas indexes such as hexafluoroethane (C.sub.2F.sub.6) and tetrafluoromethane (CF.sub.4), as well as particulate-forming silicon dioxide precursors, such as silane (SiH.sub.4) and tetraethoxysilane (Si(OC.sub.2H.sub.5).sub.4, abbreviated TEOS), with greater efficiency and lower energy usage than prior abatement systems. More particularly, and in one preferred embodiment, the present disclosure is directed to a waste gas abatement system that utilizes a combination of non-combustible and combustible gases (or gas mixtures) for thermal combustion, which are directed through multiple permeable interior surfaces of a reaction chamber, efficiently combusting waste gas and preventing undesirable accumulation of solid particulate matter on the chamber surfaces.

A method for providing upgraded biogas includes feeding a stream of biogas into a biogas upgrading system in order to remove carbon dioxide from the stream of biogas. The biogas upgrading system, which may be based on absorption, adsorption, membrane permeation, and/or cryogenics, provides a stream of upgraded biogas and a tail gas stream. The tail gas stream, which may be CO.sub.2-rich, is enriched with natural gas so that it is combustible in medium-BTU equipment. The upgraded biogas is used for transportation use and/or the generation of fuel credits. Accordingly, both the tail gas and the upgraded biogas are used effectively and at lower cost.