A gas scrubber includes a canister having a rotatable spiral separator which provides a non-linear path configured to be filled with modular adsorbent material portions between a gas inlet and a gas outlet.

A gas trap system for metal organic chemical vapor deposition (MOCVD) exhaust abatement operations is provided. The gas trap system may include a housing including an inlet configured to receive exhaust gas and an outlet. The gas trap system may also include a conical inlet shield positioned within the housing. The conical inlet shield may form a first path between the housing and the conical inlet shield, wherein the first path receives the exhaust gas from the inlet. The conical inlet shield may also cool the exhaust gas and cause the exhaust gas to be uniformly distributed in the first path. The gas trap system may also include a filter configured to receive the exhaust gas from the first path and to filter the exhaust gas, wherein the filtered gas exhaust is provided to the outlet.

Disclosed is an apparatus for collecting a by-product in a semiconductor manufacturing process. An objective of the present invention is to provide an apparatus for collecting a by-product such that exhaust gas having great amount of light gas is coagulated while having sufficient residence time in a long flow path, whereby the exhaust gas is collected as a high-density by-product. For this purpose, the apparatus includes: a housing receiving and discharging introduced exhaust gas and configured with a horizontal vortex plate; an upper plate covering an upper portion of the housing; an internal collecting tower provided with a collecting tower cover and a seed eliminating fin to extend a flow path and residence time of the exhaust gas; a heater having a heat conduction plate; and an extended discharging pipe configured to extend the flow path and residence time of the exhaust gas and discharge the exhaust gas.

A gas purification system may include: a circulation gas pipe in which a second end is connected at a first position to a second pipe through which gas is supplied from a gas supply source; a booster pump; a gas purification unit; a first tank in the circulation gas pipe; a first valve positioned between the gas supply source and the first position, the first valve having an open position and a closed position; and a second valve positioned between the first tank and the second end, the second valve having an open position and a closed position, the second valve configured to be in the closed position when the first valve is in the open position.

Disclosed is an apparatus having a cooling line for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing (110) including an inner wall plate (111) on an inner wall thereof to collect a by-product while generating a vortex in exhaust gas which is temperature-controlled by a heater (140) while being introduced through a gas inlet of an upper plate; an internal collecting tower (150) including vertical plates, an upper cover plate, and vortex plates fitted to the vertical plates, and condensing the introduced exhaust gas to collect the by-product; a main cooling channel (160) cooling the exhaust gas by using coolant while passing through the internal collecting tower (150); and a multi-connection pipe (170) sequentially supplying the coolant to an upper plate cooling channel and a main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe provided outside the housing.

Disclosed is an apparatus having a cooling line for collecting a by-product in a semiconductor manufacturing process. The apparatus includes: a housing cooling channel (111) on an inner wall thereof to cooling exhaust gas which is temperature-controlled by a heater (140) while being introduced through a gas inlet of an upper plate; an internal collecting tower (150) including multiple vertical plates and multiple horizontal plates that are assembled, and condensing and collecting a by-product from the exhaust gas; a main cooling channel (160) having a serpentine shape and cooling the exhaust gas uniformly by using coolant while passing through the internal collecting tower (150); and a multi-connection pipe (170) sequentially supplying the coolant to the upper plate cooling channel, the housing cooling channel, and the main cooling channel and discharging the coolant, by using a supply pipe and a discharge pipe that are provided outside the housing.

Described are methods, devices, and systems useful for adsorbing organometallic vapor onto solid adsorbent material to remove the organometallic vapor from a gas mixture that contains the organometallic vapor and other vapor, particulate materials, or both.

The present disclosure relates to gas recovery systems and methods, and systems including gas recovery systems. In some embodiments, a gas recovery system includes a gas inlet, a compressor, a buffer tank, a variable speed microturbine, one or more sensors, and a control system. A gas input into the gas inlet can be output from a processing tool, and the gas can include hydrogen or ammonia gas. The gas can be used to produce electrical power using the first variable speed microturbine. The sensor, for example, a gas analyzer, a flow meter, or a pressure sensor, can be between the gas inlet and the variable speed microturbine. The control system can be configured to control a speed of the variable speed microturbine in response to a measurement from the sensor.

The invention provides a device and system for decomposing and oxidizing of gaseous pollutants. A novel reaction portion reduces particle formation in fluids during treatment, thereby improving the defect of particle accumulation in a reaction portion. Also, the system includes the device, wherein a modular design enables the system to have the advantage of easy repair and maintenance.

A gas processing furnace according to the present invention includes: a hollow cylindrical furnace body including a gas processing space therein; a non-transferred plasma jet torch for supplying a plasma jet into the gas processing space; and an electric heater for heating a region of the gas processing space to which the plasma jet is supplied.