A gas laser apparatus may include: a laser chamber connected through a first control valve to a first laser gas supply source that supplies a first laser gas containing a halogen gas; a purification column that removes at least a part of the halogen gas and a halogen compound from at least a part of a gas exhausted from the laser chamber; a booster pump; and a controller that calculates, on a basis of a first amount of a gas supplied from the booster pump to the laser chamber, a second amount of the first laser gas that is to be supplied to the laser chamber and controls the first control valve on a basis of a result of the calculation of the second amount.

According to one embodiment, a silicon-containing product forming apparatus includes a reaction chamber, an emission path, a process liquid tank, a supplier, and a flow path switcher. The emission path emits an emission material from the reaction chamber. The supplier includes a supply line configured to supply a process liquid to the emission path from the process liquid tank, and a byproduct generated by reaction is treated in the emission path by the supplied process liquid. The flow path switcher switches the communication state of the emission path with each of the reaction chamber and the supply line of the supplier.

Methods and apparatus for treating an exhaust gas in a foreline of a substrate processing system are provided herein. In some embodiments, a method for treating an exhaust gas in an exhaust conduit of a substrate processing system includes: flowing an exhaust gas and a reagent gas into an exhaust conduit of a substrate processing system; injecting a non-reactive gas into the exhaust conduit to maintain a desired pressure in the exhaust conduit for conversion of the exhaust gas; and forming a plasma from the exhaust gas and reagent gas, subsequent to injecting the non-reactive gas, to convert the exhaust gas to abatable byproduct gases.

A neon recovering/purifying system including: a recovery vessel that is arranged on an exhaust gas route and stores exhaust gas, the exhaust gas route being branched and extending from a discharge line; a compressor that increases a pressure of the exhaust gas sent out from the recovery vessel, to a third pressure; an exhaust gas flow rate regulating unit that regulates a flow rate of the exhaust gas whose pressure has been increased by the compressor; a first impurity removing unit that removes a first impurity from the exhaust gas; a second impurity removing unit that removes a second impurity from the exhaust gas from which the first impurity has been removed; a pressure increasing vessel that stores purified gas that has been processed by the first impurity removing unit and the second impurity removing unit; a pressure reducing valve that reduces a pressure of the purified gas sent out from the pressure increasing vessel, to the first pressure; and a purified gas flow rate regulating unit that regulates a flow rate of the purified gas supplied to a supply line of a manufacturing system.

Venturi Scrubbers are used to separate particulate from a large range of fluids. Many provide additional liquid and/or gas to drive the fluid and aid in the removal of particulate. The present invention provides a liquid ring pump through which the fluid to be treated is first passed and then exhausted, with additional work fluid to a Venturi scrubber such that the particulate can be separated from the exhaust fluid.

A flux recovery device recovers a vaporized flux being generated at a time of soldering an electronic circuit board on which electronic components are placed. The flux recovery device includes a first pipe, a dust collector, and a current controller. The first pipe causes gas including the vaporized flux to pass to the flux recovery device. The dust collector solidifies the vaporized flux passed through the first pipe and collects dust, by a plasma discharge. The current controller performs a constant current control of the plasma discharge.

An active wet scrubbing filtration system for decontamination of a gas stream comprises components including one or more of: a) a vortexing apparatus which induces a contaminant-bearing gas into a helical flow; b) an initial scrubbing fluid spray section configured so as to project a spray of scrubbing fluid into the contaminant-bearing gas stream; c) an absorption structure; d) a condenser; and e) first and second scrubbing fluid decontamination systems that may be engaged or disengaged independently of each other. In some embodiments, the worksite comprises a clean room or one or more a semiconductor processing tools, which may include photolithography tools or photolithography tool clusters. In some embodiments, the active wet scrubbing filtration system may be useful in cleaning and recycling air or other process gasses for use in clean rooms or semiconductor processing tools.

Adsorbent materials are disclosed, along with filter elements containing the adsorbent materials methods of using adsorbents to remove siloxane contaminants from a gas stream. The method includes providing an adsorbent material that has been washed with an acid and passing a gas through the adsorbent material so as to reduce siloxane levels in the gas. A filter element for reducing siloxane levels in a gas includes a first adsorbent material, the first adsorbent material comprising an acid-washed adsorbent; and a second adsorbent material, the second adsorbent material comprising an acid-impregnated adsorbent.

The present disclosure generally relates to systems and methods for the combustive abatement of waste gas formed during the manufacture of semiconductor wafers. In particular, the systems described herein are capable of combusting air-polluting perfluorocarbons, including those having high greenhouse gas indexes such as hexafluoroethane (C.sub.2F.sub.6) and tetrafluoromethane (CF.sub.4), as well as particulate-forming silicon dioxide precursors, such as silane (SiH.sub.4) and tetraethoxysilane (Si(OC.sub.2H.sub.5).sub.4, abbreviated TEOS), with greater efficiency and lower energy usage than prior abatement systems. More particularly, and in one preferred embodiment, the present disclosure is directed to a waste gas abatement system that utilizes a combination of non-combustible and combustible gases (or gas mixtures) for thermal combustion, which are directed through multiple permeable interior surfaces of a reaction chamber, efficiently combusting waste gas and preventing undesirable accumulation of solid particulate matter on the chamber surfaces.

Implementations of the present disclosure relate to systems and techniques for abating F-gases present in the effluent of semiconductor manufacturing processes. In one implementation, a water and oxygen delivery system for a plasma abatement system is provided. The water and oxygen delivery system comprises a housing that includes a floor and a plurality of sidewalls that define an enclosed region. The water and oxygen delivery system further comprises a cylindrical water tank positioned on the floor, wherein a longitudinal axis of the cylindrical water tank is parallel to a plane defined by the floor and a length of the water tank is 1.5 times or greater than the diameter of the cylindrical water tank. The water and oxygen delivery system further comprises a flow control system positioned within the housing above the cylindrical water tank.